The category is 'USB Flash Drives'
USB Flash Drives (1612)
- All Manufacturers
- EU RoHS
- Part Status
- Chip Density (bit)
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- Automotive
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- Typical Operating Supply Voltage (V)
- Maximum Operating Supply Voltage (V)
- Minimum Operating Supply Voltage (V)
- Programmability
- ECCN (US)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Address Bus Width (bit) | Automotive | Base Product Number | Block Organization | Cell Type | Chip Density (bit) | Clock Frequency-Max (fCLK) | Command Compatible | ECC Support | ECCN (US) | EU RoHS | HTS | Ihs Manufacturer | Interface Type | Lead Shape | Manufacturer | Manufacturer Part Number | Maximum Erase Time (S) | Maximum Operating Frequency (MHz) | Maximum Operating Supply Voltage (V) | Maximum Operating Temperature (°C) | Maximum Programming Time (ms) | Memory Types | Mfr | Minimum Endurance (Cycles) | Minimum Operating Supply Voltage (V) | Minimum Operating Temperature (°C) | Mounting | Number of Bits/Word (bit) | Number of Words | Number of Words Code | Operating Current (mA) | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Height | Package Length | Package Shape | Package Style | Package Type | Package Width | Part Life Cycle Code | PCB changed | PPAP | Product Status | Program Current (mA) | Programmability | Programmable | Programming Voltage (V) | Rad Hardened | Risk Rank | Standard Package Name | Supplier Package | Supplier Temperature Grade | Supply Voltage-Nom (Vsup) | Support of Page Mode | Timing Type | Typical Operating Supply Voltage (V) | Operating Temperature | Packaging | Series | Part Status | Type | Additional Feature | Technology | Voltage - Supply | Terminal Position | Terminal Form | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Speed | Operating Mode | Clock Frequency | Access Time | Memory Format | Memory Interface | Architecture | Organization | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Memory Density | Parallel/Serial | Memory IC Type | Programming Voltage | Sector Size | Page Size | Boot Block | Temperature | Memory Organization | Length | Width |
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 | Mfr Part No W25Q128FWYIC TR | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 32-UFBGA, WLCSP | 32-WLCSP (3.98x3.19) | No | W25Q128 | Symmetrical | 128M | Compliant | Serial (SPI, Dual SPI, Quad SPI) | 1.95 | Non-Volatile | Winbond Electronics | 1.65 | Surface Mount | Tape & Reel (TR) | 0.33 | 32 | No | Obsolete | WLCSP | Synchronous | 1.8 | -40°C ~ 85°C (TA) | SpiFlash® | Obsolete | FLASH - NOR | 1.65V ~ 1.95V | 32 | 128Mbit | 104 MHz | FLASH | SPI - Quad I/O, QPI | Sectored | 60µs, 5ms | 16M x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No KLMDG4UCTA-B0410 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | No | Compliant | 8542.32.00.71 | No | Unconfirmed | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No KLMDG8JENB-B0410 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 153 | No | 1T | 200 MHz | 8542.32.00.71 | SAMSUNG SEMICONDUCTOR INC | Serial e-MMC | Samsung Semiconductor | KLMDG8JENB-B0410 | 1.95|3.6 | 1.7|2.7 | 137438953472 words | 128000000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | FBGA-153 | 1 | 13 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 11.5 | Active | No | 5.78 | 1.8 V | Synchronous | 1.8|3.3 | Unconfirmed | MLC NAND TYPE | CMOS | BOTTOM | BALL | 1 | 0.5 mm | compliant | R-PBGA-B153 | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 128GX8 | 1.2 mm | 8 | 1099511627776 bit | PARALLEL | FLASH | 1.8 V | 13 mm | 11.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W29N04GVBIAA TR | Winbond Electronics Corporation | Datasheet | 12 |
