The category is 'USB Flash Drives'
USB Flash Drives (1612)
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Address Bus Width (bit) | Automotive | Base Product Number | Block Organization | Cell Type | Chip Density (bit) | Clock Frequency-Max (fCLK) | Command Compatible | ECC Support | ECCN (US) | EU RoHS | HTS | Ihs Manufacturer | Interface Type | Lead Shape | Location of Boot Block | Manufacturer | Manufacturer Part Number | Max. Access Time (ns) | Maximum Erase Time (S) | Maximum Operating Frequency (MHz) | Maximum Operating Supply Voltage (V) | Maximum Operating Temperature (°C) | Maximum Programming Time (ms) | Memory Types | Mfr | Minimum Endurance (Cycles) | Minimum Operating Supply Voltage (V) | Minimum Operating Temperature (°C) | Mounting | Number of Bits/Word (bit) | Number of Words | Number of Words Code | Operating Current (mA) | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Height | Package Length | Package Shape | Package Style | Package Width | Part Life Cycle Code | PCB changed | PPAP | Product Status | Program Current (mA) | Programmability | Programming Voltage (V) | Risk Rank | Standard Package Name | Supplier Package | Supplier Temperature Grade | Supply Voltage-Nom (Vsup) | Support of Page Mode | Timing Type | Typical Operating Supply Voltage (V) | Operating Temperature | Packaging | Series | Part Status | Type | Technology | Voltage - Supply | Terminal Position | Terminal Form | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Speed | Operating Mode | Clock Frequency | Access Time | Memory Format | Memory Interface | Architecture | Organization | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Memory Density | Parallel/Serial | Memory IC Type | Programming Voltage | Sector Size | Page Size | Boot Block | Temperature | Memory Organization | Length | Width |
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 | Mfr Part No W25Q128FWEIQ TR | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) | No | W25Q128 | Symmetrical | 128M | Compliant | 8542.32.00.71 | Serial (SPI, Dual SPI, Quad SPI) | 1.95 | Non-Volatile | Winbond Electronics | 1.65 | Surface Mount | Tape & Reel (TR) | 0.73 | 6 | 8 | 8 | No | Obsolete | WSON EP | Synchronous | 1.8 | -40°C ~ 85°C (TA) | SpiFlash® | Obsolete | FLASH - NOR | 1.65V ~ 1.95V | 8 | 128Mbit | 104 MHz | FLASH | SPI - Quad I/O, QPI | Sectored | 60µs, 5ms | 16M x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM661GXA-AB | Silicon Motion | Datasheet | - | - | Min: 1 Mult: 1 | Yes | Compliant | 8542.32.00.71 | Ball | Surface Mount | Unknown | BGA | BGA | Unconfirmed | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W25Q80DLUXIE TR | Winbond Electronics Corporation | Datasheet | 486 |
| Min: 1 Mult: 1 | Surface Mount | 8-UFDFN Exposed Pad | 8-USON (2x3) | 24 | No | W25Q80 | Symmetrical | NOR | 8M | Yes | No | EAR99 | Compliant | 8542.32.00.51 | Serial (SPI, Dual SPI, Quad SPI) | 6 | 6/Chip | 104 | 3.6 | 85 | 3/Page | Non-Volatile | Winbond Electronics | 100000 | 2.3 | -40 | Surface Mount | 8 | 1M | 25 | 0.53 | 2 | 3 | 8 | No | Obsolete | 25 | Yes | 2.3 to 3.6 | USON EP | Industrial | No | Synchronous | 2.5|3|3.3 | -40°C ~ 85°C (TA) | Active | FLASH - NOR | 2.3V ~ 3.6V | 8 | 8Mbit | 80 MHz | FLASH | SPI - Quad I/O | Sectored | 30µs, 3ms | 4Kbyte x 256 | 256byte | No | 1M x 8 | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W29N02GZBIAF | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 29 | No | SLC NAND | 2G | No | Yes | 3A991.b.1.a | 8542.32.00.71 | Parallel | 0.01/Block | 1.95 | 85 | 0.7/Page | 100000 | 1.7 | -40 | Surface Mount | 8 | 256M | 20 | 0.6(Max) | 11 | 9 | 63 | No | 20 | Yes | 1.7 to 1.95 | VFBGA | Industrial | Yes | Asynchronous | 1.8 | 63 | 1KWords/2Kbyte | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W25R64FVSSIQ | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 24 | No | Symmetrical | NOR | 64M | Yes | No | 3A991.b.1.a | Compliant | 8542.32.00.71 | Serial (SPI, Dual SPI, Quad SPI) | Gull-wing | 8.5 | 100/Chip | 3.6 | 85 | 3/Page | 2.7 | -40 | Surface Mount | 8 | 8M | 12 | 1.8 | 5.28 | 5.28 | 8 | No | 25 | Yes | 2.7 to 3.6 | SOIC W | Industrial | No | Synchronous | 3.3|3 | Tube|Tray|Tape and Reel | NRND | 8 | Sectored | 4Kbyte x 2048 | 256byte | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No KLMBG2JENB-B0410 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 153 | No | 256G | 200 MHz | 8542.32.00.71 | SAMSUNG SEMICONDUCTOR INC | Serial e-MMC | Samsung Semiconductor | KLMBG2JENB-B0410 | 1.95|3.6 | 1.7|2.7 | 34359738368 words | 32000000000 | 85 °C | -25 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | 1 | 13 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 11.5 | Active | No | 5.79 | 1.8 V | Synchronous | 1.8|3.3 | Unconfirmed | MLC NAND TYPE | CMOS | BOTTOM | BALL | 1 | 0.5 mm | compliant | R-PBGA-B153 | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 32GX8 | 1 mm | 8 | 274877906944 bit | PARALLEL | FLASH | 1.8 V | 13 mm | 11.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W25Q32JVXGIM | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 24 | No | Symmetrical | NOR | 32M | Yes | No | 3A991.b.1.a | Compliant | 8542.32.00.71 | Serial (SPI, Dual SPI, Quad SPI) | Top|Bottom | 6 | 50/Chip | 3.6 | 85 | 3/Page | 100000 | 2.7 | -40 | Surface Mount | 8 | 4M | 25 | 0.43 | 4 | 4 | 8 | No | 25 | Yes | 2.7 to 3.6 | XSON EP | Industrial | No | Synchronous | 3.3|3 | Tube | Active | 8 | Sectored | 4Kbyte x 1024 | 256byte | Yes | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W25Q80EWBYIG/REEL | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 24 | No | Symmetrical | NOR | 8M | Yes | No | EAR99 | Compliant | 8542.32.00.71 | Serial (SPI, Dual SPI, Quad SPI) | 6 | 10/Chip | 1.95 | 85 | 0.8/Page | 100000 | 1.65 | -40 | Surface Mount | 8 | 1M | 20 | 0.23 | 1.68 | 1.64 | 8 | No | 20 | Yes | 1.65 to 1.95 | WLCSP | Industrial | No | Synchronous | 1.8 | Tube | Active | 8 | Sectored | 4Kbyte x 256 | 256byte | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W29N08GVBIAA TR | Winbond Electronics Corporation | Datasheet | 35 |
| Min: 1 Mult: 1 | Surface Mount | 63-VFBGA | 63-FBGA (11x9) | 31 | Yes | Symmetrical | SLC NAND | 8G | No | Yes | 3A991.b.1.a | Compliant | 8542.32.00.71 | Parallel | Ball | 0.01/Block | 3.6 | 85 | 0.7/Page | Non-Volatile | Winbond Electronics | 100000 | 2.7 | -40 | Surface Mount | 8 | 1G | 35 | Tape & Reel (TR) | 0.6(Max) | 11 | 9 | 63 | Unknown | Active | 35 | Yes | 2.7 to 3.6 | BGA | VFBGA | Industrial | 2.7V - 3.6V | Yes | Asynchronous | 3|3.3 | -40°C ~ 85°C (TA) | - | Active | SLC NAND Flash | FLASH - NAND (SLC) | 2.7V ~ 3.6V | 63 | 8Gbit | 40MHz | 20 ns | FLASH | ONFI | Sectored | High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set | 25ns, 700µs | 8Gb | 128Kbyte x 8192 | 2Kbyte | No | 40ºC ~ 85ºC / -40ºC ~ 105ºC | 1G x 8 | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM662QXCACSP1212 | Silicon Motion | Datasheet | - | - | Min: 1 Mult: 1 | Yes | MLC NAND | 512G | Yes | Yes | 3A991.b.1.a | Compliant | 8542.32.00.71 | Serial e-MMC | Ball | 85 | -25 | Surface Mount | 1.2 | 16 | 12 | 169 | Unknown | Yes | BGA | BGA | Commercial | No | Synchronous | Unconfirmed | 169 | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W29N02GVBIAF TR | Winbond Electronics Corporation | Datasheet | 5 |
