Specialized (272)

-

-

Min: 1

Mult: 1

YES

64

SILICON STORAGE TECHNOLOGY INC

4194304 words

4000000

85 °C

-20 °C

PLASTIC/EPOXY

LFBGA

LFBGA,

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

Obsolete

BGA

Yes

3 V

e1

EAR99

Tin/Silver/Copper (Sn/Ag/Cu)

PSRAM IS ORGANIZED AS 1024K X 16

8542.32.00.71

BOTTOM

BALL

260

1

0.8 mm

unknown

24

64

R-PBGA-B64

Not Qualified

3.3 V

OTHER

2.7 V

ASYNCHRONOUS

4MX16

1.4 mm

16

67108864 bit

MEMORY CIRCUIT

10 mm

8 mm

-

-

Min: 1

Mult: 1

NO

24

450 ns

SGS-ATES COMPONENTI ELECTRONICI S P A

512 words

512

70 °C

CERAMIC

DIP

DIP, DIP24,.6

DIP24,.6

RECTANGULAR

IN-LINE

Obsolete

No

e0

EAR99

Tin/Lead (Sn/Pb)

8542.32.00.71

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-XDIP-T24

Not Qualified

COMMERCIAL

512X8

3-STATE

8

4096 bit

COMMON

-

-

Min: 1

Mult: 1

YES

40

70 ns

HITACHI LTD

262144 words

256000

70 °C

PLASTIC/EPOXY

TSOP

TSOP, TSOP40/44,.46,32

TSOP40/44,.46,32

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

Obsolete

5 V

EAR99

8542.32.00.71

DUAL

GULL WING

0.8 mm

unknown

R-PDSO-G40

Not Qualified

COMMERCIAL

0.19 mA

256KX8

8

0.007 A

2097152 bit

VIDEO DRAM

-

-

Min: 1

Mult: 1

YES

137

NUMONYX

85 °C

-30 °C

PLASTIC/EPOXY

FBGA

FBGA, BGA137,10X15,32

BGA137,10X15,32

RECTANGULAR

GRID ARRAY

Obsolete

BGA

Yes

3 V

Yes

EAR99

8542.32.00.71

BOTTOM

BALL

NOT SPECIFIED

0.8 mm

unknown

NOT SPECIFIED

137

R-PBGA-B137

Not Qualified

OTHER

MEMORY CIRCUIT

FLASH+SDRAM

-

-

Min: 1

Mult: 1

YES

73

70 ns

ADVANCED MICRO DEVICES INC

4194304 words

4000000

85 °C

-25 °C

PLASTIC/EPOXY

LFBGA

LFBGA, BGA73,10X12,32

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

Obsolete

Yes

3 V

EAR99

SRAM IS ORGANISED AS 1KX16

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

compliant

R-PBGA-B73

Not Qualified

3.3 V

OTHER

2.7 V

ASYNCHRONOUS

4MX16

1.4 mm

16

67108864 bit

MEMORY CIRCUIT

FLASH+SRAM

11.6 mm

8 mm

-

-

Min: 1

Mult: 1

YES

77

NEC ELECTRONICS AMERICA INC

2097152 words

2000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

12 X 7 MM, FBGA-77

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Obsolete

No

e0

EAR99

TIN LEAD

SRAM IS ORGANISED AS 256 X 16 OR 512K X 8 AND FLASH CAN ALSO BE ORGANISED AS 4M X 8

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

compliant

R-PBGA-B77

Not Qualified

3.6 V

OTHER

2.7 V

ASYNCHRONOUS

2MX16

1.2 mm

16

33554432 bit

MEMORY CIRCUIT

12 mm

7 mm

-

-

Min: 1

Mult: 1

YES

32

SILICON STORAGE TECHNOLOGY INC

70 °C

PLASTIC/EPOXY

TSSOP

TSSOP, TSSOP32,.56,20

TSSOP32,.56,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Obsolete

No

3 V

e0

EAR99

Tin/Lead (Sn/Pb)

8542.32.00.71

DUAL

GULL WING

0.5 mm

unknown

R-PDSO-G32

Not Qualified

COMMERCIAL

0.0065 mA

0.00001 A

MEMORY CIRCUIT

ROM+SRAM

-

-

Min: 1

Mult: 1

YES

66

120 ns

STMICROELECTRONICS

2097152 words

2000000

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

0.80 MM PITCH, STACK, LFBGA-66

BGA66,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

Transferred

BGA

No

e0

EAR99

TIN LEAD

THE DEVICE ALSO CONTAINS A 2 MBIT (128K X16) SRAM

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

not_compliant

66

R-PBGA-B66

Not Qualified

2.2 V

INDUSTRIAL

1.65 V

ASYNCHRONOUS

0.04 mA

2MX16

1.4 mm

16

0.000025 A

33554432 bit

MEMORY CIRCUIT

FLASH+SRAM

12 mm

8 mm

-

-

Min: 1

Mult: 1

YES

66

NUMONYX

2097152 words

2000000

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

LFBGA,

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

Obsolete

BGA

No

e0

EAR99

Tin/Lead (Sn/Pb)

