The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
- All Manufacturers
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mount | Package / Case | Surface Mount | Number of Pins | Number of Terminals | Clock Frequency-Max | Data Bus Width (bit) | ECCN (US) | Family Name | I2C | I2S | Ihs Manufacturer | Instruction Set Architecture | Lead Shape | Manufacturer | Manufacturer Part Number | Maximum Operating Supply Voltage (V) | Maximum Operating Temperature (°C) | Maximum Speed (MHz) | Memory Types | Minimum Operating Supply Voltage (V) | Minimum Operating Temperature (°C) | Moisture Sensitivity Levels | Mounting | Multiply Accumulate | Number of CPU Cores | Number of I/Os | On-Chip Memory | Operating Temperature (Max.) | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Height | Package Length | Package Shape | Package Style | Package Width | Part Life Cycle Code | Part Package Code | PCB changed | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Standard Package Name | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage (V) | UART | USART | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Oscillator Type | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Supply Current-Max | Bit Size | Access Time | Seated Height-Max | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | Security Features | Display & Interface Controllers | SATA | Data Encoding/Decoding Method | SPI | CAN | Device Core | Height Seated (Max) | Length | Width | RoHS Status | Lead Free |
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 | Mfr Part No T4161NXN7PQB | NXP USA Inc. | Datasheet | 574 |
| Min: 1 Mult: 1 | 18 Weeks | 1932-BBGA, FCBGA | YES | -40°C~105°C TA | 2002 | QorIQ T4 | Active | 3 (168 Hours) | 3A991.A.1 | 8542.31.00.01 | BOTTOM | BALL | 250 | 1mm | S-PBGA-B1932 | 1.8GHz | MICROPROCESSOR, RISC | PowerPC e6500 | 133.3MHz | 16 | YES | YES | 64 | FIXED POINT | YES | 1Gbps (13), 10Gbps (2) | 8 Core 64-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, RapidIO, SPI, UART | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | SATA 3Gbps (2) | 3.33mm | 45mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MCIMX233CJM4CR2 | NXP USA Inc. | Datasheet | 80000 | - | Min: 1 Mult: 1 | 10 Weeks | 169-LFBGA | -40°C~85°C TA | Tape & Reel (TR) | 2004 | i.MX23 | Obsolete | 3 (168 Hours) | MCIMX233 | 454MHz | ARM926EJ-S | 2.0V 2.5V 2.7V 3.0V 3.3V | 1 Core 32-Bit | No | DRAM | USB 2.0 + PHY (1) | I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | Data; DCP | Cryptography, Hardware ID | LCD, Touchscreen | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LE3100MICH S L8YC | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 64 | Xeon® Processor | 0 | 0 | RISC | 1.3625 | 1830 | 0.85 | Surface Mount | No | 2 | 2.26 | 40.05 | 40.05 | 1284 | FCBGA3 | 0 | 0 | Tray | Unconfirmed | 1284 | 0 | 0 | 0 | 0 | Xeon | Yes with exemptions | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY7C53150-20AI | Cypress Semiconductor | Datasheet | 648 | - | Min: 1 Mult: 1 | YES | 64 | 20 MHz | 16 | EAR99 | CY7C531x0 | 0 | 0 | CYPRESS SEMICONDUCTOR CORP | CISC | Gull-wing | Cypress Semiconductor | CY7C53150-20AI | 5.5 | 85 | 20 | 4.5 | -40 | 3 | Surface Mount | No | 3 | 2KB/SRAM | 85 °C | -40 °C | PLASTIC/EPOXY | LQFP | 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-64 | QFP64,.66SQ,32 | 1.4 | 14 | SQUARE | FLATPACK, LOW PROFILE | 14 | Obsolete | QFP | 64 | 30 | 8.57 | No | QFP | TQFP | 5.5 V | 4.5 V | 5 V | 5 | 0 | 0 | e0 | Obsolete | Tin/Lead (Sn/Pb) | 8542.31.00.01 | Serial IO/Communication Controllers | CMOS | QUAD | GULL WING | 240 | 0.8 mm | not_compliant | 64 | S-PQFP-G64 | Not Qualified | 5 V | INDUSTRIAL | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 37 mA | 1.6 mm | 16 | NO | NO | 8 | 0 | 0 | 5 | DIFF BIPHASE-LEVEL | 0 | 0 | 14 mm | 14 mm | RoHS non-compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No TMS34010FNL-40 | Texas Instruments | Datasheet | 355 | - | Min: 1 Mult: 1 | PLCC | YES | 70°C | no | 68 | QUAD | J BEND | 5V | 1.27mm | not_compliant | S-PQCC-J68 | Not Qualified | 5V | COMMERCIAL | GRAPHICS PROCESSOR | 125mA | Non-RoHS Compliant | Contains Lead | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8544ECVTALFA | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 783-BBGA, FCBGA | YES | -40°C~105°C TA | Tray | 2007 | MPC85xx | e2 | Obsolete | 3 (168 Hours) | 783 | 5A002.A | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8544 | S-PBGA-B783 | 1.05V | 0.95V | 667MHz | MICROPROCESSOR | PowerPC e500 | 133MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | DUART, I2C, PCI | Signal Processing; SPE, Security; SEC | Cryptography, Random Number Generator | 3.38mm | 29mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8568EVTAQGG | NXP USA Inc. | Datasheet | 2372 |
