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      Home / All Categories / Memory Cards, Modules / Specialized /

      The category is 'Specialized'

      • All Manufacturers
      • Access Time-Max
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      • Ihs Manufacturer
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      • Operating Temperature-Max
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      • Package Code
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      • Package Shape
      • Supply Current-Max
      • Supply Current-Max:

        0.05 mA

      Image

      Part Number

      Manufacturer

      Datasheet

      Availability

      Pricing(USD)

      Quantity

      RoHS

      Surface Mount

      Number of Terminals

      Access Time-Max

      Ihs Manufacturer

      Number of Words

      Number of Words Code

      Operating Temperature-Max

      Operating Temperature-Min

      Package Body Material

      Package Code

      Package Description

      Package Equivalence Code

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      Part Package Code

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      HTS Code

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      JESD-30 Code

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      Supply Voltage-Max (Vsup)

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      Supply Current-Max

      Organization

      Seated Height-Max

      Memory Width

      Standby Current-Max

      Memory Density

      Memory IC Type

      Mixed Memory Type

      Length

      Width
      PF28F1602C3TD70

      Mfr Part No

      PF28F1602C3TD70

      		Intel Corporation Datasheet

      -

      -

      Min: 1

      Mult: 1

      YES

      66

      70 ns

      INTEL CORP

      1048576 words

      1000000

      85 °C

      -25 °C

      PLASTIC/EPOXY

      LFBGA

      LFBGA, BGA66,8X12,32

      BGA66,8X12,32

      RECTANGULAR

      GRID ARRAY, LOW PROFILE, FINE PITCH

      Obsolete

      BGA

      Yes

      3 V

      EAR99

      SRAM IS ORGANIZED AS 256K X 16

      8542.32.00.71

      BOTTOM

      BALL

      NOT SPECIFIED

      1

      0.8 mm

      compliant

      NOT SPECIFIED

      66

      R-PBGA-B66

      Not Qualified

      3.3 V

      COMMERCIAL EXTENDED

      2.7 V

      ASYNCHRONOUS

      0.05 mA

      1MX16

      1.4 mm

      16

      0.000005 A

      16777216 bit

      MEMORY CIRCUIT

      FLASH+SRAM

      10 mm

      8 mm

      TH50VSF3580AASB

      Mfr Part No

      TH50VSF3580AASB

      		Toshiba America Electronic Components Datasheet

      -

      -

      Min: 1

      Mult: 1

      YES

      69

      90 ns

      TOSHIBA CORP

      2097152 words

      2000000

      85 °C

      -30 °C

      PLASTIC/EPOXY

      LFBGA

      LFBGA, BGA69,10X12,32

      BGA69,10X12,32

      RECTANGULAR

      GRID ARRAY, LOW PROFILE, FINE PITCH

      Transferred

      BGA

      3 V

      e0

      EAR99

      TIN LEAD

      USER CONFIGURABLE AS 4M X 8 FLASH AND CONTAINS SRAM CONFIGURED AS 512K X 16 OR 1M X 8

      8542.32.00.71

      BOTTOM

      BALL

      1

      0.8 mm

      unknown

      69

      R-PBGA-B69

      Not Qualified

      3.3 V

      OTHER

      2.67 V

      ASYNCHRONOUS

      0.05 mA

      2MX16

      1.4 mm

      16

      33554432 bit

      MEMORY CIRCUIT

      FLASH+SRAM

      12 mm

      9 mm

      TMS4C1060-30N

      Mfr Part No

      TMS4C1060-30N

      		Texas Instruments Datasheet

      -

      -

      Min: 1

      Mult: 1

      NO

      16

      25 ns

      TEXAS INSTRUMENTS INC

      70 °C

      PLASTIC/EPOXY

      DIP

      DIP, DIP16,.3

      DIP16,.3

      RECTANGULAR

      IN-LINE

      Obsolete

      No

      5 V

      EAR99

      8542.32.00.71

      DUAL

      THROUGH-HOLE

      NOT SPECIFIED

      2.54 mm

      not_compliant

      NOT SPECIFIED

      R-PDIP-T16

      Not Qualified

      COMMERCIAL

      0.05 mA

      0.01 A

      MEMORY CIRCUIT

      M5M4C500AVP-5

      Mfr Part No

      M5M4C500AVP-5

      		Mitsubishi Electric Datasheet

      -

      -

      Min: 1

      Mult: 1

      YES

      28

      40 ns

      MITSUBISHI ELECTRIC CORP

      70 °C

      PLASTIC/EPOXY

      TSSOP

      TSSOP, TSSOP28,.53,22

      TSSOP28,.53,22

      RECTANGULAR

      SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

      Obsolete

      No

      5 V

      e0

      EAR99

      Tin/Lead (Sn/Pb)

