The category is 'Specialized'
Specialized (272)
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- ECCN Code
- HTS Code
- Reach Compliance Code
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- Part Life Cycle Code
- Package Description
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- JESD-30 Code
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- ECCN Code:
EAR99
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Memory IC Type | Mixed Memory Type | Length | Width |
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![]() | Mfr Part No S71GL064NA0BHW0F0 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | SPANSION INC | Obsolete | Yes | EAR99 | 8542.32.00.71 | 260 | unknown | 40 | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC17S100XLPDG8I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | XILINX INC | 1 | 781248 words | 781248 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | DIP | Yes | 3.3 V | e3 | Yes | EAR99 | Matte Tin (Sn) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 250 | 1 | 2.54 mm | compliant | 30 | 8 | R-PDIP-T8 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | 781248X1 | 4.5974 mm | 1 | 781248 bit | MEMORY CIRCUIT | 9.3599 mm | 7.62 mm | ||||||||
![]() | Mfr Part No MT42C4064-12 | Micron Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 120 ns | MICRON TECHNOLOGY INC | 65536 words | 64000 | 70 °C | PLASTIC/EPOXY | DIP | DIP-24 | DIP24,.4 | RECTANGULAR | IN-LINE | Active | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T24 | Not Qualified | COMMERCIAL | 0.06 mA | 64KX4 | 4 | 0.004 A | 262144 bit | MEMORY CIRCUIT | ||||||||||||||||||
![]() | Mfr Part No XC17S30VOG8I | AMD Xilinx | Datasheet | 63 | - | Min: 1 Mult: 1 | YES | 8 | XILINX INC | 3 | 247968 words | 247968 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP | Yes | 5 V | e3 | Yes | EAR99 | Matte Tin (Sn) | 8542.32.00.71 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 30 | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | SYNCHRONOUS | 247968X1 | 1.2 mm | 1 | 247968 bit | MEMORY CIRCUIT | 4.9 mm | 3.9 mm | ||||||||
![]() | Mfr Part No XC17S50XLSOG20I | AMD Xilinx | Datasheet | 310 | - | Min: 1 Mult: 1 | YES | 20 | XILINX INC | 3 | 559232 words | 559232 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | Yes | 3.3 V | e3 | Yes | EAR99 | Matte Tin (Sn) | 8542.32.00.71 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 30 | 20 | R-PDSO-G20 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | 559232X1 | 2.65 mm | 1 | 559232 bit | MEMORY CIRCUIT | 12.8 mm | 7.5 mm | ||||||||
![]() | Mfr Part No SST31LF041A-70-4C-WH | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 70 ns | SILICON STORAGE TECHNOLOGY INC | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP32,.56,20 | TSSOP32,.56,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 3.3 V | EAR99 | SRAM IS ORGANIZED AS 128K X 8 | 8542.32.00.71 | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.5 mm | unknown | NOT SPECIFIED | 32 | R-PDSO-G32 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.055 mA | 512KX8 | 1.2 mm | 8 | 0.00003 A | 4194304 bit | MEMORY CIRCUIT | FLASH+SRAM | 12.4 mm | 8 mm | |||||||
![]() | Mfr Part No M36L0R8060T1ZAQE | Numonyx Memory Solutions | Datasheet | - | - | Min: 1 Mult: 1 | YES | 88 | NUMONYX | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | TFBGA, | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Transferred | BGA | 1.8 V | e1 | EAR99 | TIN SILVER COPPER | PSEUDO SRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | NOT SPECIFIED | 88 | R-PBGA-B88 | Not Qualified | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | 16MX16 | 1.2 mm | 16 | 268435456 bit | MEMORY CIRCUIT | 10 mm | 8 mm | ||||||||||
![]() | Mfr Part No M36L0R8060T1ZAQE | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 88 | STMICROELECTRONICS | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-88 | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Transferred | BGA | Yes | 1.8 V | e1 | EAR99 | TIN SILVER COPPER | PSEUDO SRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 88 | R-PBGA-B88 | Not Qualified | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | 0.052 mA | 16MX16 | 1.2 mm | 16 | 0.00011 A | 268435456 bit | MEMORY CIRCUIT | FLASH+PSRAM | 10 mm | 8 mm | |||||||
![]() | Mfr Part No M5M4C500AVP-5 | Mitsubishi Electric | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 40 ns | MITSUBISHI ELECTRIC CORP | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP28,.53,22 | TSSOP28,.53,22 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | GULL WING | 0.55 mm | unknown | R-PDSO-G28 | Not Qualified | COMMERCIAL | 0.05 mA | 0.004 A | ||||||||||||||||||||||||
![]() | Mfr Part No M36L0R8060T1ZAQE | Micron Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 88 | MICRON TECHNOLOGY INC | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | TFBGA, | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | e1 | Yes | EAR99 | TIN SILVER COPPER | PSEUDO SRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 88 | R-PBGA-B88 | Not Qualified | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | 16MX16 | 1.2 mm | 16 | 268435456 bit | MEMORY CIRCUIT | 10 mm | 8 mm | ||||||||||
![]() | Mfr Part No TMS4C1060-40N | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | 30 ns | TEXAS INSTRUMENTS INC | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 2.54 mm | not_compliant | NOT SPECIFIED | R-PDIP-T16 | Not Qualified | COMMERCIAL | 0.045 mA | 0.01 A | MEMORY CIRCUIT | |||||||||||||||||||||||
