The category is 'USB Flash Drives'
USB Flash Drives (1612)
- All Manufacturers
- EU RoHS
- Part Status
- Chip Density (bit)
- Interface Type
- Timing Type
- Automotive
- PPAP
- Typical Operating Supply Voltage (V)
- Maximum Operating Supply Voltage (V)
- Minimum Operating Supply Voltage (V)
- Programmability
- ECCN (US)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Address Bus Width (bit) | Automotive | Block Organization | Cell Type | Chip Density (bit) | Command Compatible | ECC Support | ECCN (US) | EU RoHS | HTS | Interface Type | Lead Shape | Location of Boot Block | Max. Access Time (ns) | Maximum Erase Time (S) | Maximum Operating Frequency (MHz) | Maximum Operating Supply Voltage (V) | Maximum Operating Temperature (°C) | Maximum Page Access Time (ns) | Maximum Programming Time (ms) | Minimum Endurance (Cycles) | Minimum Operating Supply Voltage (V) | Minimum Operating Temperature (°C) | Mounting | Number of Bits/Word (bit) | Number of Words | OE Access Time (ns) | Operating Current (mA) | Package Height | Package Length | Package Width | Page Read Current (mA) | PCB changed | PPAP | Process Technology | Program Current (mA) | Programmability | Programming Voltage (V) | RoHS | Standard Package Name | Supplier Package | Supplier Temperature Grade | Support of Page Mode | Timing Type | Typical Operating Supply Voltage (V) | Packaging | Part Status | Pin Count | Architecture | Sector Size | Page Size | Boot Block |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No W25Q64FVZPIG/TRAY | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 24 | No | Symmetrical | NOR | 64M | Yes | No | 3A991.b.1.a | Compliant | Serial (SPI, Dual SPI, Quad SPI) | No Lead | Bottom|Top | 7 | 100/Chip | 104 | 3.6 | 85 | 3/Page | 100000 | 2.7 | -40 | Surface Mount | 8 | 8M | 20 | 0.73 | 5 | 6 | 8 | No | 25 | Yes | 2.7 to 3.6 | SON | WSON EP | Industrial | No | Synchronous | 3|3.3 | Obsolete | 8 | Sectored | 4Kbyte x 2048 | 256byte | Yes | ||||||||
| Mfr Part No K9F1208U0C-JIB0000 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | Unknown | Compliant | 8542.32.00.71 | Unknown | Obsolete | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W74M64FVSSIQ TUBE | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | No | Symmetrical | 64M | Yes | No | 3A991.b.1.a | Compliant | Serial (SPI, Dual SPI, Quad SPI) | Gull-wing | 7 | 3.6 | 85 | 100000 | 2.7 | -40 | Surface Mount | 8 | 8M | 30 | 1.8 | 5.28 | 5.28 | 8 | No | Yes | SOP | SOIC | Industrial | No | Synchronous | 3|3.3 | Tube | Obsolete | 8 | Sectored | 4Kbyte x 2048 | 256byte | No | |||||||||||||||
| Mfr Part No W29GL032CT7S/TRAY | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 21 | No | Symmetrical | NOR | 32M | Yes | No | 3A991.b.1.a | Parallel | Top | 70 | 64/Chip | 3.6 | 85 | 30 | 56000/Chip | 2.7 | -40 | Surface Mount | 8/16 | 4M/2M | 35 | 55 | 1 | 12 | 18.4 | 25 | 48 | No | 30 | Yes | 2.7 to 3.6 | TSOP | Industrial | Yes | Asynchronous | 3|3.3 | Tape and Reel | Obsolete | 48 | Sectored | 64Kbyte x 64 | 8Words/16byte | Yes | |||||||||
| Mfr Part No K9F1G08U0C-PIB0000 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | 28 | No | Symmetrical | NAND | 1G | No | Yes | 3A991.b.1.a | Compliant | Parallel | 0.01/Block | 3.6 | 125 | 0.7 | 2.7 | -40 | 8 | 128M | 30 | 30 | No | 30 | Yes | Yes | Asynchronous | 3.3 | Obsolete | Sectored | 128Kbyte x 1024 | 2Kbyte | No | ||||||||||||||||||||||
| Mfr Part No W25X20CLZPIG/TUBE | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 24 | No | Symmetrical | NOR | 2M | Yes | No | EAR99 | Compliant | Serial (SPI, Dual SPI) | No Lead | Bottom|Top | 8 | 2/Chip | 3.6 | 85 | 0.8/Page | 2.3 | -40 | Surface Mount | 8 | 256K | 14 | 0.73 | 5 | 6 | 8 | No | 12 | Yes | 2.3 to 3.6 | SON | WSON EP | Industrial | No | Synchronous | 2.5|3|3.3 | Active | 8 | Sectored | 4Kbyte x 64 | 256byte | Yes | ||||||||||
