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Specialized (1062)

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Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Surface Mount	Number of Terminals	Access Time-Max	Ihs Manufacturer	Moisture Sensitivity Levels	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Rohs Code	Supply Voltage-Nom (Vsup)	JESD-609 Code	Pbfree Code	ECCN Code	Terminal Finish	Additional Feature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Supply Voltage-Max (Vsup)	Temperature Grade	Supply Voltage-Min (Vsup)	Operating Mode	Supply Current-Max	Organization	Seated Height-Max	Memory Width	Standby Current-Max	Memory Density	Memory IC Type	Mixed Memory Type	Length	Width
Mfr Part No S71VS256RD0ZHE400	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	56		SPANSION INC		16777216 words	16000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	TFBGA,		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	1.8 V			EAR99		PSRAM IS ORGANIZED AS 8M X 16	8542.32.00.71	BOTTOM	BALL	260	1	0.5 mm	unknown	40	56	R-PBGA-B56	Not Qualified	1.95 V	OTHER	1.7 V	SYNCHRONOUS		16MX16	1.2 mm	16		268435456 bit	MEMORY CIRCUIT		9.2 mm	8 mm
Mfr Part No S71VS256RD0ZHEC00	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	56		SPANSION INC		16 words	16	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	9.20 X 8 MM, 0.50 MM PITCH, LEAD FREE, VFBGA-56		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	1.8 V			EAR99		PSRAM IS ORGANIZED AS 8M X 16	8542.32.00.71	BOTTOM	BALL	260	1	0.5 mm	compliant	40	56	R-PBGA-B56	Not Qualified	1.95 V	OTHER	1.7 V	SYNCHRONOUS		16X16	1.2 mm	16		256 bit	MEMORY CIRCUIT		9.2 mm	8 mm
Mfr Part No S71JL064H80BAW110	AMD	Datasheet	344 In Stock	-	Min: 1 Mult: 1	YES	73	70 ns	ADVANCED MICRO DEVICES INC		4194304 words	4000000	85 °C	-25 °C	PLASTIC/EPOXY	LFBGA	11.60 X 8 MM, FBGA-73	BGA73,10X12,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	Transferred	BGA	Yes	3 V			EAR99		PSRAM IS ORGANIZED AS 512K X 16; FLASH CAN ALSO BE ORGANIZED AS 8M X 8	8542.32.00.71	BOTTOM	BALL	NOT SPECIFIED	1	0.8 mm	compliant	NOT SPECIFIED	73	R-PBGA-B73	Not Qualified	3.3 V	OTHER	2.7 V	ASYNCHRONOUS	0.045 mA	4MX16	1.4 mm	16		67108864 bit	MEMORY CIRCUIT	FLASH+PSRAM	11.6 mm	8 mm
Mfr Part No S71JL064H80BAW110	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	73		SPANSION INC	3	4194304 words	4000000	85 °C	-25 °C	PLASTIC/EPOXY	LFBGA	LFBGA,		RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	Obsolete	BGA	No	3 V	e0		EAR99	TIN LEAD	PSEUDO STATIC RAM IS ORGANIZED AS 512K X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant		73	R-PBGA-B73	Not Qualified	3.3 V	OTHER	2.7 V	ASYNCHRONOUS		4MX16	1.4 mm	16		67108864 bit	MEMORY CIRCUIT		11.6 mm	8 mm
Mfr Part No S71NS032JA0BJWRT0	Spansion	Datasheet	-	-	Min: 1 Mult: 1
Mfr Part No TMS4C1060-40N	Texas Instruments	Datasheet	-	-	Min: 1 Mult: 1	NO	16	30 ns	TEXAS INSTRUMENTS INC				70 °C		PLASTIC/EPOXY	DIP	DIP, DIP16,.3	DIP16,.3	RECTANGULAR	IN-LINE	Obsolete		No	5 V			EAR99			8542.32.00.71	DUAL	THROUGH-HOLE	NOT SPECIFIED		2.54 mm	not_compliant	NOT SPECIFIED		R-PDIP-T16	Not Qualified		COMMERCIAL			0.045 mA				0.01 A		MEMORY CIRCUIT
Mfr Part No M4-4111-Z3	Moujen Switch	Datasheet	-	-	Min: 1 Mult: 1
Mfr Part No S71PL129NB0HFW4B0	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	64	70 ns	SPANSION INC	3	8388608 words	8000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-64	BGA64,10X12,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	3 V	e1		EAR99	TIN SILVER COPPER		8542.32.00.71	BOTTOM	BALL	260	1	0.8 mm	unknown	40	64	R-PBGA-B64	Not Qualified	3.1 V	OTHER	2.7 V	ASYNCHRONOUS		8MX16	1.2 mm	16		134217728 bit	MEMORY CIRCUIT	FLASH+PSRAM	11.6 mm	8 mm
