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Specialized (272)

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ECCN Code
HTS Code
Reach Compliance Code
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JESD-30 Code
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ECCN Code:
EAR99

Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Factory Lead Time	Contact plating	Surface Mount	Number of pins	Number of Terminals	Access Time-Max	Capacitors series	Case - inch	Case - mm	Connector	Connector pinout layout	Contacts pitch	Date Of Intro	Dielectric strength	Electrical mounting	Gross weight	Ihs Manufacturer	Kind of capacitor	Kind of connector	Memory Types	Moisture Sensitivity Levels	Mounting	Mounting method	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Rohs Code	Row pitch	Spatial orientation	Supply Voltage-Nom (Vsup)	Transport packaging size/quantity	Type of capacitor	Type of connector	Operating temperature	Operating Temperature	Packaging	Published	Series	Tolerance	JESD-609 Code	Pbfree Code	Part Status	Moisture Sensitivity Level (MSL)	Number of Terminations	ECCN Code	Connector type	Terminal Finish	Applications	Additional Feature	HTS Code	Capacitance	Pitch	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Depth	Reach Compliance Code	Current rating	Time@Peak Reflow Temperature-Max (s)	Base Part Number	Pin Count	JESD-30 Code	Qualification Status	Number of contacts	Dielectric	Supply Voltage-Max (Vsup)	Contact resistance	Temperature Grade	Supply Voltage-Min (Vsup)	Insulation resistance	Memory Size	Analog IC - Other Type	Operating Mode	Supply Current-Max	Organization	Seated Height-Max	Memory Width	Standby Current-Max	Memory Density	Memory IC Type	Rated voltage	Profile	Features	Operating voltage	Mixed Memory Type	Degree of protection	Height	Length	Width	Plating thickness	RoHS Status	Flammability rating
Mfr Part No DS1921G-F5#	Maxim Integrated	Datasheet	-	-	Min: 1 Mult: 1	14 Weeks		YES																	NVSRAM (Non-Volatile SRAM)																								-40°C~85°C	Bulk	2003	iButton®		e3	yes	Active	1 (Unlimited)	2	EAR99		Matte Tin (Sn)	Temperature Logging		9025.80.10.00			END	NO LEAD	NOT SPECIFIED	1			not_compliant		NOT SPECIFIED	DS1921G	2	O-XEDB-N2	Not Qualified			5.25V			2.8V		512B 2KB	ANALOG CIRCUIT																			ROHS3 Compliant
Mfr Part No SST32HF324C-70-4C-LBK	Silicon Storage Technology	Datasheet	-	-	Min: 1 Mult: 1			YES		48		GCM	0402	1005					500 (50 Hz, 1 min.) V		0.03 g	SILICON STORAGE TECHNOLOGY INC	MLCC				SMD	soldering	2097152 words	2000000	70 °C		PLASTIC/EPOXY	LBGA	LBGA,		RECTANGULAR	GRID ARRAY, LOW PROFILE	Obsolete	BGA	No				34.423.324.5/100	ceramic		-40 …+105 °C					±5%		No				EAR99	F - socket			STATIC RAM IS ORGANIZED AS 256K X 16	8542.32.00.71	11pF	2.77 mm	BOTTOM	BALL	240	1	1 mm	16.3	unknown				48	R-PBGA-B48	Not Qualified	9 in two rows	C0G (NP0)	3.3 V	≤20 mΩ	COMMERCIAL	2.7 V	≥1000 (at Uinsp.dc=500 V) MΩ			ASYNCHRONOUS		2MX16	1.4 mm	16		33554432 bit	MEMORY CIRCUIT			screw mounting	100V		IP67	21.10 ±0.25	12 mm	10 mm