| Mfr Part No AT45DB041D-SSU-2.5 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Compliant | 8542.32.00.71 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No K9GAG08U0D-PCB0000 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | No | Compliant | No | Compliant | Obsolete | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W25Q16DWUUIG/REEL | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 24 | No | Symmetrical | NOR | 16M | Yes | No | EAR99 | Compliant | Serial (SPI, Dual SPI, Quad SPI) | Bottom|Top | 7 | 10/Chip | 1.95 | 85 | 3/Page | 100000 | 1.65 | -40 | Surface Mount | 8 | 2M | 20 | 0.53 | 4 | 3 | 8 | No | 20 | Yes | 1.65 to 1.95 | SON | USON EP | Industrial | No | Synchronous | 1.8 | Obsolete | 8 | Sectored | 4Kbyte x 512 | 256byte | Yes | ||||||||||
| Mfr Part No K9KAG08U0M-PCB0T00 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | No | Compliant | Surface Mount | 20 | 12 | 48 | No | SOP | TSOP-I | Obsolete | 48 | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AT45DB011D-SH-B | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8542.32.00.71 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 4Gbit MLC NAND Flash | MTFC4GACAJCN-1M WT | Micron Technology | Datasheet | - | - | Min: 1 Mult: 1 | No | MLC NAND | 32G | Yes | Yes | 3A991.b.1.a | Compliant | 8542.32.00.71 | Serial e-MMC | 3.6 | 85 | 2.7 | -25 | 1/4/8 | 32G/8G/4G | 50 | No | Yes | No | Synchronous | 3.3 | Tape and Reel|Tray | LTB | Sectored | Yes | ||||||||||||||||||||||||||||
| Mfr Part No W25N01GVTBIT/TRAY | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 32 | No | Symmetrical | SLC NAND | 1G | Yes | Yes | 3A991.b.1.a | Compliant | Serial (SPI, Dual SPI, Quad SPI) | 7 | 0.01/Block | 104 | 3.6 | 85 | 0.7/Page | 100000 | 2.7 | -40 | Surface Mount | 8 | 128M | 35 | 0.85 | 8 | 6 | 24 | No | 35 | Yes | 2.7 to 3.6 | TFBGA | Industrial | Yes | Synchronous | 3|3.3 | Tray | Active | 24 | Sectored | 128Kbyte x 1024 | 2Kbyte | No | ||||||||||
| Mfr Part No W25Q16JVUXIM | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 24 | No | Symmetrical | NOR | 16M | Yes | No | EAR99 | Compliant | Serial (SPI, Dual SPI, Quad SPI) | 6 | 25/Chip | 3.6 | 85 | 3/Page | 100000 | 2.7 | -40 | Surface Mount | 8 | 2M | 25 | 0.53 | 2 | 3 | 8 | No | 25 | Yes | 2.7 to 3.6 | SON | USON EP | Industrial | No | Synchronous | 3|3.3 | Tube | Active | 8 | Sectored | 4Kbyte x 512 | 256byte | No | ||||||||||
| Mfr Part No M25PX16-VMN6TP | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | 1 | No | Symmetrical | NOR | 16M | Yes | No | EAR99 | Compliant | 8542.32.00.71 | Serial-SPI | Gull-wing | 8 | 80/Chip | 75 | 3.6 | 85 | 5/Page | 2.3 | -40 | Surface Mount | 8 | 2M | 12 | 1.5(Max) | 4.9 | 3.9 | 8 | No | 110nm | 15 | Yes | 2.3 to 3.6 | SOP | SOIC N | Industrial | No | Synchronous | 2.5|3|3.3 | Tape and Reel | Obsolete | 8 | Sectored | 64Kbyte x 32 | 256byte | No | |||||||
| Mfr Part No W25Q64JVZEIM/TUBE | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 24 | No | Symmetrical | NOR | 64M | Yes | No | 3A991.b.1.a | Compliant | Serial (SPI, Dual SPI, Quad SPI) | 6 | 100/Chip | 133 | 3.6 | 85 | 3/Page | 100000 | 2.7 | -40 | Surface Mount | 8 | 8M | 25 | 0.73 | 6 | 8 | 8 | No | 58nm | 25 | Yes | 2.7 to 3.6 | WSON EP | Industrial | No | Synchronous | 3.3|3 | Tube|Tray|Tape and Reel | Active | 8 | Sectored | 4Kbyte x 2048 | 256byte | No | |||||||||
| Mfr Part No W29N02GVBIAA/TRAY | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 29 | Yes | Symmetrical | SLC NAND | 2G | No | Yes | 3A991.b.1.a | Compliant | Parallel | Ball | 25 | 0.01/Block | 3.6 | 85 | 0.7/Page | 100000 | 2.7 | -40 | Surface Mount | 8 | 256M | 35 | 0.6(Max) | 11 | 9 | 63 | Unknown | 35 | Yes | 2.7 to 3.6 | BGA | VFBGA | Industrial | Yes | Asynchronous | 3|3.3 | Active | 63 | Sectored | 128Kbyte x 2048 | 2Kbyte | No | ||||||||||
| Mfr Part No KLM8G1GESD-B03QT17 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | No | 64G | No | No | 3A991.b.1.a | Supplier Unconfirmed | 8542.32.00.71 | Serial e-MMC | 105 | -40 | Surface Mount | 0.8 | 13 | 11.5 | 153 | No | Yes | FBGA | No | Synchronous | 1.8|3.3 | Obsolete | 153 | No | |||||||||||||||||||||||||||||
