The category is 'Specialized'
Specialized (4)
- All Manufacturers
- Access Time-Max
- ECCN Code
- HTS Code
- Ihs Manufacturer
- JESD-30 Code
- JESD-609 Code
- Memory IC Type
- Mixed Memory Type
- Number of Terminals
- Operating Temperature-Max
- Package Body Material
- Supply Current-Max
- Supply Current-Max:
0.04 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Ihs Manufacturer | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Memory IC Type | Mixed Memory Type | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No TH50VSF0302BAXB | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 100 ns | TOSHIBA CORP | 1048576 words | 1000000 | 85 °C | -20 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA48,6X8,40 | BGA48,6X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | BGA | No | 3 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | SRAM IS ORGANISED AS 128K X 8 | 8542.32.00.71 | BOTTOM | BALL | 1 | 1 mm | unknown | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | OTHER | 2.7 V | ASYNCHRONOUS | 0.04 mA | 1MX8 | 1.6 mm | 8 | 0.00003 A | 8388608 bit | MEMORY CIRCUIT | FLASH+SRAM | 12 mm | 10 mm | |
 | Mfr Part No TH50VSF0302BCXB | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 100 ns | TOSHIBA CORP | 85 °C | -20 °C | PLASTIC/EPOXY | BGA | BGA, BGA48,6X8,40 | BGA48,6X8,40 | RECTANGULAR | GRID ARRAY | Transferred | No | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | BOTTOM | BALL | 1 mm | unknown | R-PBGA-B48 | Not Qualified | OTHER | 0.04 mA | 0.00003 A | MEMORY CIRCUIT | FLASH+SRAM | |||||||||||||||||
 | Mfr Part No M36DR232A120ZA6C | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 66 | 120 ns | STMICROELECTRONICS | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LFBGA | 0.80 MM PITCH, STACK, LFBGA-66 | BGA66,8X12,32 | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | Transferred | BGA | No | e0 | EAR99 | TIN LEAD | THE DEVICE ALSO CONTAINS A 2 MBIT (128K X16) SRAM | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | not_compliant | 66 | R-PBGA-B66 | Not Qualified | 2.2 V | INDUSTRIAL | 1.65 V | ASYNCHRONOUS | 0.04 mA | 2MX16 | 1.4 mm | 16 | 0.000025 A | 33554432 bit | MEMORY CIRCUIT | FLASH+SRAM | 12 mm | 8 mm | ||
| Mfr Part No TH50VSF1421ACXB | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 100 ns | TOSHIBA CORP | 85 °C | -20 °C | PLASTIC/EPOXY | BGA | BGA, BGA48,6X8,40 | BGA48,6X8,40 | RECTANGULAR | GRID ARRAY | Transferred | No | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | BOTTOM | BALL | 1 mm | unknown | R-PBGA-B48 | Not Qualified | OTHER | 0.04 mA | 0.00003 A | MEMORY CIRCUIT | FLASH+SRAM |
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TH50VSF0302BAXB
Toshiba America Electronic Components
Package:Specialized
Price: please inquire
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TH50VSF0302BCXB
Toshiba America Electronic Components
Package:Specialized
Price: please inquire
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M36DR232A120ZA6C
STMicroelectronics
Package:Specialized
Price: please inquire
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TH50VSF1421ACXB
Toshiba America Electronic Components
Package:Specialized
Price: please inquire