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Specialized (1062)

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Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Surface Mount	Number of Terminals	Access Time-Max	Dimensions	Ihs Manufacturer	Moisture Sensitivity Levels	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Rohs Code	Supply Voltage-Nom (Vsup)	JESD-609 Code	Pbfree Code	ECCN Code	Terminal Finish	Additional Feature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Frequency	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Supply Voltage-Max (Vsup)	Temperature Grade	Supply Voltage-Min (Vsup)	Voltage	Operating Mode	Supply Current-Max	Organization	Seated Height-Max	Memory Width	Density	Standby Current-Max	Memory Density	Memory IC Type	Mixed Memory Type	Temperature	Length	Width
Mfr Part No W29N02KZBIBF	Winbond	Datasheet	-	-	Min: 1 Mult: 1				9X11mm2							VFBGA - 63																							40MHz								1.7 ~ 1.95V						2Gb					-40~+85˚C
Mfr Part No W29N04GVBIAA	Winbond	Datasheet	-	-	Min: 1 Mult: 1				9X11mm2							VFBGA - 63																							40MHz								2.7 ~ 3.6V						4Gb					-40~+85˚C
Mfr Part No W29N04GVSIAA	Winbond	Datasheet	-	-	Min: 1 Mult: 1				12X20mm2							TSOPI - 48																							40MHz								2.7 ~ 3.6V						4Gb					-40~+85˚C
Mfr Part No SST32HF162-70-4C-TBK	Silicon Storage Technology	Datasheet	-	-	Min: 1 Mult: 1	YES	48	70 ns		SILICON STORAGE TECHNOLOGY INC		1048576 words	1000000	70 °C			PLASTIC/EPOXY	TBGA	TBGA, BGA48,6X8,40	BGA48,6X8,40	RECTANGULAR	GRID ARRAY, THIN PROFILE	Obsolete	BGA	No	3 V	e0		EAR99	TIN LEAD	ALSO CONTAINS 128K X 16 SRAM	8542.32.00.71	BOTTOM	BALL		1	1 mm	unknown			48	R-PBGA-B48	Not Qualified	3.3 V	COMMERCIAL	2.7 V		ASYNCHRONOUS	0.02 mA	1MX16	1.2 mm	16		0.00003 A	16777216 bit	MEMORY CIRCUIT	FLASH+SRAM		12 mm	10 mm
Mfr Part No M4-4102-Z3	Moujen Switch	Datasheet	-	-	Min: 1 Mult: 1
Mfr Part No S71PL129JC0BFW9B0	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	64			SPANSION INC	3	8388608 words	8000000	85 °C	-25 °C		PLASTIC/EPOXY	TFBGA	8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-64		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	3 V	e1		EAR99	TIN SILVER COPPER	PSEUDO STATIC RAM IS ORGANIZED AS 4M X 16	8542.32.00.71	BOTTOM	BALL	260	1	0.8 mm	unknown		40	64	R-PBGA-B64	Not Qualified	3.1 V	OTHER	2.7 V		ASYNCHRONOUS		8MX16	1.2 mm	16			134217728 bit	MEMORY CIRCUIT			11.6 mm	8 mm
Mfr Part No MSM514212-34ZS	OKI Electric Industry Co Ltd	Datasheet	-	-	Min: 1 Mult: 1	NO	28			OKI ELECTRIC INDUSTRY CO LTD		5048 words	5048	70 °C			PLASTIC/EPOXY	ZIP	ZIP,		RECTANGULAR	IN-LINE	Obsolete	ZIP		5 V			EAR99			8542.32.00.71	ZIG-ZAG	THROUGH-HOLE		1	1.27 mm	unknown			28	R-PZIP-T28	Not Qualified	5.5 V	COMMERCIAL	4.5 V		SYNCHRONOUS		5048X8	10.16 mm	8			40384 bit	MEMORY CIRCUIT			36 mm	2.8 mm
Mfr Part No MSM514212-34ZS	LAPIS Semiconductor Co Ltd	Datasheet	-	-	Min: 1 Mult: 1	NO	28	34 ns		LAPIS SEMICONDUCTOR CO LTD				70 °C			PLASTIC/EPOXY	ZIP	ZIP, ZIP28,.1	ZIP28,.1	RECTANGULAR	IN-LINE	Obsolete		No	5 V	e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.71	ZIG-ZAG	THROUGH-HOLE			1.27 mm	unknown				R-PZIP-T28	Not Qualified		COMMERCIAL				0.03 mA					0.03 A
Mfr Part No S71PL064JB0BFWQB0	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	56	65 ns		SPANSION INC	3	4194304 words	4000000	85 °C	-25 °C		PLASTIC/EPOXY	TFBGA	9 X 7 MM, 1.20 MM PITCH, LEAD FREE, FBGA-56	BGA56,8X8,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	3 V	e1	Yes	EAR99	TIN SILVER COPPER	PSRAM IS ORGANIZED AS 2M X 16	8542.32.00.71	BOTTOM	BALL	260	1	0.8 mm	unknown		40	56	R-PBGA-B56	Not Qualified	3.6 V	COMMERCIAL EXTENDED	2.7 V		ASYNCHRONOUS		4MX16	1.2 mm	16			67108864 bit	MEMORY CIRCUIT	FLASH+PSRAM		9 mm	7 mm