| Min: 1 Mult: 1 | 1023-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2016 | MPC85xx | e2 | Obsolete | 3 (168 Hours) | 5A002.A | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 1mm | 40 | MPC8568 | S-PBGA-B1023 | 1.155V | 1.11.8/2.52.5/3.3V | 1.045V | 1.0GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 32 | 16 | YES | YES | 64 | FIXED POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | DUART, HSSI, I2C, PCI, RapidIO, UART | Communications; QUICC Engine, Security; SEC | Cryptography, Random Number Generator | 2.75mm | 33mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LS1088ASN7Q1A | NXP USA Inc. | Datasheet | 2160 |
| Min: 1 Mult: 1 | 18 Weeks | 780-BFBGA, FCBGA | 0°C~105°C | QorIQ® Layerscape | Active | 3 (168 Hours) | 8542.39.00.01 | 250 | 30 | 1.6GHz | ARM® Cortex®-A53 | 10GbE (2), 1GbE (8) | 8 Core 64-Bit | DDR4 | USB 3.0 (2) + PHY | Secure Boot, TrustZone® | SATA 6Gbps (1) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MCIMX6S4AVM10AC | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | YES | -40°C~125°C TJ | Tray | i.MX6S | Active | 3 (168 Hours) | 624 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.8mm | NOT SPECIFIED | S-PBGA-B624 | 1.5V | 1.4V | 1GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No RM7035C-600L-D004 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Tray | Active | 3 (168 Hours) | 600MHz | 2.5V 3.3V | 1 Core 64-Bit | DDR, SDRAM | PCI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC860DPZQ66D4 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (2), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No S80C186EB25 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PQFP | 80 | 70°C | Bulk | 1996 | e0 | 80 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | NOT SPECIFIED | 5V | 0.8mm | 25MHz | NOT SPECIFIED | 80 | Not Qualified | 5V | COMMERCIAL | 5V | MICROPROCESSOR | 115mA | 16 | 25 μs | 20 | NO | YES | 16 | FIXED POINT | NO | 3.15mm | 20mm | 14mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No ATSAMA5D21B-CUR | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 196-TFBGA, CSBGA | External Program Memory | 72 | -40°C~85°C TA | Tape & Reel (TR) | 2017 | SAMA5D2 | yes | Obsolete | 3 (168 Hours) | 500MHz | ATSAMA5D21 | EBI/EMI, Ethernet, I2C, IrDA, LIN, MMC, SD, SDIO, SPI, UART, USART, USB | Internal | ARM® Cortex®-A5 | DMA, LCD, POR, PWM, WDT | ARM | 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | Multimedia; NEON™ MPE | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No ATSAMA5D26B-CNR | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 289-LFBGA | External Program Memory | 128 | -40°C~105°C TA | Tape & Reel (TR) | 2017 | SAMA5D2 | yes | Obsolete | 3 (168 Hours) | 500MHz | ATSAMA5D26 | EBI/EMI, Ethernet, I2C, IrDA, LIN, MMC, SD, SDIO, SPI, UART, USART, USB | Internal | ARM® Cortex®-A5 | DMA, LCD, POR, PWM, WDT | ARM | 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | Multimedia; NEON™ MPE | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No ATSAMA5D22B-CNR | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 196-TFBGA, CSBGA | YES | External Program Memory | 72 | -40°C~105°C TA | Tape & Reel (TR) | 2017 | SAMA5D2 | e2 | yes | Obsolete | 3 (168 Hours) | 196 | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | BOTTOM | BALL | 1.2V | 0.75mm | 500MHz | ATSAMA5D22 | S-PBGA-B196 | 1.32V | 1.1V | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, MMC, SD, SDIO, SPI, UART, USART, USB | Internal | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | DMA, LCD, POR, PWM, WDT | 26 | ARM | YES | YES | 32 | FLOATING POINT | YES | 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | Multimedia; NEON™ MPE | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | 1.2mm | 11mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8313ECZQADDC | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 516-BBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e0 | Last Time Buy | 3 (168 Hours) | 516 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8313 | S-PBGA-B516 | 1.05V | 0.95V | 267MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 15 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | Security; SEC 2.2 | Cryptography | 2.55mm | 27mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8323EVRADDCA | NXP USA Inc. | Datasheet | 16 |
