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Memory - Modules (40)

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Access Time-Max
Ihs Manufacturer
JESD-30 Code
Memory Density
Memory IC Type
Memory Width
Number of Terminals
Number of Words
Number of Words Code
Operating Temperature-Max
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Supply Current-Max

Supply Current-Max:
0.07 mA

Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Surface Mount	Number of Terminals	Access Time-Max	Ihs Manufacturer	Moisture Sensitivity Levels	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Rohs Code	Supply Voltage-Nom (Vsup)	JESD-609 Code	Pbfree Code	ECCN Code	Type	Terminal Finish	Additional Feature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Supply Voltage-Max (Vsup)	Temperature Grade	Supply Voltage-Min (Vsup)	Operating Mode	Supply Current-Max	Organization	Output Characteristics	Seated Height-Max	Memory Width	Standby Current-Max	Memory Density	Parallel/Serial	I/O Type	Memory IC Type	Programming Voltage	Endurance	Write Cycle Time-Max (tWC)	Alternate Memory Width	Data Polling	Toggle Bit	Command User Interface	Number of Sectors/Size	Sector Size	Page Size	Ready/Busy	Boot Block	Common Flash Interface	Length	Width
Mfr Part No RC28F128J3F75	Alliance Memory Inc	Datasheet	-	-	Min: 1 Mult: 1	YES	64	75 ns	ALLIANCE MEMORY INC		134217728 words	128000000	85 °C	-40 °C	PLASTIC/EPOXY	TBGA	FBGA-64	BGA64,8X8,40	RECTANGULAR	GRID ARRAY, THIN PROFILE	Active			3 V				NOR TYPE				BOTTOM	BALL		1	1 mm	unknown			R-PBGA-B64		3.6 V		2.7 V	ASYNCHRONOUS	0.07 mA	128MX1	OPEN-DRAIN	1.2 mm	1	0.002 A	134217728 bit	PARALLEL		FLASH	3 V	100000 Write/Erase Cycles	0.000075 ms		YES	NO	NO	128	64K		YES		YES	13 mm	10 mm
Mfr Part No S29GL256N10FFIV20	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	64	100 ns	SPANSION INC	3	16777216 words	16000000	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	13 X 11 MM, 1MM PITCH, LEAD FREE, FBGA-64	BGA64,8X8,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Obsolete	BGA	Yes	3 V	e1		EAR99	NOR TYPE	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		8542.32.00.51	BOTTOM	BALL	260	1	1 mm	compliant	40	64	R-PBGA-B64	Not Qualified	3.6 V	INDUSTRIAL	2.7 V	ASYNCHRONOUS	0.07 mA	16MX16	3-STATE	1.4 mm	16	0.000005 A	268435456 bit	PARALLEL		FLASH	3 V			8	YES	YES	YES	256	128K	8/16 words	YES		YES	13 mm	11 mm
Mfr Part No S29GL256N10FFIV20	AMD	Datasheet	-	-	Min: 1 Mult: 1	YES	64	100 ns	ADVANCED MICRO DEVICES INC		16777216 words	16000000	85 °C	-40 °C	PLASTIC/EPOXY	BGA		BGA64,8X8,40	SQUARE	GRID ARRAY	Transferred		Yes				EAR99	NOR TYPE			8542.32.00.51	BOTTOM	BALL		1	1 mm	unknown			S-PBGA-B64	Not Qualified		INDUSTRIAL		ASYNCHRONOUS	0.07 mA	16MX16	3-STATE		16	0.000005 A	268435456 bit	PARALLEL		FLASH				8	YES	YES	YES	256	128K	8/16 words	YES		YES
