Shop the Latest Specialized at Richard Electronics

The category is 'Specialized'

Specialized (1062)

All Manufacturers
Package
Series
Mfr
Product Status
Type
Reach Compliance Code
Ihs Manufacturer
Part Life Cycle Code
ECCN Code
HTS Code
Package Description
Dimensions

Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Surface Mount	Number of Terminals	Access Time-Max	Date Of Intro	Ihs Manufacturer	Moisture Sensitivity Levels	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Rohs Code	Supply Voltage-Nom (Vsup)	JESD-609 Code	Pbfree Code	ECCN Code	Terminal Finish	Additional Feature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Supply Voltage-Max (Vsup)	Temperature Grade	Supply Voltage-Min (Vsup)	Operating Mode	Supply Current-Max	Organization	Output Characteristics	Seated Height-Max	Memory Width	Standby Current-Max	Memory Density	Screening Level	I/O Type	Memory IC Type	Mixed Memory Type	Length	Width
Mfr Part No XC17S50XLSOG20C	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1	YES	20			XILINX INC	3	559232 words	559232	70 °C		PLASTIC/EPOXY	SOP	SOP,		RECTANGULAR	SMALL OUTLINE	Obsolete	SOIC	Yes	3.3 V	e3	Yes	EAR99	Matte Tin (Sn)		8542.32.00.71	DUAL	GULL WING	260	1	1.27 mm	compliant	30	20	R-PDSO-G20	Not Qualified	3.6 V	COMMERCIAL	3 V	SYNCHRONOUS		559232X1		2.65 mm	1		559232 bit			MEMORY CIRCUIT		12.8 mm	7.5 mm
Mfr Part No M4-4101S-Z3	Moujen Switch	Datasheet	-	-	Min: 1 Mult: 1
Mfr Part No SSDSC2KB240G701	Intel Corporation	Datasheet	-	-	Min: 1 Mult: 1				2018-07-23	INTEL CORP								,				Obsolete						EAR99			8542.32.00.71						compliant																		MEMORY CIRCUIT
Mfr Part No S82S141F883C	Philips Semiconductors	Datasheet	-	-	Min: 1 Mult: 1	NO	24	90 ns		SIGNETICS CORP		512 words	512	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	DIP	DIP, DIP24,.6	DIP24,.6	RECTANGULAR	IN-LINE	Obsolete		No	5 V	e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.71	DUAL	THROUGH-HOLE		1	2.54 mm	unknown			R-CDIP-T24	Not Qualified	5.5 V	MILITARY	4.5 V	ASYNCHRONOUS	0.185 mA	512X8			8		4096 bit	MIL-STD-883		MEMORY CIRCUIT
Mfr Part No S82S141F883C	NXP Semiconductors	Datasheet	-	-	Min: 1 Mult: 1	NO	24	90 ns		SIGNETICS CORP		512 words	512	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	DIP	DIP, DIP24,.6	DIP24,.6	RECTANGULAR	IN-LINE	Obsolete	DIP	No	5 V	e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.71	DUAL	THROUGH-HOLE		1	2.54 mm	unknown		24	R-CDIP-T24	Not Qualified	5.5 V	MILITARY	4.5 V	ASYNCHRONOUS	0.185 mA	512X8			8		4096 bit	MIL-STD-883		MEMORY CIRCUIT
Mfr Part No HY64UD16322A-DF70E	SK Hynix Inc	Datasheet	-	-	Min: 1 Mult: 1	YES	48	70 ns		SK HYNIX INC		2097152 words	2000000	85 °C	-25 °C	PLASTIC/EPOXY	FBGA	FBGA, BGA48,6X8,30	BGA48,6X8,30	RECTANGULAR	GRID ARRAY, FINE PITCH	Obsolete			3 V			EAR99			8542.32.00.71	BOTTOM	BALL			0.75 mm	unknown			R-PBGA-B48	Not Qualified		OTHER			0.025 mA	2MX16	3-STATE		16	0.000002 A	33554432 bit		COMMON
Mfr Part No S72NS256PD0AJBLG3	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	133			SPANSION INC	3	16777216 words	16000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133		SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	1.8 V	e2		EAR99	TIN SILVER COPPER NICKEL	DRAM IS ORGANISED AS 16M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE	8542.32.00.71	BOTTOM	BALL	260	1	0.5 mm	unknown	40	133	S-PBGA-B133	Not Qualified	1.95 V	OTHER	1.7 V	ASYNCHRONOUS		16MX16		1.1 mm	16		268435456 bit			MEMORY CIRCUIT		8 mm	8 mm
Mfr Part No PF38F5060M0Y0B0	Intel Corporation	Datasheet	-	-	Min: 1 Mult: 1	YES	105			INTEL CORP	3	33554432 words	32000000	85 °C	-30 °C	PLASTIC/EPOXY	TFBGA	TFBGA, BGA105,9X12,32	BGA105,9X12,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Transferred	BGA	Yes	1.8 V	e1		EAR99	TIN SILVER COPPER	PSEUDO SRAM IS ORGANIZED AS 8M X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant		105	R-PBGA-B105	Not Qualified	2 V	OTHER	1.7 V	SYNCHRONOUS		32MX16		1.2 mm	16	0.00012 A	536870912 bit			MEMORY CIRCUIT	FLASH+PSRAM	11 mm	9 mm
