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Specialized (1062)

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Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Surface Mount	Number of Terminals	Access Time-Max	Ihs Manufacturer	Moisture Sensitivity Levels	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Rohs Code	Supply Voltage-Nom (Vsup)	JESD-609 Code	Pbfree Code	ECCN Code	Terminal Finish	Additional Feature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Supply Voltage-Max (Vsup)	Temperature Grade	Supply Voltage-Min (Vsup)	Operating Mode	Supply Current-Max	Organization	Seated Height-Max	Memory Width	Standby Current-Max	Memory Density	Memory IC Type	Mixed Memory Type	Length	Width
Mfr Part No S71PL127JB0BFW9Z	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	64		SPANSION INC	3	8388608 words	8000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	TFBGA,		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	3 V	e1		EAR99	TIN SILVER COPPER	PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant		64	R-PBGA-B64	Not Qualified	3.6 V	OTHER	2.7 V	ASYNCHRONOUS		8MX16	1.2 mm	16		134217728 bit	MEMORY CIRCUIT		11.6 mm	8 mm
Mfr Part No SST32HF164-70-4C-TBK	Silicon Storage Technology	Datasheet	-	-	Min: 1 Mult: 1	YES	48	70 ns	SILICON STORAGE TECHNOLOGY INC		1048576 words	1000000	70 °C		PLASTIC/EPOXY	TBGA	TBGA, BGA48,6X8,40	BGA48,6X8,40	RECTANGULAR	GRID ARRAY, THIN PROFILE	Obsolete	BGA	No	3 V	e0		EAR99	TIN LEAD	ALSO CONTAINS 256K X 16 SRAM	8542.32.00.71	BOTTOM	BALL		1	1 mm	unknown		48	R-PBGA-B48	Not Qualified	3.3 V	COMMERCIAL	2.7 V	ASYNCHRONOUS	0.02 mA	1MX16	1.2 mm	16	0.00003 A	16777216 bit	MEMORY CIRCUIT	FLASH+SRAM	12 mm	10 mm
Mfr Part No S71PL256NC0HFW5U0	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	84	70 ns	SPANSION INC	3	16777216 words	16000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84	BGA84,10X12,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	3 V	e1		EAR99	TIN SILVER COPPER		8542.32.00.71	BOTTOM	BALL	260	1	0.8 mm	unknown	40	84	R-PBGA-B84	Not Qualified	3.1 V	OTHER	2.7 V	ASYNCHRONOUS		16MX16	1.2 mm	16		268435456 bit	MEMORY CIRCUIT	FLASH+PSRAM	11.6 mm	8 mm
Mfr Part No M5M410092AFP-13	Mitsubishi Electric	Datasheet	-	-	Min: 1 Mult: 1	YES	128		MITSUBISHI ELECTRIC CORP		327680 words	320000			PLASTIC/EPOXY	LFQFP	LFQFP,		RECTANGULAR	FLATPACK, LOW PROFILE, FINE PITCH	Obsolete	QFP		3.3 V			EAR99			8542.32.00.71	QUAD	GULL WING		1	0.5 mm	unknown		128	R-PQFP-G128	Not Qualified	3.465 V		3.135 V	SYNCHRONOUS		320KX32	1.7 mm	32		10485760 bit	MEMORY CIRCUIT		20 mm	14 mm
Mfr Part No CDP1824	General Electric Solid State	Datasheet	-	-	Min: 1 Mult: 1				GENERAL ELECTRIC SOLID STATE												Obsolete						EAR99			8542.32.00.71						unknown
Mfr Part No SLF9000N	Infineon Technologies AG	Datasheet	-	-	Min: 1 Mult: 1				INFINEON TECHNOLOGIES AG												Active						EAR99			8542.32.00.71						compliant
Mfr Part No XC17S50XLPDG8C	AMD Xilinx	Datasheet	283 In Stock	-	Min: 1 Mult: 1	NO	8		XILINX INC	1	559232 words	559232	70 °C		PLASTIC/EPOXY	DIP	DIP,		RECTANGULAR	IN-LINE	Obsolete	DIP	Yes	3.3 V	e3	Yes	EAR99	Matte Tin (Sn)		8542.32.00.71	DUAL	THROUGH-HOLE	250	1	2.54 mm	compliant	30	8	R-PDIP-T8	Not Qualified	3.6 V	COMMERCIAL	3 V	SYNCHRONOUS		559232X1	4.5974 mm	1		559232 bit	MEMORY CIRCUIT		9.3599 mm	7.62 mm
Mfr Part No SST32HF324C-70-4C-LBKE	Greenliant Systems Ltd	Datasheet	-	-	Min: 1 Mult: 1				GREENLIANT SYSTEMS LTD								,				Obsolete						EAR99			8542.32.00.71						compliant