Mfr Part No TC58FVM6B2AFT65	Toshiba America Electronic Components	Datasheet	-	-	Min: 1 Mult: 1	YES	48	75 ns	TOSHIBA CORP		4194304 words	4000000	85 °C	-40 °C	PLASTIC/EPOXY	TSOP1	12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48	TSSOP48,.8,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSOP1	No	3 V			EAR99	NOR TYPE			8542.32.00.51	DUAL	GULL WING	NOT SPECIFIED	1	0.5 mm	unknown	NOT SPECIFIED	48	R-PDSO-G48	Not Qualified	3.6 V	INDUSTRIAL	2.3 V	ASYNCHRONOUS	0.07 mA	4MX16		1.2 mm	16	0.00001 A	67108864 bit	PARALLEL		FLASH	3 V			8	YES	YES	YES	8,127	8K,64K	8/16 words	YES	BOTTOM	YES	18.4 mm	12 mm
Mfr Part No S29PL127J60BFI00	Cypress Semiconductor	Datasheet	-	-	Min: 1 Mult: 1	YES	80	60 ns	CYPRESS SEMICONDUCTOR CORP	3	8388608 words	8000000	85 °C	-40 °C	PLASTIC/EPOXY	VFBGA	8 X 11 MM, LEAD FREE, FBGA-80	BGA80,8X12,32	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Transferred		Yes	3 V	e1		EAR99	NOR TYPE	TIN SILVER COPPER	TOP AND BOTTOM BOOT BLOCK	8542.32.00.51	BOTTOM	BALL	260	1	0.8 mm	compliant	40		R-PBGA-B80	Not Qualified	3.6 V	INDUSTRIAL	2.7 V	SYNCHRONOUS	0.07 mA	8MX16		1 mm	16	0.000005 A	134217728 bit	PARALLEL		FLASH	3 V				YES	YES	YES	16,254	4K,32K	8 words	YES	BOTTOM/TOP	YES	11 mm	8 mm
Mfr Part No S29PL127J60TFI13	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	56	60 ns	SPANSION INC	3	8388608 words	8000000	85 °C	-40 °C	PLASTIC/EPOXY	TSOP1	20 X 14 MM, LEAD FREE, TSOP-56	TSSOP56,.8,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Transferred	TSOP	Yes	3 V	e3	Yes	EAR99	NOR TYPE	MATTE TIN		8542.32.00.51	DUAL	GULL WING	260	1	0.5 mm	unknown	40	56	R-PDSO-G56	Not Qualified	3.6 V	INDUSTRIAL	2.7 V	ASYNCHRONOUS	0.07 mA	8MX16		1.2 mm	16	0.000005 A	134217728 bit	PARALLEL		FLASH	3 V				YES	YES	YES	16,254	4K,32K	8 words	YES	BOTTOM/TOP	YES	18.4 mm	14 mm
Mfr Part No M27C800-120M1	STMicroelectronics	Datasheet	-	-	Min: 1 Mult: 1	YES	44	120 ns	STMICROELECTRONICS		524288 words	512000	70 °C		PLASTIC/EPOXY	SOP	0.525 INCH, PLASTIC, SO-44	SOP44,.63	RECTANGULAR	SMALL OUTLINE	Obsolete	SOIC	Yes	5 V	e3		EAR99		MATTE TIN		8542.32.00.71	DUAL	GULL WING		1	1.27 mm	compliant		44	R-PDSO-G44	Not Qualified	5.5 V	COMMERCIAL	4.5 V	ASYNCHRONOUS	0.07 mA	512KX16	3-STATE	2.62 mm	16	0.00005 A	8388608 bit	PARALLEL	COMMON	OTP ROM				8										28.2 mm	13.3 mm
Mfr Part No S29GL128N90FFI010	AMD	Datasheet	-	-	Min: 1 Mult: 1	YES	64	90 ns	ADVANCED MICRO DEVICES INC		8388608 words	8000000	85 °C	-40 °C	PLASTIC/EPOXY	BGA		BGA64,8X8,40	SQUARE	GRID ARRAY	Transferred		Yes				EAR99	NOR TYPE			8542.32.00.51	BOTTOM	BALL			1 mm	unknown			S-PBGA-B64	Not Qualified		INDUSTRIAL			0.07 mA	8MX16			16	0.000005 A	134217728 bit	PARALLEL		FLASH				8	YES	YES	YES	128	128K	8/16 words	YES		YES
Mfr Part No S29GL128N90FFI010	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	64	90 ns	SPANSION INC	3	8388608 words	8000000	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	13 X 11 MM, 1MM PITCH, LEAD FREE, FBGA-64	BGA64,8X8,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Obsolete	BGA	Yes	3 V	e1		EAR99	NOR TYPE	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		8542.32.00.51	BOTTOM	BALL	260	1	1 mm	compliant	40	64	R-PBGA-B64	Not Qualified	3.6 V	INDUSTRIAL	2.7 V	ASYNCHRONOUS	0.07 mA	8MX16		1.4 mm	16	0.000005 A	134217728 bit	PARALLEL		FLASH	3 V			8	YES	YES	YES	128	128K	8/16 words	YES		YES	13 mm	11 mm