| Mfr Part No W25Q64JVSSIQ/REEL | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 24 | No | Symmetrical | NOR | 64M | Yes | No | 3A991.b.1.a | Compliant | 8542.32.00.71 | Serial (SPI, Dual SPI, Quad SPI) | Gull-wing | 6 | 100/Chip | 133 | 3.6 | 85 | 3/Page | 100000 | 2.7 | -40 | Surface Mount | 8 | 8M | 25 | 1.8 | 5.28 | 5.28 | 8 | No | 58nm | 25 | Yes | 2.7 to 3.6 | SOP | SOIC | Industrial | No | Synchronous | 3|3.3 | Tube | Active | 8 | Sectored | 4Kbyte x 2048 | 256byte | No | ||||||
| Mfr Part No W25Q64JVZEIQ TUBE | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 24 | No | Symmetrical | NOR | 64M | Yes | No | 3A991.b.1.a | Compliant | Serial (SPI, Dual SPI, Quad SPI) | 6 | 100/Chip | 133 | 3.6 | 85 | 3/Page | 100000 | 2.7 | -40 | Surface Mount | 8 | 8M | 25 | 0.73 | 6 | 8 | 8 | No | 58nm | 25 | Yes | 2.7 to 3.6 | WSON EP | Industrial | No | Synchronous | 3.3|3 | Active | 8 | Sectored | 4Kbyte x 2048 | 256byte | No |
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W25Q64FVZPIG/TRAY
Winbond Electronics Corporation
Package:USB Flash Drives
Price: please inquire
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K9F1208U0C-JIB0000
Samsung Semiconductor
Package:USB Flash Drives
Price: please inquire
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W74M64FVSSIQ TUBE
Winbond Electronics Corporation
Package:USB Flash Drives
Price: please inquire
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W29GL032CT7S/TRAY
Winbond Electronics Corporation
Package:USB Flash Drives
Price: please inquire
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K9F1G08U0C-PIB0000
Samsung Semiconductor
Package:USB Flash Drives
Price: please inquire
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W25X20CLZPIG/TUBE
Winbond Electronics Corporation
Package:USB Flash Drives
Price: please inquire
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AT45DB041D-SSU-2.5
Microchip Technology
Package:USB Flash Drives
Price: please inquire
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K9GAG08U0D-PCB0000
Samsung Semiconductor
Package:USB Flash Drives
Price: please inquire
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W25Q16DWUUIG/REEL
Winbond Electronics Corporation
Package:USB Flash Drives
Price: please inquire
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K9KAG08U0M-PCB0T00
Samsung Semiconductor
Package:USB Flash Drives
Price: please inquire
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AT45DB011D-SH-B
Microchip Technology
Package:USB Flash Drives
Price: please inquire
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4Gbit MLC NAND Flash | MTFC4GACAJCN-1M WT
Micron Technology
Package:USB Flash Drives
Price: please inquire
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W25N01GVTBIT/TRAY
Winbond Electronics Corporation
Package:USB Flash Drives
Price: please inquire
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W25Q16JVUXIM
Winbond Electronics Corporation
Package:USB Flash Drives
Price: please inquire
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M25PX16-VMN6TP
STMicroelectronics
Package:USB Flash Drives
Price: please inquire
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W25Q64JVZEIM/TUBE
Winbond Electronics Corporation
Package:USB Flash Drives
Price: please inquire
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W29N02GVBIAA/TRAY
Winbond Electronics Corporation
Package:USB Flash Drives
Price: please inquire
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KLM8G1GESD-B03QT17
Samsung Semiconductor
Package:USB Flash Drives
Price: please inquire
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W25Q64JVSSIQ/REEL
Winbond Electronics Corporation
Package:USB Flash Drives
Price: please inquire
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W25Q64JVZEIQ TUBE
Winbond Electronics Corporation
Package:USB Flash Drives
Price: please inquire