| Min: 1 Mult: 1 | Surface Mount | 63-VFBGA | 63-VFBGA (9x11) | 30 | Yes | Symmetrical | SLC NAND | 4G | No | Yes | 3A991b.1.a. | Compliant | 8542.32.00.71 | Parallel | 0.01/Block | 3.6 | 85 | 0.7/Page | Non-Volatile | Winbond Electronics | 100000 | 2.7 | -40 | Surface Mount | 8 | 512M | 35 | Tape & Reel (TR) | 0.6(Max) | 11 | VFBGA | 9 | 63 | Unknown | Active | 35 | Yes | Yes | 2.7 to 3.6 | No | VFBGA | Industrial | 2.7V - 3.6V | Yes | Asynchronous | 3.3 | -40°C ~ 85°C (TA) | - | Active | SLC NAND Flash | FLASH - NAND (SLC) | 2.7V ~ 3.6V | 63 | 4Gbit | 40MHz | 20 ns | FLASH | ONFI | Sectored | High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set | 25ns, 700µs | 4Gb | 128Kbyte x 4096 | 2Kbyte | No | 40ºC ~ 85ºC / -40ºC ~ 105ºC | 512M x 8 | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM662PE8-AB | Silicon Motion | Datasheet | - | - | Min: 1 Mult: 1 | Unknown | MLC NAND | 8G | Compliant | 8542.32.00.71 | Ball | Surface Mount | 1.4 | 18 | 14 | 100 | Unknown | BGA | BGA | Industrial | Unconfirmed | 100 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM662PEB-AB | Silicon Motion | Datasheet | - | - | Min: 1 Mult: 1 | Unknown | MLC NAND | 32G | Compliant | 8542.32.00.71 | Ball | Surface Mount | 1.4 | 18 | 14 | 100 | Unknown | BGA | BGA | Industrial | Unconfirmed | 100 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM662PXD-BDS | 153-b eMMC 5.1 TLC NAND 128GB C-temp | Silicon Motion | Datasheet | 36 |
| Min: 1 Mult: 1 | Yes | TLC NAND | 1T | Yes | Yes | EAR99 | Compliant | 8542.32.00.71 | Serial e-MMC | 85 | -25 | Surface Mount | 1.4 | 18 | 14 | 153 | Unknown | Yes | BGA | Commercial | No | Synchronous | Tray | Obsolete | 153 | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No KLMCG4JETD-B0410 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 153 | No | NAND | 512G | 200 MHz | Yes | Yes | 3A991.b.1.a | Compliant | 8542.32.00.71 | SAMSUNG SEMICONDUCTOR INC | Serial e-MMC | Ball | Samsung Semiconductor | KLMCG4JETD-B0410 | 0.02 | 200 | 1.95|3.6 | 85 | 1.7|2.7 | -25 | Surface Mount | 1/4/8 | 512G/128G/64G | 64000000000 | 85 °C | -25 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | 0.71 | 13 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 11.5 | Active | 153 | No | Yes | 5.79 | BGA | FBGA | 1.8 V | No | Synchronous | 1.8|3.3 | Active | MLC NAND TYPE | ALSO OPERATES @ 3V SUP NOM | CMOS | BOTTOM | BALL | 1 | 0.5 mm | compliant | 153 | R-PBGA-B153 | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 64GX8 | 1 mm | 8 | 549755813888 bit | PARALLEL | FLASH | 1.8 V | Yes | 13 mm | 11.5 mm | ||||||||||||||||||||||||||||||||||||
| Mfr Part No SM671PED-ADS | UFS 2.1 TLC NAND 128GB I-temp | Silicon Motion | Datasheet | 36 |
| Min: 1 Mult: 1 | Yes | TLC NAND | 1T | Yes | Yes | EAR99 | Compliant | 8542.32.00.71 | Serial UFS | 85 | -40 | Surface Mount | 1.2 | 13 | 11.5 | 153 | Unknown | Yes | BGA | Industrial | Yes | Synchronous | Tray | 153 | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM671PAC-ADS | UFS 2.1 TLC NAND 64GB Automotive | Silicon Motion | Datasheet | 36 |
