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Specialized (1062)

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Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Surface Mount	Number of Terminals	Access Time-Max	Ihs Manufacturer	Moisture Sensitivity Levels	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Rohs Code	Supply Voltage-Nom (Vsup)	JESD-609 Code	Pbfree Code	ECCN Code	Terminal Finish	Additional Feature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Supply Voltage-Max (Vsup)	Temperature Grade	Supply Voltage-Min (Vsup)	Operating Mode	Supply Current-Max	Organization	Seated Height-Max	Memory Width	Standby Current-Max	Memory Density	Memory IC Type	Mixed Memory Type	Length	Width
Mfr Part No S71WS256NC0BFWAP	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	84		SPANSION INC	3	16777216 words	16000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	TFBGA,		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	1.8 V	e1		EAR99	TIN SILVER COPPER	PSRAM IS ALSO ORGANIZED AS 4M X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant		84	R-PBGA-B84	Not Qualified	1.95 V	OTHER	1.7 V	SYNCHRONOUS		16MX16	1.2 mm	16		268435456 bit	MEMORY CIRCUIT		11.6 mm	8 mm
Mfr Part No S71GL064A08BFW0B0	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	56		SPANSION INC	3	4194304 words	4000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	3 V	e1		EAR99	TIN SILVER COPPER	SRAM IS ORGANIZED AS 512K X 16	8542.32.00.71	BOTTOM	BALL	260	1	0.8 mm	unknown	40	56	R-PBGA-B56	Not Qualified	3.1 V	COMMERCIAL EXTENDED	2.7 V	ASYNCHRONOUS		4MX16	1.2 mm	16		67108864 bit	MEMORY CIRCUIT		9 mm	7 mm
Mfr Part No M36L0R7040U3ZA5U	SGS Thomson	Datasheet	-	-	Min: 1 Mult: 1
Mfr Part No S71PL032J40BAW0K2	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	56	65 ns	SPANSION INC	3	2097152 words	2000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	TFBGA, BGA56,8X8,32	BGA56,8X8,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	3 V	e1		EAR99	TIN SILVER COPPER	PSRAM IS ORGANIZED AS 256K X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant		56	R-PBGA-B56	Not Qualified	3.6 V	COMMERCIAL EXTENDED	2.7 V	ASYNCHRONOUS		2MX16	1.2 mm	16		33554432 bit	MEMORY CIRCUIT	FLASH+PSRAM	9 mm	7 mm
Mfr Part No XC17S40PDG8I	AMD Xilinx	Datasheet	323 In Stock	-	Min: 1 Mult: 1	NO	8		XILINX INC	1	329312 words	329312	85 °C	-40 °C	PLASTIC/EPOXY	DIP	DIP,		RECTANGULAR	IN-LINE	Obsolete	DIP	Yes	5 V	e3	Yes	EAR99	Matte Tin (Sn)		8542.32.00.71	DUAL	THROUGH-HOLE	250	1	2.54 mm	compliant	30	8	R-PDIP-T8	Not Qualified	5.5 V	INDUSTRIAL	4.5 V	SYNCHRONOUS		329312X1	4.5974 mm	1		329312 bit	MEMORY CIRCUIT		9.3599 mm	7.62 mm
Mfr Part No M4-4103S-Z3	Moujen Switch	Datasheet	-	-	Min: 1 Mult: 1