      8542.32.00.71

      DUAL

      GULL WING

      0.55 mm

      unknown

      R-PDSO-G28

      Not Qualified

      COMMERCIAL

      0.05 mA

      0.004 A

      TH50VSF3581AASB

      Mfr Part No

      TH50VSF3581AASB

      		Toshiba America Electronic Components Datasheet

      -

      -

      Min: 1

      Mult: 1

      YES

      69

      90 ns

      TOSHIBA CORP

      2097152 words

      2000000

      85 °C

      -30 °C

      PLASTIC/EPOXY

      LFBGA

      LFBGA, BGA69,10X12,32

      BGA69,10X12,32

      RECTANGULAR

      GRID ARRAY, LOW PROFILE, FINE PITCH

      Transferred

      BGA

      3 V

      e0

      EAR99

      TIN LEAD

      USER CONFIGURABLE AS 4M X 8 FLASH AND CONTAINS SRAM CONFIGURED AS 512K X 16 OR 1M X 8

      8542.32.00.71

      BOTTOM

      BALL

      1

      0.8 mm

      unknown

      69

      R-PBGA-B69

      Not Qualified

      3.3 V

      OTHER

      2.67 V

      ASYNCHRONOUS

      0.05 mA

      2MX16

      1.4 mm

      16

      33554432 bit

      MEMORY CIRCUIT

      FLASH+SRAM

      12 mm

      9 mm

      TMS4C2973-26DT

      Mfr Part No

      TMS4C2973-26DT

      		Texas Instruments Datasheet

      -

      -

      Min: 1

      Mult: 1

      YES

      36

      21 ns

      TEXAS INSTRUMENTS INC

      70 °C

      PLASTIC/EPOXY

      SSOP

      SSOP, SOP36,.47,40

      SOP36,.47,40

      RECTANGULAR

      SMALL OUTLINE, SHRINK PITCH

      Obsolete

      No

      3.3 V

      EAR99

      8542.32.00.71

      DUAL

      GULL WING

      1 mm

      not_compliant

      R-PDSO-G36

      Not Qualified

      COMMERCIAL

      0.05 mA

      0.01 A

      TH50VSF2580AASB

      Mfr Part No

      TH50VSF2580AASB

      		Toshiba America Electronic Components Datasheet

      -

      -

      Min: 1

      Mult: 1

      YES

      69

      90 ns

      TOSHIBA CORP

      2097152 words

      2000000

      85 °C

      -40 °C

      PLASTIC/EPOXY

      LFBGA

      LFBGA, BGA69,10X12,32

      BGA69,10X12,32

      RECTANGULAR

      GRID ARRAY, LOW PROFILE, FINE PITCH

      Transferred

      BGA

      No

      3 V

      e0

      No

      EAR99

      TIN LEAD

      USER CONFIGURABLE AS 4M X 8 FLASH AND CONTAINS SRAM CONFIGURED AS 256 X 16 OR 512K X 8

      8542.32.00.71

      BOTTOM

      BALL

      1

      0.8 mm

      unknown

      69

      R-PBGA-B69

      Not Qualified

      3.6 V

      INDUSTRIAL

      2.7 V

      ASYNCHRONOUS

      0.05 mA

      2MX16

      1.4 mm

      16

      33554432 bit

      MEMORY CIRCUIT

      FLASH+SRAM

      12 mm

      9 mm

      TMS4C1060-30SD

      Mfr Part No

      TMS4C1060-30SD

      		Texas Instruments Datasheet

      -

      -

      Min: 1

      Mult: 1

      NO

      20

      25 ns

      TEXAS INSTRUMENTS INC

      70 °C

      PLASTIC/EPOXY

      ZIP

      ZIP, ZIP20,.1

      ZIP20,.1

      RECTANGULAR

      IN-LINE

      Obsolete

      No

      5 V

      EAR99

      8542.32.00.71

      ZIG-ZAG

      THROUGH-HOLE

      NOT SPECIFIED

      1.27 mm

      not_compliant

      NOT SPECIFIED

      R-PZIP-T20

      Not Qualified

      COMMERCIAL

      0.05 mA

      0.01 A

      MEMORY CIRCUIT