THE DEVICE ALSO CONTAINS A 2 MBIT (128K X16) SRAM

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

not_compliant

66

R-PBGA-B66

Not Qualified

2.2 V

INDUSTRIAL

1.65 V

ASYNCHRONOUS

2MX16

1.4 mm

16

33554432 bit

MEMORY CIRCUIT

12 mm

8 mm

-

-

Min: 1

Mult: 1

2018-07-27

INTEL CORP

,

Obsolete

EAR99

8542.32.00.71

compliant

MEMORY CIRCUIT

-

-

Min: 1

Mult: 1

YES

107

MICRON TECHNOLOGY INC

85 °C

-30 °C

PLASTIC/EPOXY

FBGA

FBGA, BGA107,10X14,32

BGA107,10X14,32

RECTANGULAR

GRID ARRAY, FINE PITCH

Obsolete

Yes

1.8 V

EAR99

8542.32.00.71

BOTTOM

BALL

0.8 mm

compliant

R-PBGA-B107

Not Qualified

OTHER

MEMORY CIRCUIT

FLASH+SDRAM

-

-

Min: 1

Mult: 1

YES

165

96 ns

MICRON TECHNOLOGY INC

PLASTIC/EPOXY

FBGA

FBGA, BGA165,12X15,25

BGA165,12X15,25

RECTANGULAR

GRID ARRAY, FINE PITCH

Obsolete

Yes

1.8 V

EAR99

8542.32.00.71

BOTTOM

BALL

0.635 mm

compliant

R-PBGA-B165

Not Qualified

0.00016 A

MEMORY CIRCUIT

FLASH+PSRAM

-

-

Min: 1

Mult: 1

YES

56

SPANSION INC

16777216 words

16000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

TFBGA,

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Obsolete

BGA

Yes

1.8 V

EAR99

PSRAM IS ORGANIZED AS 2M X 16

8542.32.00.71

BOTTOM

BALL

260

1

0.5 mm

unknown

40

56

R-PBGA-B56

Not Qualified

1.95 V

OTHER

1.7 V

SYNCHRONOUS

16MX16

1.2 mm

16

268435456 bit

MEMORY CIRCUIT

9.2 mm

8 mm

-

-

Min: 1

Mult: 1

YES

84

SPANSION INC

3

8388608 words

8000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

11.60 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

BGA84,10X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Obsolete

BGA

Yes

1.8 V

e1

EAR99

TIN SILVER COPPER

PSRAM IS ORGANIZED AS 4M X 16BIT; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

8542.32.00.71

BOTTOM

BALL

260

1

0.8 mm

unknown

40

84

R-PBGA-B84

Not Qualified

1.95 V

OTHER

1.7 V

ASYNCHRONOUS

8MX16

1.2 mm

16

134217728 bit

MEMORY CIRCUIT

FLASH+PSRAM

11.6 mm

8 mm

-

-

Min: 1

Mult: 1

2018-07-27

INTEL CORP

Active

EAR99

8542.32.00.71

compliant

MEMORY CIRCUIT

-

-

Min: 1

Mult: 1

YES

8

3.4 MHz

RAMTRON INTERNATIONAL CORP

65536 words

64000

85 °C

-40 °C

PLASTIC/EPOXY

SOP

,

SOP8,.25

RECTANGULAR

SMALL OUTLINE

Obsolete

SOIC

3.3 V

EAR99

8542.32.00.71

DUAL

GULL WING

1

1.27 mm

unknown

8

R-PDSO-G8

3.6 V

2 V

SYNCHRONOUS

0.001 mA

64KX8

1.75 mm

8

0.00015 A

524288 bit

SERIAL

FRAM

I2C

100000000000000 Write/Erase Cycles

10

HARDWARE

2 V

4.9 mm

3.9 mm

-

-

Min: 1

Mult: 1

YES

66

110 ns

MICRON TECHNOLOGY INC

2097152 words

2000000

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

FBGA-66

BGA66,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

Obsolete

BGA

No

e0

EAR99

Tin/Lead (Sn/Pb)

SRAM ORGANISATION IS 128K X 16

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

not_compliant

66

R-PBGA-B66

Not Qualified

2.2 V

INDUSTRIAL

1.65 V

ASYNCHRONOUS

0.025 mA

2MX16

1.4 mm

16

0.00006 A

33554432 bit

MEMORY CIRCUIT

FLASH+SRAM

12 mm

8 mm

472
In Stock

-

Min: 1

Mult: 1

YES

20

XILINX INC

3

330696 words

330696

70 °C

PLASTIC/EPOXY

SOP

SOP,

RECTANGULAR

SMALL OUTLINE

Obsolete

SOIC

Yes

3.3 V

e3

Yes

EAR99

Matte Tin (Sn)

8542.32.00.71

DUAL

GULL WING

260

1

1.27 mm

compliant

30

20

R-PDSO-G20

Not Qualified

3.6 V

COMMERCIAL

3 V

SYNCHRONOUS

330696X1

2.65 mm

1

330696 bit

MEMORY CIRCUIT

12.8 mm

7.5 mm

-

-

Min: 1

Mult: 1

YES

20

RAMTRON INTERNATIONAL CORP

PLASTIC/EPOXY

,

RECTANGULAR

SMALL OUTLINE

Obsolete

SOIC

EAR99

8542.32.00.71

DUAL

GULL WING

unknown

20

R-PDSO-G20

Not Qualified

MEMORY CIRCUIT

-

-

Min: 1

Mult: 1

YES

130

EON SILICON SOLUTION INC

33554432 words

32000000

85 °C

-25 °C

PLASTIC/EPOXY

VFBGA

VFBGA,

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Transferred

BGA

1.8 V

EAR99

8542.32.00.71

BOTTOM

BALL

1

0.65 mm

unknown

130

R-PBGA-B130

1.95 V

OTHER

1.7 V

SYNCHRONOUS

32MX16

1 mm

16

536870912 bit

MEMORY CIRCUIT

9 mm

8 mm