Mfr Part No SST34HF1641C-70-4E-L1P	Silicon Storage Technology	Datasheet	-	-	Min: 1 Mult: 1	YES	56		SILICON STORAGE TECHNOLOGY INC		1048576 words	1000000	85 °C	-20 °C	PLASTIC/EPOXY	LFBGA	LFBGA,		RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	Obsolete	BGA	No	3 V			EAR99		SRAM IS ORGANIZED AS 256K X 16 / 512K X 8; FLASH CAN ALSO BE ORGANIZED AS 2M X 8	8542.32.00.71	BOTTOM	BALL	240	1	0.8 mm	unknown	10	56	R-PBGA-B56	Not Qualified	3.3 V	OTHER	2.7 V	ASYNCHRONOUS		1MX16	1.4 mm	16		16777216 bit	MEMORY CIRCUIT		10 mm	8 mm
Mfr Part No TH50VSF1320AAXB	Toshiba America Electronic Components	Datasheet	-	-	Min: 1 Mult: 1	YES	48		TOSHIBA CORP		1048576 words	1000000	85 °C	-20 °C	PLASTIC/EPOXY	LBGA	LBGA,		RECTANGULAR	GRID ARRAY, LOW PROFILE	Obsolete	BGA		3 V			EAR99		SRAM IS CONFIGURED AS 256 K X 8	8542.32.00.71	BOTTOM	BALL		1	1 mm	unknown		48	R-PBGA-B48	Not Qualified	3.6 V	OTHER	2.7 V	ASYNCHRONOUS		1MX8	1.6 mm	8		8388608 bit	MEMORY CIRCUIT		12 mm	10 mm
Mfr Part No PF38F2040W0YTQ0	Intel Corporation	Datasheet	-	-	Min: 1 Mult: 1	YES	88	70 ns	INTEL CORP	3	4194304 words	4000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	TFBGA, BGA88,8X12,32	BGA88,8X12,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Transferred	BGA	Yes	1.8 V	e1		EAR99	TIN SILVER COPPER	CONTAINS 32 MBIT SRAM, ALSO CONTAINS 64 MBIT FLASH	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant		88	R-PBGA-B88	Not Qualified	1.95 V	OTHER	1.7 V	SYNCHRONOUS	0.055 mA	4MX16	1.2 mm	16	0.000045 A	67108864 bit	MEMORY CIRCUIT	FLASH+PSRAM+SRAM	10 mm	8 mm
Mfr Part No PF38F2040W0YTQ0	Micron Technology Inc	Datasheet	-	-	Min: 1 Mult: 1	YES	88	70 ns	MICRON TECHNOLOGY INC						PLASTIC/EPOXY	FBGA	FBGA, BGA88,8X12,32	BGA88,8X12,32	RECTANGULAR	GRID ARRAY, FINE PITCH	Obsolete		Yes	1.8 V			EAR99			8542.32.00.71	BOTTOM	BALL			0.8 mm	compliant			R-PBGA-B88	Not Qualified					0.035 mA				0.00011 A		MEMORY CIRCUIT	FLASH+PSRAM
Mfr Part No PF38F2040W0YTQ0	Numonyx Memory Solutions	Datasheet	-	-	Min: 1 Mult: 1	YES	88	70 ns	NUMONYX		4194304 words	4000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	TFBGA, BGA88,8X12,32	BGA88,8X12,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	1.8 V		Yes	EAR99		CONTAINS 32 MBIT SRAM, ALSO CONTAINS 64 MBIT FLASH	8542.32.00.71	BOTTOM	BALL	NOT SPECIFIED	1	0.8 mm	unknown	NOT SPECIFIED	88	R-PBGA-B88	Not Qualified	1.95 V	OTHER	1.7 V	SYNCHRONOUS	0.035 mA	4MX16	1.2 mm	16	0.00011 A	67108864 bit	MEMORY CIRCUIT	FLASH+PSRAM	10 mm	8 mm
Mfr Part No MAP168-45L	Waferscale Integration Inc	Datasheet	-	-	Min: 1 Mult: 1	YES	44	45 ns	WAFERSCALE INTEGRATION INC				70 °C		CERAMIC	QCCJ		LDCC44,.7SQ	SQUARE	CHIP CARRIER	Obsolete		No	5 V	e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.71	QUAD	J BEND			1.27 mm	unknown			S-XQCC-J44	Not Qualified		COMMERCIAL			0.143 mA				0.001 A
Mfr Part No M36W0R6050B1ZAQF	Numonyx Memory Solutions	Datasheet	-	-	Min: 1 Mult: 1	YES	88	70 ns	NUMONYX		4194304 words	4000000	85 °C	-30 °C	PLASTIC/EPOXY	TFBGA	TFBGA, BGA88,8X12,32	BGA88,8X12,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Transferred	BGA	Yes	1.8 V			EAR99		PSRAM IS ORGANIZED AS 2M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE	8542.32.00.71	BOTTOM	BALL	NOT SPECIFIED	1	0.8 mm	unknown	NOT SPECIFIED	88	R-PBGA-B88	Not Qualified	1.95 V	OTHER	1.7 V	ASYNCHRONOUS		4MX16	1.2 mm	16		67108864 bit	MEMORY CIRCUIT	FLASH+PSRAM	10 mm	8 mm