Mfr Part No RD38F2040W0YTQ0	Micron Technology Inc	Datasheet	-	-	Min: 1 Mult: 1			YES		88	70 ns											MICRON TECHNOLOGY INC											PLASTIC/EPOXY	FBGA	FBGA, BGA88,8X12,32	BGA88,8X12,32	RECTANGULAR	GRID ARRAY, FINE PITCH	Obsolete		No			1.8 V															EAR99					8542.32.00.71			BOTTOM	BALL			0.8 mm		unknown					R-PBGA-B88	Not Qualified											0.035 mA				0.00011 A		MEMORY CIRCUIT					FLASH+PSRAM
Mfr Part No RD38F2040W0YTQ0	Intel Corporation	Datasheet	-	-	Min: 1 Mult: 1			YES		88	65 ns											INTEL CORP							4194304 words	4000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	TFBGA, BGA88,8X12,32	BGA88,8X12,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	No			1.8 V										e0	No				EAR99		TIN LEAD		CONTAINS 32 MBIT SRAM, ALSO CONTAINS 64 MBIT FLASH	8542.32.00.71			BOTTOM	BALL		1	0.8 mm		compliant				88	R-PBGA-B88	Not Qualified			1.95 V		OTHER	1.7 V				SYNCHRONOUS	0.035 mA	4MX16	1.2 mm	16	0.0001 A	67108864 bit	MEMORY CIRCUIT					FLASH+PSRAM			10 mm	8 mm
Mfr Part No RD38F2040W0YTQ0	Numonyx Memory Solutions	Datasheet	-	-	Min: 1 Mult: 1			YES		88	70 ns											NUMONYX											PLASTIC/EPOXY	FBGA	FBGA, BGA88,8X12,32	BGA88,8X12,32	RECTANGULAR	GRID ARRAY, FINE PITCH	Transferred		No			1.8 V															EAR99					8542.32.00.71			BOTTOM	BALL			0.8 mm		unknown					R-PBGA-B88	Not Qualified											0.035 mA				0.00011 A		MEMORY CIRCUIT					FLASH+PSRAM
Mfr Part No RD38F3040L0YTQ0	Intel Corporation	Datasheet	-	-	Min: 1 Mult: 1			YES		88	85 ns											INTEL CORP							8388608 words	8000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	TFBGA, BGA88,8X12,32	BGA88,8X12,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	No			1.8 V										e0					EAR99		TIN LEAD		CONTAINS 32M BIT PSRAM	8542.32.00.71			BOTTOM	BALL		1	0.8 mm		compliant				88	R-PBGA-B88	Not Qualified			2 V		OTHER	1.7 V				SYNCHRONOUS	0.035 mA	8MX16	1.2 mm	16	0.0001 A	134217728 bit	MEMORY CIRCUIT					FLASH+PSRAM			10 mm	8 mm
Mfr Part No XC17S05PDG8I	AMD Xilinx	Datasheet	716 In Stock	-	Min: 1 Mult: 1			NO		8												XILINX INC				1			53984 words	53984	85 °C	-40 °C	PLASTIC/EPOXY	DIP	DIP,		RECTANGULAR	IN-LINE	Obsolete	DIP	Yes			5 V										e3	Yes				EAR99		Matte Tin (Sn)			8542.32.00.71			DUAL	THROUGH-HOLE	250	1	2.54 mm		compliant		30		8	R-PDIP-T8	Not Qualified			5.5 V		INDUSTRIAL	4.5 V				SYNCHRONOUS		53984X1	4.5974 mm	1		53984 bit	MEMORY CIRCUIT								9.3599 mm	7.62 mm
Mfr Part No PF38F4050M0Y1Q0	Numonyx Memory Solutions	Datasheet	-	-	Min: 1 Mult: 1			YES		88												NUMONYX							67108864 words	64000000			PLASTIC/EPOXY	TFBGA	TFBGA,		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA				1.8 V															EAR99				FLASH IS ALSO ORGANIZED AS 32M X 16 AND 64M X 16, PSEUDO SRAM IS ORGANIZED AS 4M X 16 OR 8M X 16	8542.32.00.71			BOTTOM	BALL	NOT SPECIFIED	1	0.8 mm		unknown		NOT SPECIFIED		88	R-PBGA-B88	Not Qualified			1.95 V			1.7 V				SYNCHRONOUS		64MX16	1.2 mm	16		1073741824 bit	MEMORY CIRCUIT								10 mm	8 mm