Mfr Part No S29PL127J70BAW02	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	80	70 ns	SPANSION INC	3	8388608 words	8000000	85 °C	-25 °C	PLASTIC/EPOXY	VFBGA	VFBGA, BGA64,10X12,32	BGA64,10X12,32	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Transferred	BGA	Yes	3 V	e1	Yes	EAR99	NOR TYPE	TIN SILVER COPPER	TOP AND BOTTOM BOOT BLOCK	8542.32.00.51	BOTTOM	BALL		1	0.8 mm	compliant		80	R-PBGA-B80	Not Qualified	3.6 V	OTHER	2.7 V	SYNCHRONOUS	0.07 mA	8MX16		1 mm	16	0.000005 A	134217728 bit	PARALLEL		FLASH	3 V				YES	YES	YES	16,254	4K,32K	8 words	YES	BOTTOM/TOP	YES	11 mm	8 mm
Mfr Part No S29GL256N10FFIV10	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	64	100 ns	SPANSION INC	3	16777216 words	16000000	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	13 X 11 MM, 1MM PITCH, LEAD FREE, FBGA-64	BGA64,8X8,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Obsolete	BGA	Yes	3 V	e1	Yes	EAR99	NOR TYPE	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		8542.32.00.51	BOTTOM	BALL	260	1	1 mm	compliant	40	64	R-PBGA-B64	Not Qualified	3.6 V	INDUSTRIAL	2.7 V	ASYNCHRONOUS	0.07 mA	16MX16	3-STATE	1.4 mm	16	0.000005 A	268435456 bit	PARALLEL		FLASH	3 V			8	YES	YES	YES	256	128K	8/16 words	YES		YES	13 mm	11 mm
Mfr Part No S29GL256N10TFIV10	AMD	Datasheet	-	-	Min: 1 Mult: 1	YES	56	100 ns	ADVANCED MICRO DEVICES INC		16777216 words	16000000	85 °C	-40 °C	PLASTIC/EPOXY	TSSOP	TSSOP, TSSOP56,.8,20	TSSOP56,.8,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	Transferred		Yes				EAR99	NOR TYPE			8542.32.00.51	DUAL	GULL WING		1	0.5 mm	unknown			R-PDSO-G56	Not Qualified		INDUSTRIAL		ASYNCHRONOUS	0.07 mA	16MX16	3-STATE		16	0.000005 A	268435456 bit	PARALLEL		FLASH				8	YES	YES	YES	256	128K	8/16 words	YES		YES
Mfr Part No S29PL032J55BFI12	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	48	55 ns	SPANSION INC	3	2097152 words	2000000	85 °C	-40 °C	PLASTIC/EPOXY	VFBGA	8.15 X 6.15 MM, FBGA-48	BGA48,6X8,32	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Transferred	BGA	Yes	3 V	e1	Yes	EAR99	NOR TYPE	TIN SILVER COPPER		8542.32.00.51	BOTTOM	BALL	260	1	0.8 mm	unknown	40	48	R-PBGA-B48	Not Qualified	3.6 V	INDUSTRIAL	2.7 V	ASYNCHRONOUS	0.07 mA	2MX16		1 mm	16	0.000005 A	33554432 bit	PARALLEL		FLASH	3 V				YES	YES	YES	16,62	4K,32K	8 words	YES	BOTTOM/TOP	YES	8.15 mm	6.15 mm
Mfr Part No S29GL512N90TFI020	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	56	90 ns	SPANSION INC	3	33554432 words	32000000	85 °C	-40 °C	PLASTIC/EPOXY	TSOP1	TSOP1, TSSOP56,.8,20	TSSOP56,.8,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSOP1	Yes	3 V	e3		EAR99	NOR TYPE	Matte Tin (Sn)		8542.32.00.51	DUAL	GULL WING	260	1	0.5 mm	compliant	40	56	R-PDSO-G56	Not Qualified	3.6 V	INDUSTRIAL	2.7 V	ASYNCHRONOUS	0.07 mA	32MX16		1.2 mm	16	0.000005 A	536870912 bit	PARALLEL		FLASH	3 V			8	YES	YES	YES	512	128K	8/16 words	YES		YES	18.4 mm	14 mm