Mfr Part No TC528126AJ-12	Toshiba America Electronic Components	Datasheet	-	-	Min: 1 Mult: 1	YES	40	120 ns	TOSHIBA CORP		131072 words	128000	70 °C		PLASTIC/EPOXY	SOJ	SOJ, SOJ40,.44	SOJ40,.44	RECTANGULAR	SMALL OUTLINE	Transferred		No	5 V	e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.71	DUAL	J BEND			1.27 mm	unknown			R-PDSO-J40	Not Qualified		COMMERCIAL			0.045 mA	128KX8		8	0.01 A	1048576 bit	VIDEO DRAM
Mfr Part No S71PL129JC0BFW9U0	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	64		SPANSION INC	3	8388608 words	8000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-64		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	3 V	e1		EAR99	TIN SILVER COPPER	PSEUDO STATIC RAM IS ORGANIZED AS 4M X 16	8542.32.00.71	BOTTOM	BALL	260	1	0.8 mm	unknown	40	64	R-PBGA-B64	Not Qualified	3.1 V	OTHER	2.7 V	ASYNCHRONOUS		8MX16	1.2 mm	16		134217728 bit	MEMORY CIRCUIT		11.6 mm	8 mm
Mfr Part No S71NS256PB0ZJETV3	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	56		SPANSION INC		16777216 words	16000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	TFBGA,		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	1.8 V			EAR99		PSRAM IS ORGANIZED AS 2M X 16	8542.32.00.71	BOTTOM	BALL	260	1	0.5 mm	unknown	40	56	R-PBGA-B56	Not Qualified	1.95 V	OTHER	1.7 V	SYNCHRONOUS		16MX16	1.2 mm	16		268435456 bit	MEMORY CIRCUIT		9.2 mm	8 mm
Mfr Part No SST32HF162-70-4C-TBK	Silicon Storage Technology	Datasheet	-	-	Min: 1 Mult: 1	YES	48	70 ns	SILICON STORAGE TECHNOLOGY INC		1048576 words	1000000	70 °C		PLASTIC/EPOXY	TBGA	TBGA, BGA48,6X8,40	BGA48,6X8,40	RECTANGULAR	GRID ARRAY, THIN PROFILE	Obsolete	BGA	No	3 V	e0		EAR99	TIN LEAD	ALSO CONTAINS 128K X 16 SRAM	8542.32.00.71	BOTTOM	BALL		1	1 mm	unknown		48	R-PBGA-B48	Not Qualified	3.3 V	COMMERCIAL	2.7 V	ASYNCHRONOUS	0.02 mA	1MX16	1.2 mm	16	0.00003 A	16777216 bit	MEMORY CIRCUIT	FLASH+SRAM	12 mm	10 mm
Mfr Part No M4-4102-Z3	Moujen Switch	Datasheet	-	-	Min: 1 Mult: 1
Mfr Part No S71PL129JC0BFW9B0	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	64		SPANSION INC	3	8388608 words	8000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-64		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	3 V	e1		EAR99	TIN SILVER COPPER	PSEUDO STATIC RAM IS ORGANIZED AS 4M X 16	8542.32.00.71	BOTTOM	BALL	260	1	0.8 mm	unknown	40	64	R-PBGA-B64	Not Qualified	3.1 V	OTHER	2.7 V	ASYNCHRONOUS		8MX16	1.2 mm	16		134217728 bit	MEMORY CIRCUIT		11.6 mm	8 mm
Mfr Part No NAND98W3M1AZBC5E	Numonyx Memory Solutions	Datasheet	-	-	Min: 1 Mult: 1	YES	137		NUMONYX				85 °C	-30 °C	PLASTIC/EPOXY	FBGA	FBGA, BGA137,10X15,32	BGA137,10X15,32	RECTANGULAR	GRID ARRAY	Obsolete	BGA	Yes	3 V		Yes	EAR99			8542.32.00.71	BOTTOM	BALL	NOT SPECIFIED		0.8 mm	unknown	NOT SPECIFIED	137	R-PBGA-B137	Not Qualified		OTHER									MEMORY CIRCUIT	FLASH+SDRAM

Specialized (1062)