Mfr Part No PF38F4050M0Y1Q0	Intel Corporation	Datasheet	-	-	Min: 1 Mult: 1			YES		88	70 ns											INTEL CORP				3			67108864 words	64000000			PLASTIC/EPOXY	TFBGA	TFBGA, BGA107,9X12,32	BGA107,9X12,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Transferred	BGA	Yes			1.8 V										e1					EAR99		TIN SILVER COPPER		FLASH IS ALSO ORGANIZED AS 32M X 16 AND 64M X 16, PSEUDO SRAM IS ORGANIZED AS 4M X 16 OR 8M X 16	8542.32.00.71			BOTTOM	BALL		1	0.8 mm		compliant				88	R-PBGA-B88	Not Qualified			1.95 V			1.7 V				SYNCHRONOUS		64MX16	1.2 mm	16	0.00025 A	1073741824 bit	MEMORY CIRCUIT					FLASH+PSRAM			10 mm	8 mm
Mfr Part No S71GL512NC0BFWEZ2	AMD	Datasheet	-	-	Min: 1 Mult: 1			YES		84	110 ns											ADVANCED MICRO DEVICES INC									85 °C	-25 °C	PLASTIC/EPOXY	FBGA	FBGA, BGA84,10X12,32	BGA84,10X12,32	RECTANGULAR	GRID ARRAY, FINE PITCH	Active		Yes																		EAR99					8542.32.00.71			BOTTOM	BALL			0.8 mm		compliant					R-PBGA-B84	Not Qualified					OTHER						0.09 mA				0.005 A		MEMORY CIRCUIT					FLASH+PSRAM
Mfr Part No XC17S05XLVOG8I	AMD Xilinx	Datasheet	546 In Stock	-	Min: 1 Mult: 1			YES		8												XILINX INC				3			54544 words	54544	85 °C	-40 °C	PLASTIC/EPOXY	TSOP2	TSOP2,		RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSOP	Yes			3.3 V										e3	Yes				EAR99		Matte Tin (Sn)			8542.32.00.71			DUAL	GULL WING	260	1	1.27 mm		compliant		30		8	R-PDSO-G8	Not Qualified			3.6 V		INDUSTRIAL	3 V				SYNCHRONOUS		54544X1	1.2 mm	1		54544 bit	MEMORY CIRCUIT								4.9 mm	3.9 mm
Mfr Part No M6MGB64BM34CWG-P	Renesas Electronics Corporation	Datasheet	-	-	Min: 1 Mult: 1																	RENESAS TECHNOLOGY CORP													,				Obsolete																				EAR99					8542.32.00.71									unknown
Mfr Part No RD28F1602C3T90	Intel Corporation	Datasheet	-	-	Min: 1 Mult: 1			YES		66	90 ns											INTEL CORP							1048576 words	1000000	85 °C	-25 °C	PLASTIC/EPOXY	LFBGA	LFBGA, BGA68,8X12,32	BGA68,8X12,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	Obsolete	BGA				3 V															EAR99				SRAM IS ORGANIZED AS 256K X 16	8542.32.00.71			BOTTOM	BALL		1	0.8 mm		unknown				66	R-PBGA-B66	Not Qualified			3.3 V		COMMERCIAL EXTENDED	2.7 V				ASYNCHRONOUS	0.055 mA	1MX16	1.4 mm	16	0.000035 A	16777216 bit	MEMORY CIRCUIT					FLASH+SRAM			10 mm	8 mm
Mfr Part No NM1282KSLAXAL-3B	Nanya Technology Corporation	Datasheet	-	-	Min: 1 Mult: 1			YES		162												NANYA TECHNOLOGY CORP							67108864 words	64000000	85 °C	-25 °C	PLASTIC/EPOXY	VFBGA	VFBGA,		RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Active		Yes			1.8 V															EAR99				NAND IS ORGANISED AS 256M X 8 AND ALSO OPERATES WITH 1.2V NOMINAL SUPPLY	8542.32.00.71			BOTTOM	BALL	NOT SPECIFIED	1	0.5 mm		compliant		NOT SPECIFIED			R-PBGA-B162				1.95 V		OTHER	1.7 V				SYNCHRONOUS		64MX32	1 mm	32		2147483648 bit	MEMORY CIRCUIT								10.5 mm	8 mm