| Min: 1 Mult: 1 | Yes | TLC NAND | 512G | Yes | Yes | EAR99 | Compliant | 8542.32.00.71 | Serial UFS | Surface Mount | 1.2 | 13 | 11.5 | 153 | Unknown | Yes | BGA | Automotive | Yes | Synchronous | Tray | 153 | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM668PX2-AC | Silicon Motion | Datasheet | - | - | Min: 1 Mult: 1 | Yes | SLC NAND | 16G | Yes | Yes | EAR99 | Compliant | 8542.32.00.71 | Serial e-MMC | 85 | -25 | Surface Mount | 1.4 | 18 | 14 | 153 | Unknown | Yes | BGA | Commercial | No | Synchronous | Tray | Unconfirmed | 153 | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM668GXB-ACS | Silicon Motion | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 100-LBGA | 100-BGA (14x18) | Yes | SLC NAND | 256G | Yes | Yes | EAR99 | Compliant | 8542.32.00.71 | Serial e-MMC | 85 | Non-Volatile | Silicon Motion, Inc. | -25 | Surface Mount | Bulk | 1.4 | 18 | 14 | 153 | Unknown | Active | Yes | BGA | Commercial | No | Synchronous | -25°C ~ 85°C | Tray | Ferri-eMMC® | LTB | FLASH - NAND (SLC) | - | 153 | 256Gbit | FLASH | eMMC | - | No | 32G x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM662PEA-BDS | 153-b eMMC 5.1 TLC NAND 16GB i-temp | Silicon Motion | Datasheet | - | - | Min: 1 Mult: 1 | Yes | TLC NAND | 128G | Yes | Yes | EAR99 | Compliant | 8542.32.00.71 | Serial e-MMC | 85 | -40 | Surface Mount | 1.4 | 18 | 14 | 153 | Unknown | Yes | BGA | Industrial | No | Synchronous | Tray | Unconfirmed | 153 | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM668PE8-ACS | Silicon Motion | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 153-TFBGA | 153-BGA (11.5x13) | Yes | SM668 | SLC NAND | 64G | Yes | Yes | EAR99 | Compliant | 8542.32.00.71 | Serial e-MMC | 85 | Non-Volatile | Silicon Motion, Inc. | -40 | Surface Mount | Bulk | 1.4 | 18 | 14 | 153 | Unknown | Last Time Buy | Yes | BGA | Industrial | No | Synchronous | -40°C ~ 85°C | Tray | Ferri-eMMC® | LTB | FLASH - NAND (SLC) | - | 153 | 64Gbit | FLASH | eMMC | - | No | 8G x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM662GAA-BDS | 100-b eMMC 5.1 TLC NAND 16GB i-temp | Silicon Motion | Datasheet | 15 |
| Min: 1 Mult: 1 | Yes | TLC NAND | 128G | Yes | Yes | EAR99 | Compliant | 8542.32.00.71 | Serial e-MMC | Surface Mount | 1.4 | 18 | 14 | 153 | Unknown | Yes | BGA | Automotive | No | Synchronous | Tray | Unconfirmed | 153 | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM662GAC-BDS | 100-b eMMC 5.1 TLC NAND 64GB i-temp | Silicon Motion | Datasheet | 15 |
| Min: 1 Mult: 1 | Yes | TLC NAND | 512G | Yes | Yes | EAR99 | Compliant | 8542.32.00.71 | Serial e-MMC | Surface Mount | 1.4 | 18 | 14 | 153 | Unknown | Yes | BGA | Automotive | No | Synchronous | Tray | Unconfirmed | 153 | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM671PAB-ADS | UFS 2.1 TLC NAND 32GB Automotive | Silicon Motion | Datasheet | 40 |
| Min: 1 Mult: 1 | Yes | TLC NAND | 256G | Yes | Yes | EAR99 | Compliant | 8542.32.00.71 | Serial UFS | Surface Mount | 1.2 | 13 | 11.5 | 153 | Unknown | Yes | BGA | Automotive | Yes | Synchronous | Tray | 153 | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM668GE2-ACH | Silicon Motion | Datasheet | - | - | Min: 1 Mult: 1 | Yes | SLC NAND | 16G | Yes | Yes | EAR99 | Compliant | 8542.32.00.71 | Serial e-MMC | 85 | -40 | Surface Mount | 1.4 | 18 | 14 | 153 | Unknown | Yes | BGA | Industrial | No | Synchronous | Tray | Unconfirmed | 153 | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM662GEB-BDS | 100-b eMMC 5.1 TLC NAND 32GB i-temp | Silicon Motion | Datasheet | 12 |