| Min: 1 Mult: 1 | 28 | No | SLC NAND | 2G | No | Yes | 3A991.b.1.a | Compliant | 8542.32.00.71 | Parallel | 25 | 0.01/Block | 3.6 | 85 | 0.7 | 2.7 | -40 | Surface Mount | 8 | 256M | 0.6(Max) | 11 | 9 | 63 | No | 35 | Yes | 2.7 to 3.6 | VFBGA | Industrial | 2.7V - 3.6V | No | Asynchronous | 3.3 | Active | SLC NAND Flash | 63 | 40MHz | Sectored | High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set | 2Gb | No | 40ºC ~ 85ºC / -40ºC ~ 105ºC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W25Q16FWSSIG TR | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 24 | No | Symmetrical | NOR | 16M | Yes | No | EAR99 | Compliant | 8542.32.00.71 | Serial (SPI, Dual SPI, Quad SPI) | Top|Bottom | 6 | 25/Chip | 1.95 | 85 | 3/Page | 1.65 | -40 | 8 | 2M | 25 | No | 25 | Yes | 1.65 to 1.95 | Industrial | No | Synchronous | 1.8 | Obsolete | Sectored | 4Kbyte x 512 | 256byte | Yes | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM662PEB-BDS | 153-b eMMC 5.1 TLC NAND 32GB i-temp | Silicon Motion | Datasheet | - | - | Min: 1 Mult: 1 | Yes | TLC NAND | 256G | Yes | Yes | EAR99 | Compliant | 8542.32.00.71 | Serial e-MMC | 85 | -40 | Surface Mount | 1.4 | 18 | 14 | 153 | Unknown | Yes | BGA | Industrial | No | Synchronous | Tray | Unconfirmed | 153 | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM662GXD-BDS | 100-b eMMC 5.1 TLC NAND 128GB C-temp | Silicon Motion | Datasheet | 15 |
| Min: 1 Mult: 1 | Yes | TLC NAND | 1T | Yes | Yes | EAR99 | Compliant | 8542.32.00.71 | Serial e-MMC | 85 | -25 | Surface Mount | 1.4 | 18 | 14 | 153 | Unknown | Yes | BGA | Commercial | No | Synchronous | Tray | Obsolete | 153 | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM662PAA-BDS | 153-b eMMC 5.1 TLC NAND 16GB i-temp | Silicon Motion | Datasheet | - | - | Min: 1 Mult: 1 | Yes | TLC NAND | 128G | Yes | Yes | EAR99 | Compliant | 8542.32.00.71 | Serial e-MMC | Surface Mount | 1.4 | 18 | 14 | 153 | Unknown | Yes | BGA | Automotive | No | Synchronous | Tray | Unconfirmed | 153 | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W29N08GZBIBA TR | Winbond Electronics Corporation | Datasheet | 35 |
| Min: 1 Mult: 1 | Surface Mount | 63-VFBGA | 63-VFBGA (9x11) | 31 | Yes | Symmetrical | SLC NAND | 8G | No | Yes | 3A991.b.1.a | Compliant | 8542.32.00.71 | Parallel | 0.01/Block | 1.95 | 85 | 0.7/Page | Non-Volatile | Winbond Electronics | 100000 | 1.7 | -40 | Surface Mount | 8 | 1G | 20 | Tape & Reel (TR) | 0.6(Max) | 11 | 9 | 63 | Unknown | Active | 20 | Yes | 1.7 to 1.95 | VFBGA | Industrial | 1.7V - 1.95V | Yes | Asynchronous | 1.8 | -40°C ~ 85°C (TA) | - | Active | SLC NAND Flash | FLASH - NAND (SLC) | 1.7V ~ 1.95V | 63 | 8Gbit | 40MHz | 25 ns | FLASH | ONFI | High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set | 35ns, 700µs | 8Gb | 2Kbyte | No | 40ºC ~ 85ºC / -40ºC ~ 105ºC | 1G x 8 | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM668GXA-ACS | Silicon Motion | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 100-LBGA | 100-BGA (14x18) | Yes | SLC NAND | 128G | Yes | Yes | EAR99 | Compliant | 8542.32.00.71 | Serial e-MMC | 85 | Non-Volatile | Silicon Motion, Inc. | -25 | Surface Mount | Bulk | 1.4 | 18 | 14 | 153 | Unknown | Active | Yes | BGA | Commercial | No | Synchronous | -25°C ~ 85°C | Tray | Ferri-eMMC® | LTB | FLASH - NAND (SLC) | - | 153 | 128Gbit | FLASH | eMMC | - | No | 16G x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM668GEA-ACS | Silicon Motion | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 100-LBGA | 100-BGA (14x18) | Yes | SM668 | SLC NAND | 128G | Yes | Yes | EAR99 | Compliant | 8542.32.00.71 | Serial e-MMC | 85 | Non-Volatile | Silicon Motion, Inc. | -40 | Surface Mount | Bulk | 1.4 | 18 | 14 | 153 | Unknown | Last Time Buy | Yes | BGA | Industrial | No | Synchronous | -40°C ~ 85°C | Tray | Ferri-eMMC® | LTB | FLASH - NAND (SLC) | - | 153 | 128Gbit | FLASH | eMMC | - | No | 16G x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM662GEA-BDS | 100-b eMMC 5.1 TLC NAND 16GB i-temp | Silicon Motion | Datasheet | 15 |