Mfr Part No MR2A16AVYS35	NXP Semiconductors	Datasheet	-	-	Min: 1 Mult: 1		tinned	YES	6	44					socket	2x3	1.27mm	2018-08-17		THT	0.41 g	NXP SEMICONDUCTORS		female					262144 words	256000	105 °C	-40 °C	PLASTIC/EPOXY	TSOP2	TSOP2-44		RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete			1.27mm	straight	3.3 V			pin strips	-40...163°C											EAR99					8542.32.00.71			DUAL	GULL WING		1	0.8 mm		unknown	1.5A				R-PDSO-G44				3.6 V		INDUSTRIAL	3 V				ASYNCHRONOUS		256KX16	1.2 mm	16		4194304 bit	MEMORY CIRCUIT	125V	bronze						18.41 mm	10.16 mm	4µm		UL94V-0
Mfr Part No S71PL129JC0BFW9U0	Spansion	Datasheet	-	-	Min: 1 Mult: 1			YES		64												SPANSION INC				3			8388608 words	8000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-64		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes			3 V										e1					EAR99		TIN SILVER COPPER		PSEUDO STATIC RAM IS ORGANIZED AS 4M X 16	8542.32.00.71			BOTTOM	BALL	260	1	0.8 mm		unknown		40		64	R-PBGA-B64	Not Qualified			3.1 V		OTHER	2.7 V				ASYNCHRONOUS		8MX16	1.2 mm	16		134217728 bit	MEMORY CIRCUIT								11.6 mm	8 mm
Mfr Part No S71NS256PB0ZJETV3	Spansion	Datasheet	-	-	Min: 1 Mult: 1			YES		56												SPANSION INC							16777216 words	16000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	TFBGA,		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes			1.8 V															EAR99				PSRAM IS ORGANIZED AS 2M X 16	8542.32.00.71			BOTTOM	BALL	260	1	0.5 mm		unknown		40		56	R-PBGA-B56	Not Qualified			1.95 V		OTHER	1.7 V				SYNCHRONOUS		16MX16	1.2 mm	16		268435456 bit	MEMORY CIRCUIT								9.2 mm	8 mm
Mfr Part No MC-242453F9-B10-BT3	NEC Electronics Group	Datasheet	-	-	Min: 1 Mult: 1			YES		77												NEC ELECTRONICS CORP							2097152 words	2000000	70 °C	-20 °C	PLASTIC/EPOXY	TFBGA	TFBGA,		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA																			EAR99				THE DEVICE ALSO CONTAINS A 1M X 16 MOBILE SPECIFIED RAM	8542.32.00.71			BOTTOM	BALL		1	0.8 mm		unknown				77	R-PBGA-B77	Not Qualified			3 V		COMMERCIAL	2.6 V				ASYNCHRONOUS		2MX16	1.2 mm	16		33554432 bit	MEMORY CIRCUIT								12 mm	7 mm
Mfr Part No SST34HF3282-70-4E-L1P	Silicon Storage Technology	Datasheet	-	-	Min: 1 Mult: 1			YES		56												SILICON STORAGE TECHNOLOGY INC							2097152 words	2000000	85 °C	-20 °C	PLASTIC/EPOXY	LFBGA	LFBGA,		RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	Obsolete	BGA	No			3 V															EAR99				ALSO CONTAINS 512K X 16 SRAM	8542.32.00.71			BOTTOM	BALL	NOT SPECIFIED	1	0.8 mm		unknown		NOT SPECIFIED		56	R-PBGA-B56	Not Qualified			3.3 V		OTHER	2.7 V				ASYNCHRONOUS		2MX16	1.4 mm	16		33554432 bit	MEMORY CIRCUIT								10 mm	8 mm
Mfr Part No S71GL064AB0BFW0Z0	Spansion	Datasheet	-	-	Min: 1 Mult: 1			YES		56												SPANSION INC				3			4194304 words	4000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	TFBGA,		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes			3 V										e1					EAR99		TIN SILVER COPPER		PSRAM IS ORGANIZED AS 512K X 16	8542.32.00.71			BOTTOM	BALL		1	0.8 mm		compliant				56	R-PBGA-B56	Not Qualified			3.1 V		COMMERCIAL EXTENDED	2.7 V				ASYNCHRONOUS		4MX16	1.2 mm	16		67108864 bit	MEMORY CIRCUIT								9 mm	7 mm

Specialized (272)