Mfr Part No TE28F200B5B80	Intel Corporation	Datasheet	-	-	Min: 1 Mult: 1	YES	48	80 ns	INTEL CORP		262144 words	256000	85 °C	-40 °C	PLASTIC/EPOXY	TSOP1	12 X 20 MM, TSOP-48	TSSOP48,.8,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSOP	No	5 V	e0		EAR99	NOR TYPE	TIN LEAD	CONFG AS 128K X 16; USER SELECTABLE AS 5V OR 12V VPP; BOTTOM BOOT BLOCK	8542.32.00.51	DUAL	GULL WING		1	0.5 mm	compliant		48	R-PDSO-G48	Not Qualified	5.5 V	INDUSTRIAL	4.5 V	ASYNCHRONOUS	0.07 mA	256KX8		1.2 mm	8	0.000008 A	2097152 bit	PARALLEL		FLASH	5 V			8	NO	NO	YES	1,2,1,1	16K,8K,96K,128K			BOTTOM		18.4 mm	12 mm
Mfr Part No S29PL064J55BFI12	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	48	55 ns	SPANSION INC	3	4194304 words	4000000	85 °C	-40 °C	PLASTIC/EPOXY	VFBGA	VFBGA, BGA48,6X8,32	BGA48,6X8,32	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Transferred	BGA	Yes	3 V	e1	Yes	EAR99	NOR TYPE	TIN SILVER COPPER		8542.32.00.51	BOTTOM	BALL	260	1	0.8 mm	unknown	40	48	R-PBGA-B48	Not Qualified	3.6 V	INDUSTRIAL	2.7 V	ASYNCHRONOUS	0.07 mA	4MX16		1 mm	16	0.000005 A	67108864 bit	PARALLEL		FLASH	3 V				YES	YES	YES	16,126	4K,32K	8 words	YES	BOTTOM/TOP	YES	8.15 mm	6.15 mm
Mfr Part No S29PL032J70BAW12	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	48	70 ns	SPANSION INC	3	2097152 words	2000000	85 °C	-25 °C	PLASTIC/EPOXY	VFBGA	8.15 X 6.15 MM, FBGA-48	BGA48,6X8,32	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Transferred	BGA	No	3 V	e0	No	EAR99	NOR TYPE	TIN LEAD		8542.32.00.51	BOTTOM	BALL	260	1	0.8 mm	not_compliant		48	R-PBGA-B48	Not Qualified	3.6 V	OTHER	2.7 V	ASYNCHRONOUS	0.07 mA	2MX16		1 mm	16	0.000005 A	33554432 bit	PARALLEL		FLASH	3 V				YES	YES	YES	16,62	4K,32K	8 words	YES	BOTTOM/TOP	YES	8.15 mm	6.15 mm
Mfr Part No S29GL512N90TAI010	AMD	Datasheet	-	-	Min: 1 Mult: 1	YES	56	90 ns	ADVANCED MICRO DEVICES INC		33554432 words	32000000	85 °C	-40 °C	PLASTIC/EPOXY	TSSOP	TSSOP, TSSOP56,.8,20	TSSOP56,.8,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	Transferred		No				EAR99	NOR TYPE			8542.32.00.51	DUAL	GULL WING			0.5 mm	unknown			R-PDSO-G56	Not Qualified		INDUSTRIAL			0.07 mA	32MX16			16	0.000005 A	536870912 bit	PARALLEL		FLASH				8	YES	YES	YES	512	128K	8/16 words	YES		YES
Mfr Part No S29GL128N90FFI020	AMD	Datasheet	-	-	Min: 1 Mult: 1	YES	64	90 ns	ADVANCED MICRO DEVICES INC		8388608 words	8000000	85 °C	-40 °C	PLASTIC/EPOXY	BGA		BGA64,8X8,40	SQUARE	GRID ARRAY	Transferred		Yes				EAR99	NOR TYPE			8542.32.00.51	BOTTOM	BALL			1 mm	unknown			S-PBGA-B64	Not Qualified		INDUSTRIAL			0.07 mA	8MX16			16	0.000005 A	134217728 bit	PARALLEL		FLASH				8	YES	YES	YES	128	128K	8/16 words	YES		YES
Mfr Part No S29PL064J70BFI12	Cypress Semiconductor	Datasheet	-	-	Min: 1 Mult: 1	YES	48	70 ns	CYPRESS SEMICONDUCTOR CORP	3	4194304 words	4000000	85 °C	-40 °C	PLASTIC/EPOXY	VFBGA	8.15 X 6.15 MM, FBGA-48	BGA48,6X8,32	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Transferred		Yes	3 V	e1		EAR99	NOR TYPE	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		8542.32.00.51	BOTTOM	BALL	260	1	0.8 mm	compliant	40		R-PBGA-B48	Not Qualified	3.6 V	INDUSTRIAL	2.7 V	ASYNCHRONOUS	0.07 mA	4MX16		1 mm	16	0.000005 A	67108864 bit	PARALLEL		FLASH	3 V				YES	YES	YES	16,126	4K,32K	8 words	YES	BOTTOM/TOP	YES	8.15 mm	6.15 mm

Memory - Modules (40)