| Min: 1 Mult: 1 | 12 Weeks | 516-BBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | S-PBGA-B516 | 1.05V | 0.95V | 266MHz | MICROPROCESSOR, RISC | PowerPC e300c2 | 66.67MHz | 32 | YES | YES | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine, Security; SEC 2.2 | Cryptography | 2.55mm | 27mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8379ECVRALGA | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 689-BBGA Exposed Pad | -40°C~125°C TA | Tray | 2004 | MPC83xx | Active | 3 (168 Hours) | MPC8379 | 667MHz | PowerPC e300c4s | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | Security; SEC 3.0 | Cryptography, Random Number Generator | SATA 3Gbps (4) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No FS32V234BMN1VUB | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 22 Weeks | 621-FBGA, FCBGA | YES | -40°C~105°C TA | 2015 | Active | 3 (168 Hours) | 621 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.65mm | 40 | S-PBGA-B621 | 1.05V | 0.95V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A53, ARM® Cortex®-M4 | 64 | YES | YES | FLOATING POINT | YES | 1V 1.8V 3.3V | 1Gbps | 4 Core 64-Bit/1 Core 32-Bit | Yes | DDR3, DDR3L, LPDDR2 | I2C, SPI, PCI, UART | Multimedia; NEON™ MPE | AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG | APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU | 2.44mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MCIMX6Q4AVT10AE | NXP USA Inc. | Datasheet | 20 |
| Min: 1 Mult: 1 | 14 Weeks | 624-FBGA, FCBGA | -40°C~125°C TJ | Tray | 2002 | i.MX6Q | Active | 3 (168 Hours) | 260 | 40 | 1.0GHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | ROHS3 Compliant |
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T4161NXN7PQB
NXP USA Inc.
Package:Embedded - Microprocessors
952.535987
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MCIMX233CJM4CR2
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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LE3100MICH S L8YC
Intel
Package:Embedded - Microprocessors
Price: please inquire
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CY7C53150-20AI
Cypress Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
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TMS34010FNL-40
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
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MPC8544ECVTALFA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8568EVTAQGG
NXP USA Inc.
Package:Embedded - Microprocessors
188.245619
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LS1088ASN7Q1A
NXP USA Inc.
Package:Embedded - Microprocessors
174.225112
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MCIMX6S4AVM10AC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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RM7035C-600L-D004
Microchip Technology
Package:Embedded - Microprocessors
Price: please inquire
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MPC860DPZQ66D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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S80C186EB25
Intel
Package:Embedded - Microprocessors
Price: please inquire
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ATSAMA5D21B-CUR
Microchip Technology
Package:Embedded - Microprocessors
Price: please inquire
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ATSAMA5D26B-CNR
Microchip Technology
Package:Embedded - Microprocessors
Price: please inquire
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ATSAMA5D22B-CNR
Microchip Technology
Package:Embedded - Microprocessors
Price: please inquire
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MPC8313ECZQADDC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8323EVRADDCA
NXP USA Inc.
Package:Embedded - Microprocessors
43.880863
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MPC8379ECVRALGA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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FS32V234BMN1VUB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6Q4AVT10AE
NXP USA Inc.
Package:Embedded - Microprocessors
82.378419