The category is 'Memory - Modules'
Memory - Modules (1566)
- All Manufacturers
- ECCN Code
- HTS Code
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
- Memory Width
- Terminal Position
- Organization
- Memory IC Type
- Terminal Form
- Memory Density
- Surface Mount
- ECCN Code:
EAR99
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mount | Mounting type | Package / Case | Surface Mount | Number of Pins | Housing material | Number of Terminals | Access Time-Max | Automotive | Cable external diameter | Cable features | Cable structure | CAS Latency | Chip Configuration | Chip Density (bit) | Chip Package Type | Clock Frequency-Max (fCLK) | Compatibility | Conductor diameter (cross section) | Core marking | Core structure | Data Bus Width (bit) | Dielectric strength | Earth core | ECC Support | EU RoHS | Gross weight | HTS | Ihs Manufacturer | Kind of core | Manufacturer | Manufacturer Part Number | Max. Access Time (ns) | Maximum Clock Rate (MHz) | Maximum Operating Supply Voltage (V) | Maximum Operating Temperature (°C) | Memory Types | Minimum Operating Supply Voltage (V) | Minimum Operating Temperature (°C) | Module | Module Density | Module Sides | Moisture Sensitivity Levels | Mounting | Mounting method | Number of Elements | Number of Chip Banks | Number of Chip per Module | Number of Ranks | Number of terals | Number of Words | Number of Words Code | Operating Current (mA) | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package contents | Package Description | Package Equivalence Code | Package Height | Package Length | Package Shape | Package Style | Package Width | Part Life Cycle Code | Part Package Code | PCB changed | PPAP | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Shield structure | SPD EEPROM Support | Supplier Package | Supplier Temperature Grade | Supply Voltage-Nom (Vsup) | Type of wire | Typical Operating Supply Voltage (V) | Version | Wire insulation material | Operating temperature | Published | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Connector type | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Color | Additional Feature | HTS Code | Subcategory | Pitch | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Depth | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Number of contacts | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Contact resistance | Temperature Grade | Supply Voltage-Min (Vsup) | Insulation resistance | Max Supply Voltage | Min Supply Voltage | Memory Size | Number of Ports | Speed | Operating Mode | Supply Current-Max | Data Bus Width | Organization | Output Characteristics | Seated Height-Max | Memory Width | Operating temperature range | Standby Current-Max | Rated current | Memory Density | Max Frequency | PLL | Parallel/Serial | I/O Type | Wire cross section | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Protection | Rated voltage | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of cores | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Refresh Cycles | Common Flash Interface | Core diameter | Access Mode | Connector pitch | Saturation Current | Self Refresh | Module Type | Height | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No MT8KTF25664HZ-1G6K1 | Micron Technology Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | Socket | 204-SODIMM | 204 | DDR3L SDRAM | 8 | 2014 | Obsolete | 1 (Unlimited) | 204 | EAR99 | 70°C | 0°C | AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V SUPPLY; WD-MAX | ZIG-ZAG | NO LEAD | 1 | 1.35V | 0.6mm | Not Qualified | 1.35V | COMMERCIAL | 1.45V | 1.283V | 2GB | 1 | 1600MT/s | SYNCHRONOUS | 64b | 256MX64 | 3-STATE | 64 | 0.096A | 1.6GHz | COMMON | SINGLE BANK PAGE BURST | 30.15mm | 67.6mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M378B5173EB0-CK0 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 240 | 0.1 ns | No | Compliant | SAMSUNG SEMICONDUCTOR INC | Samsung Semiconductor | M378B5173EB0-CK0 | Socket | 536870912 words | 512000000 | UNSPECIFIED | DIMM | DIMM, | 30 | 133.35 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | 4(Max) | Active | 240 | No | 5.74 | Yes | UDIMM | 1.5 V | Obsolete | EAR99 | AUTO/SELF REFRESH; WD-MAX | CMOS | DUAL | NO LEAD | 1 | 1 mm | compliant | 240 | R-XDMA-N240 | 1.575 V | 1.425 V | 1 | SYNCHRONOUS | 512MX64 | 30.15 mm | 64 | 34359738368 bit | DDR DRAM MODULE | SINGLE