Mfr Part No TH50VSF2580AASB	Toshiba America Electronic Components	Datasheet	-	-	Min: 1 Mult: 1	YES	69	90 ns		TOSHIBA CORP		2097152 words	2000000	85 °C	-40 °C	PLASTIC/EPOXY	LFBGA	LFBGA, BGA69,10X12,32	BGA69,10X12,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	Transferred	BGA	No	3 V	e0	No	EAR99	TIN LEAD	USER CONFIGURABLE AS 4M X 8 FLASH AND CONTAINS SRAM CONFIGURED AS 256 X 16 OR 512K X 8	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	unknown		69	R-PBGA-B69	Not Qualified	3.6 V	INDUSTRIAL	2.7 V	ASYNCHRONOUS	0.05 mA	2MX16		1.4 mm	16		33554432 bit			MEMORY CIRCUIT	FLASH+SRAM	12 mm	9 mm
Mfr Part No RD28F3208C3T70	Intel Corporation	Datasheet	-	-	Min: 1 Mult: 1	YES	66	70 ns		INTEL CORP		2097152 words	2000000	85 °C	-25 °C	PLASTIC/EPOXY	LFBGA	LFBGA, BGA68,8X12,32	BGA68,8X12,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	Obsolete	BGA	No	3 V			EAR99		SRAM IS ORGANIZED AS 512K X 16	8542.32.00.71	BOTTOM	BALL	240	1	0.8 mm	compliant	30	66	R-PBGA-B66	Not Qualified	3.3 V	COMMERCIAL EXTENDED	2.7 V	ASYNCHRONOUS	0.055 mA	2MX16		1.4 mm	16	0.000006 A	33554432 bit			MEMORY CIRCUIT	FLASH+SRAM	10 mm	8 mm
Mfr Part No S71GL128NB0BFW9Z0	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	64			SPANSION INC	3	8388608 words	8000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	8 X 11.60 MM, 1.20 MM HIEGHT, LEAD FREE, FBGA-64		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	3 V	e1		3A991.B.1.A	TIN SILVER COPPER	PSRAM IS ORGANIZED AS 2M X 16	8542.32.00.71	BOTTOM	BALL	260	1	0.8 mm	unknown	40	64	R-PBGA-B64	Not Qualified	3.1 V	OTHER	2.7 V	ASYNCHRONOUS		8MX16		1.2 mm	16		134217728 bit			MEMORY CIRCUIT		11.6 mm	8 mm
Mfr Part No LRS1806K	Sharp Microelectronics of the Americas	Datasheet	-	-	Min: 1 Mult: 1
Mfr Part No R8A66120FFA	Renesas Electronics Corporation	Datasheet	-	-	Min: 1 Mult: 1	YES	48	6 ns		RENESAS ELECTRONICS CORP		2097152 words	2000000	70 °C		PLASTIC/EPOXY	LFQFP	LFQFP, QFP48,.35SQ,20	QFP48,.35SQ,20	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	Obsolete	QFP		3.3 V			EAR99			8542.32.00.71	QUAD	GULL WING		1	0.5 mm	unknown		48	S-PQFP-G48	Not Qualified	3.6 V	COMMERCIAL	3 V	SYNCHRONOUS	0.15 mA	2MX4		1.7 mm	4		8388608 bit			MEMORY CIRCUIT		7 mm	7 mm
Mfr Part No SSDSCKJR150G7XA	Intel Corporation	Datasheet	-	-	Min: 1 Mult: 1				2018-07-27	INTEL CORP		161061273600 words	150000000000	70 °C		UNSPECIFIED		PACKAGE		RECTANGULAR		Active						EAR99			8542.32.00.71				1		compliant						COMMERCIAL		ASYNCHRONOUS		150GX8			8		1288490188800 bit			MEMORY CIRCUIT
Mfr Part No M4-4112-Z3	Moujen Switch	Datasheet	-	-	Min: 1 Mult: 1
Mfr Part No M4-4112RS-Z2	Moujen Switch	Datasheet	-	-	Min: 1 Mult: 1
Mfr Part No S71VS256RD0AHKBL0	Cypress Semiconductor	Datasheet	-	-	Min: 1 Mult: 1	YES	56			CYPRESS SEMICONDUCTOR CORP				85 °C	-25 °C	PLASTIC/EPOXY	FBGA		BGA56,10X14,20	RECTANGULAR	GRID ARRAY, FINE PITCH	Transferred		Yes	1.8 V			EAR99			8542.32.00.71	BOTTOM	BALL			0.5 mm	compliant			R-PBGA-B56	Not Qualified		OTHER												MEMORY CIRCUIT	FLASH+PSRAM
Mfr Part No SST32HF3281-70-4E-LSE	Greenliant Systems Ltd	Datasheet	-	-	Min: 1 Mult: 1					GREENLIANT SYSTEMS LTD								,				Obsolete						EAR99			8542.32.00.71						compliant
Mfr Part No S71GL256NB0BAWAZ3	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	84			SPANSION INC		16777216 words	16000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	TFBGA,		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	No	3 V	e0		EAR99	TIN LEAD	PSRAM IS ORGANIZED AS 2M X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant		84	R-PBGA-B84	Not Qualified	3.1 V	OTHER	2.7 V	ASYNCHRONOUS		16MX16		1.2 mm	16		268435456 bit			MEMORY CIRCUIT		11.6 mm	8 mm
Mfr Part No M4-4112S-Z3	Moujen Switch	Datasheet	-	-	Min: 1 Mult: 1

Specialized (1062)