| Min: 1 Mult: 1 | Yes | TLC NAND | 256G | Yes | Yes | EAR99 | Compliant | 8542.32.00.71 | Serial e-MMC | 85 | -40 | Surface Mount | 1.4 | 18 | 14 | 153 | Unknown | Yes | BGA | Industrial | No | Synchronous | Tray | Unconfirmed | 153 | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM671PXC-ADS | UFS 2.1 TLC NAND 64GB C-temp | Silicon Motion | Datasheet | 36 |
| Min: 1 Mult: 1 | Yes | TLC NAND | 512G | Yes | Yes | EAR99 | Compliant | 8542.32.00.71 | Serial UFS | 85 | -25 | Surface Mount | 1.2 | 13 | 11.5 | 153 | Unknown | Yes | BGA | Commercial | Yes | Synchronous | Tray | 153 | No |
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W25Q128FWYIC TR
Winbond Electronics Corporation
Package:USB Flash Drives
Price: please inquire
-
KLMDG4UCTA-B0410
Samsung Semiconductor
Package:USB Flash Drives
Price: please inquire
-
KLMDG8JENB-B0410
Samsung Semiconductor
Package:USB Flash Drives
Price: please inquire
-
W29N04GVBIAA TR
Winbond Electronics Corporation
Package:USB Flash Drives
9.265521
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SM662PE8-AB
Silicon Motion
Package:USB Flash Drives
Price: please inquire
-
SM662PEB-AB
Silicon Motion
Package:USB Flash Drives
Price: please inquire
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SM662PXD-BDS | 153-b eMMC 5.1 TLC NAND 128GB C-temp
Silicon Motion
Package:USB Flash Drives
7.045120
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KLMCG4JETD-B0410
Samsung Semiconductor
Package:USB Flash Drives
Price: please inquire
-
SM671PED-ADS | UFS 2.1 TLC NAND 128GB I-temp
Silicon Motion
Package:USB Flash Drives
6.886606
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SM671PAC-ADS | UFS 2.1 TLC NAND 64GB Automotive
Silicon Motion
Package:USB Flash Drives
3.645850
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SM668PX2-AC
Silicon Motion
Package:USB Flash Drives
Price: please inquire
-
SM668GXB-ACS
Silicon Motion
Package:USB Flash Drives
Price: please inquire
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SM662PEA-BDS | 153-b eMMC 5.1 TLC NAND 16GB i-temp
Silicon Motion
Package:USB Flash Drives
Price: please inquire
-
SM668PE8-ACS
Silicon Motion
Package:USB Flash Drives
Price: please inquire
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SM662GAA-BDS | 100-b eMMC 5.1 TLC NAND 16GB i-temp
Silicon Motion
Package:USB Flash Drives
1.630549
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SM662GAC-BDS | 100-b eMMC 5.1 TLC NAND 64GB i-temp
Silicon Motion
Package:USB Flash Drives
4.026659
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SM671PAB-ADS | UFS 2.1 TLC NAND 32GB Automotive
Silicon Motion
Package:USB Flash Drives
2.078310
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SM668GE2-ACH
Silicon Motion
Package:USB Flash Drives
Price: please inquire
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SM662GEB-BDS | 100-b eMMC 5.1 TLC NAND 32GB i-temp
Silicon Motion
Package:USB Flash Drives
2.153516
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SM671PXC-ADS | UFS 2.1 TLC NAND 64GB C-temp
Silicon Motion
Package:USB Flash Drives
3.557786