BANK PAGE BURST | YES | 133.35 mm | 2.7 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M378B1G73EB0-CK0 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 240 | 0.1 ns | No | Compliant | SAMSUNG SEMICONDUCTOR INC | Samsung Semiconductor | M378B1G73EB0-CK0 | Socket | 1073741824 words | 1000000000 | UNSPECIFIED | DIMM | DIMM, | 30 | 133.35 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | 4(Max) | Active | 240 | No | 5.74 | Yes | UDIMM | 1.5 V | Unconfirmed | EAR99 | AUTO/SELF REFRESH; WD-MAX | CMOS | DUAL | NO LEAD | 1 | 1 mm | compliant | 240 | R-XDMA-N240 | 1.575 V | 1.425 V | 1 | SYNCHRONOUS | 1GX64 | 30.15 mm | 64 | 68719476736 bit | DDR DRAM MODULE | DUAL BANK PAGE BURST | YES | 133.35 mm | 4 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M393A1G40DB0-CPB | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 288 | No | 15 | 1Gx4 | 4G | 78FBGA | 72 | Yes | Compliant | 8473.30.11.40 | SAMSUNG SEMICONDUCTOR INC | Samsung Semiconductor | M393A1G40DB0-CPB | 0.18 | 2133 | 1.26 | 85 | 1.14 | 0 | DRAM Module | 8Gbyte | Double | Socket | 16 | 18 | Single | 1073741824 words | 1000000000 | 2240 | UNSPECIFIED | DIMM | DIMM, | 31.25 | 133.35 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | 4.3(Max) | Active | 288 | No | NOT SPECIFIED | 5.38 | Yes | No | RDIMM | Commercial | 1.2 V | 1.2 | Obsolete | EAR99 | AUTO/SELF REFRESH; WD-MAX | CMOS | DUAL | NO LEAD | NOT SPECIFIED | 1 | 0.85 mm | compliant | 288 | R-XDMA-N288 | 1.26 V | 1.14 V | 1 | SYNCHRONOUS | 1Gx72 | 31.4 mm | 72 | 77309411328 bit | No | DDR DRAM MODULE | SINGLE BANK PAGE BURST | Yes | 288RDIMM | 133.35 mm | 3.9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No HYS72T128420HFA-3S-B | SK HYNIX INC | Datasheet | - | - | Min: 1 Mult: 1 | NO | 240 | 333 MHz | QIMONDA AG | Qimonda AG | HYS72T128420HFA-3S-B | 3 | 134217728 words | 128000000 | 95 °C | UNSPECIFIED | DIMM | DIMM, DIMM240,40 | DIMM240,40 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Obsolete | DIMM | 40 | 5.8 | Yes | 1.8 V | e4 | EAR99 | Gold (Au) | AUTO/SELF REFRESH | 8542.32.00.36 | Other Memory ICs | CMOS | DUAL | NO LEAD | 260 | 1 | 1 mm | unknown | 240 | R-XDMA-N240 | Not Qualified | 1.9 V | 1.5,1.8 V | OTHER | 1.7 V | 1 | SYNCHRONOUS | 5.34 mA | 128MX72 | 3-STATE | 72 | 9663676416 bit | COMMON | DDR DRAM MODULE | 8192 | DUAL BANK PAGE BURST | YES | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EN25T16A-75QIP | Elite Semiconductor Memory Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | 75 MHz | ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Contact Manufacturer | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T8 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 2MX8 | 5.334 mm | 8 | 16777216 bit | SERIAL | FLASH | 2.7 V | 9.271 mm | 7.62 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No SST39VF1601-70-4I-B3KE | Silicon Storage Technology | Datasheet | 458 | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | SILICON STORAGE TECHNOLOGY INC | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | 6 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, MO-210AB-1, TFBGA-48 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Transferred | BGA | Yes | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.035 mA | 1MX16 | 1.2 mm | 16 | 0.00002 A | 16777216 bit | PARALLEL | FLASH | 2.7 V | YES | YES | YES | 512 | 2K | BOTTOM | YES | 8 mm | 6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SST39VF6401B-70-4I-B1KE | Silicon Storage Technology | Datasheet | 1624 | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | SILICON STORAGE TECHNOLOGY INC | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, MO-210, TFBGA-48 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 3 V | e1 | EAR99 | NOR TYPE | TIN SILVER COPPER | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 10 | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.035 mA | 4MX16 | 1.2 mm | 16 | 0.00002 A | 67108864 bit | PARALLEL | FLASH | 2.7 V | YES | YES | YES | 2K | 2K | BOTTOM | YES | 10 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL256P10FFI013 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 100 ns | ADVANCED MICRO DEVICES INC | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA64,8X8,40 | SQUARE | GRID ARRAY | Transferred | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | 1 | 1 mm | unknown | S-PBGA-B64 | Not Qualified | INDUSTRIAL | ASYNCHRONOUS | 0.08 mA | 16MX16 | 3-STATE | 16 | 0.000005 A | 268435456 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 256 | 128K | 8/16 words | YES | YES | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M29W160ET70N6 | Numonyx Memory Solutions | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | NUMONYX | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | 12 X 20 MM, PLASTIC, TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | TSOP | No | 3 V | EAR99 | NOR TYPE | TOP BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 1MX16 | 1.2 mm | 16 | 0.0001 A | 16777216 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 1,2,1,31 | 16K,8K,32K,64K | YES | TOP | YES | 18.4 mm | 12 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PM49FL004T-33JCE | Programmable Microelectronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 120 ns | PROGRAMMABLE MICROELECTRONICS CORP | 524288 words | 512000 | 85 °C | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Transferred | Yes | 3.3 V | EAR99 | NOR TYPE | 8542.32.00.51 | QUAD | J BEND | 1.27 mm | unknown | R-PQCC-J32 | Not Qualified | OTHER | 0.02 mA | 512KX8 | 8 | 0.0005 A | 4194304 bit | PARALLEL | FLASH | YES | YES | YES | 128 | 4K | TOP | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No RC28F128J3F75 | Micron Technology Inc | Datasheet | 320 | - | Min: 1 Mult: 1 | YES | 64 | 75 ns | MICRON TECHNOLOGY INC | 1 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | BGA-64 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Obsolete | BGA | No | 3 V | e0 | No | EAR99 | NOR TYPE | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.32.00.51 | BOTTOM | BALL | 235 | 1 | 1 mm | unknown | 30 | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.054 mA | 8MX16 | 1.2 mm | 16 | 0.00012 A | 134217728 bit | PARALLEL | FLASH | 2.7 V | 8 | NO | NO | YES | 128 | 128K | 4/8 words | YES | YES | 13 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 27C512-15FA | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 150 ns | NXP SEMICONDUCTORS | 65536 words | 64000 | 70 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP-28 | RECTANGULAR | IN-LINE | Obsolete | 5 V | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | unknown | R-CDIP-T28 | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.015 mA | 64KX8 | 8 | 524288 bit | PARALLEL | UVPROM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PM25LV010-33SCE | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 33 MHz | INTEGRATED SILICON SOLUTION INC | 131072 words | 128000 | 85 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Active | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 1.27 mm | compliant | R-PDSO-G8 | Not Qualified | OTHER | 0.03 mA | 128KX8 | 8 | 0.00005 A | 1048576 bit | SERIAL | FLASH | SPI | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M29W128GL70ZA6E | STMicroelectronics | Datasheet | 1811 | - | Min: 1 Mult: 1 | YES | 64 | 70 ns | STMICROELECTRONICS | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | 10 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, TBGA-64 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Transferred | BGA | Yes | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 40 | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 8MX16 | 1.2 mm | 16 | 0.0001 A | 134217728 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 128 | 128K | 8/16 words | YES | YES | 13 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL064A10FAIR30 | Spansion | Datasheet | 1531 | - | Min: 1 Mult: 1 | YES | 64 | 100 ns | SPANSION INC | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | 13 X 11 MM, FBGA-64 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | BGA | No | 3.3 V | e0 | No | EAR99 | NOR TYPE | TIN LEAD | ALSO CONFIGURABLE 8M X 8 | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | not_compliant | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 4MX16 | 1.4 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 8,127 | 8K,64K | 4/8 words | YES | TOP | YES | 3 | 13 mm | 11 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL064A10FAIR30 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 100 ns | 6.4mm | twisted pair conductors | 12x2x28AWG | colours without colour repetition | stranded | none | 2525.8 g | CYPRESS SEMICONDUCTOR CORP | Cu | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | 30.5m | 13 X 11 MM, FBGA-64 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | No | Al-PET foil, | 3.3 V | data transmission | Splice Free | PVC | max. 75°C | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B64 | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 4MX16 | 1.4 mm | 16 | 67108864 bit | PARALLEL | FLASH | 3 V | 50V | 8 | 24 | TOP | 28AWG | 3 | 13 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No N28F020-120 | Intel Corporation | Datasheet | 391 | - | Min: 1 Mult: 1 | YES | 32 | 120 ns | INTEL CORP | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | QCCJ | 0.450 X 0.550 INCH, PLASTIC, LCC-32 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | No | 5 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 100000 ERASE/PROGRAM CYCLES | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.03 mA | 256KX8 | 3.55 mm | 8 | 0.0001 A | 2097152 bit | PARALLEL | FLASH | 12 V | 100000 Write/Erase Cycles | NO | NO | YES | 13.97 mm | 11.43 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M25P16-VMN6 | STMicroelectronics | Datasheet | 3445 | - | Min: 1 Mult: 1 | YES | PA66 UL94V-0 | 8 | 50 MHz | 2.5 sq. mm (24-12 AWG) | 2000 V (50 Hz)/ 1 min. | STMICROELECTRONICS | on board, soldering | 3min | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | 0.150 INCH, SOP-8 | RECTANGULAR | SMALL OUTLINE | Obsolete | No | e0 | EAR99 | Screw modular terminal block, 45° angled, on board, 3 contacts, series RG103-5.0 | TIN LEAD | green | 8542.32.00.51 | 5.0 mm | DUAL | GULL WING | 1 | 13.4 mm | compliant | R-PDSO-G8 | 3.6 V | ≤20 mΩ | INDUSTRIAL | 2.7 V | ≥5000 MΩ (at Uinsp.dc=1000 V) | SYNCHRONOUS | 2MX8 | 8 | -40…+105 °C | 10 A | 16777216 bit | SERIAL | 2.5 sq. mm | FLASH | 2.7 V | 300 V | 15.5 mm | 15.0 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M25P16-VME6 | Numonyx Memory Solutions | Datasheet | - | - | Min: 1 Mult: 1 | PCB mount | YES | PA66 UL94V-0, green | 8 | 50 MHz | 3.81mm: 15ERGK-3.81-03P; 15ERGKC-3.81-03P; 15ERGKA-3.81-03P; 15ERGKB-3.81-03P; 15ERGA-3.81-03P; 15ERGB-3.81-03P | 2000 V (50 Hz)/ 1 min. | NUMONYX | 2097152 words | 2000000 | 85 °C | -40 °C | UNSPECIFIED | HVSON | HVSON, | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | DFP | 3 V | e0 | EAR99 | Disconnect terminal block for PCB, right angle (R), 3 contacts, series 15ERGRC-3.81, plug (M) | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | NO LEAD | 1 | 1.27 mm | 9.2 mm | unknown | 8 | R-XDSO-N8 | Not Qualified | 3 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 2MX8 | 1 mm | 8 | -40…+105 °C | 8 A | 16777216 bit | SERIAL | FLASH | 2.7 V | 300 V | 3.81 mm | 7.2 mm | 8 mm | 6 mm |
-
MT8KTF25664HZ-1G6K1
Micron Technology Inc.
Package:Memory - Modules
Price: please inquire
-
M378B5173EB0-CK0
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire
-
M378B1G73EB0-CK0
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire
-
M393A1G40DB0-CPB
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire
-
HYS72T128420HFA-3S-B
SK HYNIX INC
Package:Memory - Modules
Price: please inquire
-
EN25T16A-75QIP
Elite Semiconductor Memory Technology Inc
Package:Memory - Modules
Price: please inquire
-
SST39VF1601-70-4I-B3KE
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
-
SST39VF6401B-70-4I-B1KE
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
-
S29GL256P10FFI013
AMD
Package:Memory - Modules
Price: please inquire
-
M29W160ET70N6
Numonyx Memory Solutions
Package:Memory - Modules
Price: please inquire
-
PM49FL004T-33JCE
Programmable Microelectronics Corp
Package:Memory - Modules
Price: please inquire
-
RC28F128J3F75
Micron Technology Inc
Package:Memory - Modules
Price: please inquire
-
27C512-15FA
NXP Semiconductors
Package:Memory - Modules
Price: please inquire
-
PM25LV010-33SCE
Integrated Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
-
M29W128GL70ZA6E
STMicroelectronics
Package:Memory - Modules
Price: please inquire
-
S29GL064A10FAIR30
Spansion
Package:Memory - Modules
Price: please inquire
-
S29GL064A10FAIR30
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
-
N28F020-120
Intel Corporation
Package:Memory - Modules
Price: please inquire
-
M25P16-VMN6
STMicroelectronics
Package:Memory - Modules
Price: please inquire
-
M25P16-VME6
Numonyx Memory Solutions
Package:Memory - Modules
Price: please inquire