| Min: 1 Mult: 1 | Yes | TLC NAND | 128G | Yes | Yes | EAR99 | Compliant | 8542.32.00.71 | Serial e-MMC | 85 | -40 | Surface Mount | 1.4 | 18 | 14 | 153 | Unknown | Yes | BGA | Industrial | No | Synchronous | Tray | Unconfirmed | 153 | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM662GXB-BDS | 100-b eMMC 5G1 TLC NAND 32GB C-temp | Silicon Motion | Datasheet | 12 |
| Min: 1 Mult: 1 | Yes | TLC NAND | 256G | Yes | Yes | EAR99 | Compliant | 8542.32.00.71 | Serial e-MMC | 85 | -25 | Surface Mount | 1.4 | 18 | 14 | 153 | Unknown | Yes | BGA | Commercial | No | Synchronous | Tray | Obsolete | 153 | No |
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W25Q128FWEIQ TR
Winbond Electronics Corporation
Package:USB Flash Drives
Price: please inquire
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SM661GXA-AB
Silicon Motion
Package:USB Flash Drives
Price: please inquire
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W25Q80DLUXIE TR
Winbond Electronics Corporation
Package:USB Flash Drives
0.513413
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W29N02GZBIAF
Winbond Electronics Corporation
Package:USB Flash Drives
Price: please inquire
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W25R64FVSSIQ
Winbond Electronics Corporation
Package:USB Flash Drives
Price: please inquire
-
KLMBG2JENB-B0410
Samsung Semiconductor
Package:USB Flash Drives
Price: please inquire
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W25Q32JVXGIM
Winbond Electronics Corporation
Package:USB Flash Drives
Price: please inquire
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W25Q80EWBYIG/REEL
Winbond Electronics Corporation
Package:USB Flash Drives
Price: please inquire
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W29N08GVBIAA TR
Winbond Electronics Corporation
Package:USB Flash Drives
22.296290
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SM662QXCACSP1212
Silicon Motion
Package:USB Flash Drives
Price: please inquire
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W29N02GVBIAF TR
Winbond Electronics Corporation
Package:USB Flash Drives
5.184331
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W25Q16FWSSIG TR
Winbond Electronics Corporation
Package:USB Flash Drives
Price: please inquire
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SM662PEB-BDS | 153-b eMMC 5.1 TLC NAND 32GB i-temp
Silicon Motion
Package:USB Flash Drives
Price: please inquire
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SM662GXD-BDS | 100-b eMMC 5.1 TLC NAND 128GB C-temp
Silicon Motion
Package:USB Flash Drives
7.774932
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SM662PAA-BDS | 153-b eMMC 5.1 TLC NAND 16GB i-temp
Silicon Motion
Package:USB Flash Drives
Price: please inquire
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W29N08GZBIBA TR
Winbond Electronics Corporation
Package:USB Flash Drives
16.304616
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SM668GXA-ACS
Silicon Motion
Package:USB Flash Drives
Price: please inquire
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SM668GEA-ACS
Silicon Motion
Package:USB Flash Drives
Price: please inquire
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SM662GEA-BDS | 100-b eMMC 5.1 TLC NAND 16GB i-temp
Silicon Motion
Package:USB Flash Drives
1.581831
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SM662GXB-BDS | 100-b eMMC 5G1 TLC NAND 32GB C-temp
Silicon Motion
Package:USB Flash Drives
2.127667