Mfr Part No XC17S05PDG8C	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1	NO	8		XILINX INC	1	53984 words	53984	70 °C		PLASTIC/EPOXY	DIP	DIP,		RECTANGULAR	IN-LINE	Obsolete	DIP	Yes	5 V	e3	Yes	EAR99	Matte Tin (Sn)		8542.32.00.71	DUAL	THROUGH-HOLE	250	1	2.54 mm	compliant	30	8	R-PDIP-T8	Not Qualified	5.25 V	COMMERCIAL	4.75 V	SYNCHRONOUS		53984X1	4.5974 mm	1		53984 bit	MEMORY CIRCUIT		9.3599 mm	7.62 mm
Mfr Part No S71NS256NC0BJWVN3	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	60		SPANSION INC	3	16777216 words	16000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	11 X 10 MM, 1.20 MM HEIGHT, LEAD FREE, VFBGA-60		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	1.8 V	e2		EAR99	TIN SILVER COPPER NICKEL	PSRAM IS ORGANIZED AS 16M X 16	8542.32.00.71	BOTTOM	BALL	260	1	0.5 mm	unknown	40	60	R-PBGA-B60	Not Qualified	1.95 V	OTHER	1.7 V	SYNCHRONOUS		16MX16	1.2 mm	16		268435456 bit	MEMORY CIRCUIT		11 mm	10 mm
Mfr Part No UPD41101C-2	NEC Electronics Group	Datasheet	-	-	Min: 1 Mult: 1
Mfr Part No UPD41101C-2	Renesas Electronics Corporation	Datasheet	-	-	Min: 1 Mult: 1	NO	24	27 ns	RENESAS ELECTRONICS CORP				70 °C	-20 °C	PLASTIC/EPOXY	DIP	DIP-24	DIP24,.3	RECTANGULAR	IN-LINE	Obsolete		No		e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.71	DUAL	THROUGH-HOLE			2.54 mm	unknown			R-PDIP-T24	Not Qualified		COMMERCIAL			0.09 mA				0.09 A		MEMORY CIRCUIT
Mfr Part No CY7C274-55QMB	Teledyne e2v	Datasheet	-	-	Min: 1 Mult: 1				E2V TECHNOLOGIES PLC								,				Active						3A001.A.2.C			8542.32.00.61						compliant
Mfr Part No NAND98R3M0AZBB5E	Numonyx Memory Solutions	Datasheet	-	-	Min: 1 Mult: 1	YES	107		NUMONYX				85 °C	-30 °C	PLASTIC/EPOXY	FBGA	FBGA, BGA107,10X14,32	BGA107,10X14,32	RECTANGULAR	GRID ARRAY	Obsolete	BGA	Yes	1.8 V		Yes	EAR99			8542.32.00.71	BOTTOM	BALL	NOT SPECIFIED		0.8 mm	unknown	NOT SPECIFIED	107	R-PBGA-B107	Not Qualified		OTHER									MEMORY CIRCUIT	FLASH+SDRAM
Mfr Part No XC17S05XLVOG8C	AMD Xilinx	Datasheet	330 In Stock	-	Min: 1 Mult: 1	YES	8		XILINX INC	3	54544 words	54544	70 °C		PLASTIC/EPOXY	TSOP2	TSOP2,		RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSOP	Yes	3.3 V	e3	Yes	EAR99	Matte Tin (Sn)		8542.32.00.71	DUAL	GULL WING	260	1	1.27 mm	compliant	30	8	R-PDSO-G8	Not Qualified	3.6 V	COMMERCIAL	3 V	SYNCHRONOUS		54544X1	1.2 mm	1		54544 bit	MEMORY CIRCUIT		4.9 mm	3.9 mm
Mfr Part No M4-4102R-Z2	Moujen Switch	Datasheet	-	-	Min: 1 Mult: 1
Mfr Part No S72NS256PD0AJBLG2	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	133		SPANSION INC	3	16777216 words	16000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133		SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	1.8 V	e2		EAR99	TIN SILVER COPPER NICKEL	DRAM IS ORGANISED AS 16M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE	8542.32.00.71	BOTTOM	BALL	260	1	0.5 mm	unknown	40	133	S-PBGA-B133	Not Qualified	1.95 V	OTHER	1.7 V	ASYNCHRONOUS		16MX16	1.1 mm	16		268435456 bit	MEMORY CIRCUIT		8 mm	8 mm
Mfr Part No XC17S40PDG8C	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1	NO	8		XILINX INC	1	329312 words	329312	70 °C		PLASTIC/EPOXY	DIP	DIP,		RECTANGULAR	IN-LINE	Obsolete	DIP	Yes	5 V	e3	Yes	EAR99	Matte Tin (Sn)		8542.32.00.71	DUAL	THROUGH-HOLE	250	1	2.54 mm	compliant	30	8	R-PDIP-T8	Not Qualified	5.25 V	COMMERCIAL	4.75 V	SYNCHRONOUS		329312X1	4.5974 mm	1		329312 bit	MEMORY CIRCUIT		9.3599 mm	7.62 mm
Mfr Part No ICM-45631	TDK Corporation	Datasheet	-	-	Min: 1 Mult: 1
Mfr Part No XC17S30PDG8C	AMD Xilinx	Datasheet	128 In Stock	-	Min: 1 Mult: 1	NO	8		XILINX INC	1	247968 words	247968	70 °C		PLASTIC/EPOXY	DIP	DIP,		RECTANGULAR	IN-LINE	Obsolete	DIP	Yes	5 V	e3	Yes	EAR99	Matte Tin (Sn)		8542.32.00.71	DUAL	THROUGH-HOLE	250	1	2.54 mm	compliant	30	8	R-PDIP-T8	Not Qualified	5.25 V	COMMERCIAL	4.75 V	SYNCHRONOUS		247968X1	4.5974 mm	1		247968 bit	MEMORY CIRCUIT		9.3599 mm	7.62 mm

Specialized (1062)