Mfr Part No S71NS256PB0ZJETV2	Cypress Semiconductor	Datasheet	-	-	Min: 1 Mult: 1					CYPRESS SEMICONDUCTOR CORP									,				Transferred						EAR99			8542.32.00.71						compliant
Mfr Part No M4-4112RS-Z3	Moujen Switch	Datasheet	-	-	Min: 1 Mult: 1
Mfr Part No IS75V16F64GS32-7070DI	Integrated Silicon Solution Inc	Datasheet	-	-	Min: 1 Mult: 1	YES	65	70 ns		INTEGRATED SILICON SOLUTION INC		4194304 words	4000000	85 °C	-30 °C		PLASTIC/EPOXY	LFBGA	9 X 9 MM, 0.80 MM PITCH, FBGA-65	BGA65,10X10,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Obsolete	BGA	No	2.9 V	e0	No	EAR99	TIN LEAD	ALSO CONTAINS 32MBIT PSEUDO SRAM	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant			65	S-PBGA-B65	Not Qualified	3.1 V	OTHER	2.7 V		ASYNCHRONOUS	0.053 mA	4MX16	1.34 mm	16		0.005 A	67108864 bit	MEMORY CIRCUIT	FLASH+SRAM		9 mm	9 mm
Mfr Part No S72NS512RD0AHGL03	Spansion	Datasheet	-	-	Min: 1 Mult: 1					SPANSION INC									,				Obsolete		Yes				EAR99			8542.32.00.71			260			unknown		40
Mfr Part No SY6923PPC	Silergy Corporation	Datasheet	-	-	Min: 1 Mult: 1
Mfr Part No XC17S150XLSOG20C	AMD Xilinx	Datasheet	421 In Stock	-	Min: 1 Mult: 1	YES	20			XILINX INC	3	1040128 words	1040128	70 °C			PLASTIC/EPOXY	SOP	SOP,		RECTANGULAR	SMALL OUTLINE	Obsolete	SOIC	Yes	3.3 V	e3	Yes	EAR99	Matte Tin (Sn)		8542.32.00.71	DUAL	GULL WING	260	1	1.27 mm	compliant		30	20	R-PDSO-G20	Not Qualified	3.6 V	COMMERCIAL	3 V		SYNCHRONOUS		1040128X1	2.65 mm	1			1040128 bit	MEMORY CIRCUIT			12.8 mm	7.5 mm
Mfr Part No S71WS256NC0BFWAP	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	84			SPANSION INC	3	16777216 words	16000000	85 °C	-25 °C		PLASTIC/EPOXY	TFBGA	TFBGA,		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	1.8 V	e1		EAR99	TIN SILVER COPPER	PSRAM IS ALSO ORGANIZED AS 4M X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant			84	R-PBGA-B84	Not Qualified	1.95 V	OTHER	1.7 V		SYNCHRONOUS		16MX16	1.2 mm	16			268435456 bit	MEMORY CIRCUIT			11.6 mm	8 mm
Mfr Part No TH50VSF1320AAXB	Toshiba America Electronic Components	Datasheet	-	-	Min: 1 Mult: 1	YES	48			TOSHIBA CORP		1048576 words	1000000	85 °C	-20 °C		PLASTIC/EPOXY	LBGA	LBGA,		RECTANGULAR	GRID ARRAY, LOW PROFILE	Obsolete	BGA		3 V			EAR99		SRAM IS CONFIGURED AS 256 K X 8	8542.32.00.71	BOTTOM	BALL		1	1 mm	unknown			48	R-PBGA-B48	Not Qualified	3.6 V	OTHER	2.7 V		ASYNCHRONOUS		1MX8	1.6 mm	8			8388608 bit	MEMORY CIRCUIT			12 mm	10 mm
Mfr Part No PF38F2040W0YTQ0	Intel Corporation	Datasheet	-	-	Min: 1 Mult: 1	YES	88	70 ns		INTEL CORP	3	4194304 words	4000000	85 °C	-25 °C		PLASTIC/EPOXY	TFBGA	TFBGA, BGA88,8X12,32	BGA88,8X12,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Transferred	BGA	Yes	1.8 V	e1		EAR99	TIN SILVER COPPER	CONTAINS 32 MBIT SRAM, ALSO CONTAINS 64 MBIT FLASH	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant			88	R-PBGA-B88	Not Qualified	1.95 V	OTHER	1.7 V		SYNCHRONOUS	0.055 mA	4MX16	1.2 mm	16		0.000045 A	67108864 bit	MEMORY CIRCUIT	FLASH+PSRAM+SRAM		10 mm	8 mm
Mfr Part No PF38F2040W0YTQ0	Micron Technology Inc	Datasheet	-	-	Min: 1 Mult: 1	YES	88	70 ns		MICRON TECHNOLOGY INC							PLASTIC/EPOXY	FBGA	FBGA, BGA88,8X12,32	BGA88,8X12,32	RECTANGULAR	GRID ARRAY, FINE PITCH	Obsolete		Yes	1.8 V			EAR99			8542.32.00.71	BOTTOM	BALL			0.8 mm	compliant				R-PBGA-B88	Not Qualified						0.035 mA					0.00011 A		MEMORY CIRCUIT	FLASH+PSRAM
Mfr Part No PF38F2040W0YTQ0	Numonyx Memory Solutions	Datasheet	-	-	Min: 1 Mult: 1	YES	88	70 ns		NUMONYX		4194304 words	4000000	85 °C	-25 °C		PLASTIC/EPOXY	TFBGA	TFBGA, BGA88,8X12,32	BGA88,8X12,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	1.8 V		Yes	EAR99		CONTAINS 32 MBIT SRAM, ALSO CONTAINS 64 MBIT FLASH	8542.32.00.71	BOTTOM	BALL	NOT SPECIFIED	1	0.8 mm	unknown		NOT SPECIFIED	88	R-PBGA-B88	Not Qualified	1.95 V	OTHER	1.7 V		SYNCHRONOUS	0.035 mA	4MX16	1.2 mm	16		0.00011 A	67108864 bit	MEMORY CIRCUIT	FLASH+PSRAM		10 mm	8 mm

Specialized (1062)