Mfr Part No TH50VSF3581AASB	Toshiba America Electronic Components	Datasheet	-	-	Min: 1 Mult: 1	YES	69	90 ns	TOSHIBA CORP		2097152 words	2000000	85 °C	-30 °C	PLASTIC/EPOXY	LFBGA	LFBGA, BGA69,10X12,32	BGA69,10X12,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	Transferred	BGA		3 V	e0		EAR99	TIN LEAD	USER CONFIGURABLE AS 4M X 8 FLASH AND CONTAINS SRAM CONFIGURED AS 512K X 16 OR 1M X 8	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	unknown		69	R-PBGA-B69	Not Qualified	3.3 V	OTHER	2.67 V	ASYNCHRONOUS	0.05 mA	2MX16	1.4 mm	16		33554432 bit	MEMORY CIRCUIT	FLASH+SRAM	12 mm	9 mm
Mfr Part No XC17S30VOG8C	AMD Xilinx	Datasheet	492 In Stock	-	Min: 1 Mult: 1	YES	8		XILINX INC	3	247968 words	247968	70 °C		PLASTIC/EPOXY	TSOP2	TSOP2,		RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSOP	Yes	5 V	e3	Yes	EAR99	Matte Tin (Sn)		8542.32.00.71	DUAL	GULL WING	260	1	1.27 mm	compliant	30	8	R-PDSO-G8	Not Qualified	5.25 V	COMMERCIAL	4.75 V	SYNCHRONOUS		247968X1	1.2 mm	1		247968 bit	MEMORY CIRCUIT		4.9 mm	3.9 mm
Mfr Part No XC17S100XLSOG20I	AMD Xilinx	Datasheet	308 In Stock	-	Min: 1 Mult: 1	YES	20		XILINX INC	3	781248 words	781248	85 °C	-40 °C	PLASTIC/EPOXY	SOP	SOP,		RECTANGULAR	SMALL OUTLINE	Obsolete	SOIC	Yes	3.3 V	e3	Yes	EAR99	Matte Tin (Sn)		8542.32.00.71	DUAL	GULL WING	260	1	1.27 mm	compliant	30	20	R-PDSO-G20	Not Qualified	3.6 V	INDUSTRIAL	3 V	SYNCHRONOUS		781248X1	2.65 mm	1		781248 bit	MEMORY CIRCUIT		12.8 mm	7.5 mm
Mfr Part No DS1235YW	Dallas Semiconductor	Datasheet	-	-	Min: 1 Mult: 1				DALLAS SEMICONDUCTOR												Obsolete						EAR99			8542.32.00.71						unknown
Mfr Part No S63256	Asahi Kasei Microsystems Corporation	Datasheet	-	-	Min: 1 Mult: 1				ASAHI KASEI MICRODEVICES CORP								,				Active						EAR99			8542.32.00.71						unknown
Mfr Part No HYG0UEG0AF1P-6SS0E	SK Hynix Inc	Datasheet	-	-	Min: 1 Mult: 1	YES	149		SK HYNIX INC		33554432 words	32000000	85 °C	-30 °C	PLASTIC/EPOXY	LFBGA	FBGA-149		RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	Active			1.8 V			EAR99		IT ALSO CONTAINS 512MBIT(64MBIT X 8) MOBILE DDR SDRAM OPERATES AT 2.7V NOM SUPPLY	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant			R-PBGA-B149		1.95 V	OTHER	1.7 V	SYNCHRONOUS		32MX16	1.4 mm	16		536870912 bit	MEMORY CIRCUIT		14 mm	10 mm
Mfr Part No S71VS256RD0AHKBL0	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	56		SPANSION INC				85 °C	-25 °C	PLASTIC/EPOXY	FBGA	FBGA, BGA56,10X14,20	BGA56,10X14,20	RECTANGULAR	GRID ARRAY, FINE PITCH	Transferred		Yes	1.8 V			EAR99			8542.32.00.71	BOTTOM	BALL	260		0.5 mm	unknown	40		R-PBGA-B56	Not Qualified		OTHER									MEMORY CIRCUIT	FLASH+PSRAM
Mfr Part No SST32HF3281-70-4E-LSE	Silicon Storage Technology	Datasheet	-	-	Min: 1 Mult: 1	YES	62		SILICON STORAGE TECHNOLOGY INC		2097152 words	2000000	85 °C	-20 °C	PLASTIC/EPOXY	LFBGA	LFBGA,		RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	Obsolete	BGA		3 V			EAR99		SRAM IS ORGANIZED AS 512K X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	unknown		62	R-PBGA-B62	Not Qualified	3.3 V	COMMERCIAL EXTENDED	2.7 V	ASYNCHRONOUS		2MX16	1.4 mm	16		33554432 bit	MEMORY CIRCUIT		10 mm	8 mm
Mfr Part No NAND98R3M0AZBB5E	Micron Technology Inc	Datasheet	-	-	Min: 1 Mult: 1	YES	107		MICRON TECHNOLOGY INC				85 °C	-30 °C	PLASTIC/EPOXY	FBGA	FBGA, BGA107,10X14,32	BGA107,10X14,32	RECTANGULAR	GRID ARRAY, FINE PITCH	Obsolete		Yes	1.8 V			EAR99			8542.32.00.71	BOTTOM	BALL			0.8 mm	compliant			R-PBGA-B107	Not Qualified		OTHER									MEMORY CIRCUIT	FLASH+SDRAM
Mfr Part No S71WS256NC0BFWAM	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	84		SPANSION INC	3	16777216 words	16000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	TFBGA,		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	1.8 V	e1		EAR99	TIN SILVER COPPER	PSRAM IS ALSO ORGANIZED AS 4M X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant		84	R-PBGA-B84	Not Qualified	1.95 V	OTHER	1.7 V	SYNCHRONOUS		16MX16	1.2 mm	16		268435456 bit	MEMORY CIRCUIT		11.6 mm	8 mm
Mfr Part No MC2210126-005-C	ATGBICS	Datasheet	-	-	Min: 1 Mult: 1
Mfr Part No SSDSC2KB240G8	Intel Corporation	Datasheet	-	-	Min: 1 Mult: 1

Specialized (1062)