![]() | Mfr Part No S71WS256NC0BFWAP0 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 84 | 80 ns | SPANSION INC | 3 | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84 | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | e1 | EAR99 | TIN SILVER COPPER | PSRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 84 | R-PBGA-B84 | Not Qualified | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | 0.054 mA | 16MX16 | 1.2 mm | 16 | 0.00007 A | 268435456 bit | MEMORY CIRCUIT | FLASH+PSRAM | 11.6 mm | 8 mm | |||
![]() | Mfr Part No S71WS256NC0BFWAP0 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 84 | 80 ns | ADVANCED MICRO DEVICES INC | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA84,10X12,32 | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Active | Yes | 1.8 V | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B84 | Not Qualified | OTHER | 0.066 mA | 0.00004 A | MEMORY CIRCUIT | FLASH+PSRAM | |||||||||||||||||||||||
![]() | Mfr Part No TMS4461-15NL | Rochester Electronics LLC | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 150 ns | ROCHESTER ELECTRONICS LLC | 65536 words | 64000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP24,.4 | DIP24,.4 | RECTANGULAR | IN-LINE | Active | 5 V | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T24 | Not Qualified | COMMERCIAL | 64KX4 | 4 | 262144 bit | MEMORY CIRCUIT | |||||||||||||||||||||||
![]() | Mfr Part No RD38F2030W0ZTQ0 | Numonyx Memory Solutions | Datasheet | - | - | Min: 1 Mult: 1 | YES | 88 | NUMONYX | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA88,8X12,32 | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Transferred | No | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | unknown | R-PBGA-B88 | Not Qualified | OTHER | 0.055 mA | 0.000005 A | MEMORY CIRCUIT | FLASH+PSRAM | |||||||||||||||||||||||||
![]() | Mfr Part No RD38F2030W0ZTQ0 | Micron Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 88 | MICRON TECHNOLOGY INC | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA88,8X12,32 | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Obsolete | No | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | unknown | R-PBGA-B88 | Not Qualified | OTHER | 0.055 mA | 0.000005 A | MEMORY CIRCUIT | FLASH+PSRAM | |||||||||||||||||||||||||
![]() | Mfr Part No S71GL032NA0BFW0U0 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | SPANSION INC | 3 | 2097152 words | 2000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 3 V | e1 | EAR99 | TIN SILVER COPPER | PSRAM IS ORGANIZED AS 1M X 16 | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 56 | R-PBGA-B56 | Not Qualified | 3.1 V | OTHER | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.2 mm | 16 | 33554432 bit | MEMORY CIRCUIT | 9 mm | 7 mm | ||||||||
![]() | Mfr Part No M36W0R6050B1ZAQF | Numonyx Memory Solutions | Datasheet | - | - | Min: 1 Mult: 1 | YES | 88 | 70 ns | NUMONYX | 4194304 words | 4000000 | 85 °C | -30 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA88,8X12,32 | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Transferred | BGA | Yes | 1.8 V | EAR99 | PSRAM IS ORGANIZED AS 2M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE | 8542.32.00.71 | BOTTOM | BALL | NOT SPECIFIED | 1 | 0.8 mm | unknown | NOT SPECIFIED | 88 | R-PBGA-B88 | Not Qualified | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | 4MX16 | 1.2 mm | 16 | 67108864 bit | MEMORY CIRCUIT | FLASH+PSRAM | 10 mm | 8 mm | ||||||||
![]() | Mfr Part No S71PL256ND0HFW5B0 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 84 | 70 ns | SPANSION INC | 3 | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | 8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84 | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 3 V | e1 | EAR99 | TIN SILVER COPPER | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 84 | R-PBGA-B84 | Not Qualified | 3.1 V | OTHER | 2.7 V | ASYNCHRONOUS | 16MX16 | 1.2 mm | 16 | 268435456 bit | MEMORY CIRCUIT | FLASH+PSRAM | 11.6 mm | 8 mm | ||||||
![]() | Mfr Part No SSDSC2KB480G701 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 2018-07-27 | INTEL CORP | , | Obsolete | EAR99 | 8542.32.00.71 | compliant | MEMORY CIRCUIT |
S71GL064NA0BHW0F0
Spansion
Package:Specialized
Price: please inquire
XC17S100XLPDG8I
AMD Xilinx
Package:Specialized
Price: please inquire
MT42C4064-12
Micron Technology Inc
Package:Specialized
Price: please inquire
XC17S30VOG8I
AMD Xilinx
Package:Specialized
Price: please inquire
XC17S50XLSOG20I
AMD Xilinx
Package:Specialized
Price: please inquire
SST31LF041A-70-4C-WH
Silicon Storage Technology
Package:Specialized
Price: please inquire
M36L0R8060T1ZAQE
Numonyx Memory Solutions
Package:Specialized
Price: please inquire
M36L0R8060T1ZAQE
STMicroelectronics
Package:Specialized
Price: please inquire
M5M4C500AVP-5
Mitsubishi Electric
Package:Specialized
Price: please inquire
M36L0R8060T1ZAQE
Micron Technology Inc
Package:Specialized
Price: please inquire
TMS4C1060-40N
Texas Instruments
Package:Specialized
Price: please inquire
S71WS256NC0BFWAP0
Spansion
Package:Specialized
Price: please inquire
S71WS256NC0BFWAP0
AMD
Package:Specialized
Price: please inquire
TMS4461-15NL
Rochester Electronics LLC
Package:Specialized
Price: please inquire
RD38F2030W0ZTQ0
Numonyx Memory Solutions
Package:Specialized
Price: please inquire
RD38F2030W0ZTQ0
Micron Technology Inc
Package:Specialized
Price: please inquire
S71GL032NA0BFW0U0
Spansion
Package:Specialized
Price: please inquire
M36W0R6050B1ZAQF
Numonyx Memory Solutions
Package:Specialized
Price: please inquire
S71PL256ND0HFW5B0
Spansion
Package:Specialized
Price: please inquire
SSDSC2KB480G701
Intel Corporation
Package:Specialized
Price: please inquire
