The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
- All Manufacturers
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Frequency(Max) | Number of I/Os | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Supply Current-Max | Bit Size | Access Time | Data Bus Width | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | Number of Cores | Number of External Interrupts | On Chip Data RAM Width | Security Features | Data Transfer Rate-Max | Display & Interface Controllers | Number of DMA Channels | SATA | Data Encoding/Decoding Method | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No AM1808BZWTT3 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 361-LFBGA | 361 | -40°C~125°C TJ | Tube | Sitara™ | e1 | no | Obsolete | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 375MHz | AM1808 | 1.32V | MICROPROCESSOR, RISC | ARM926EJ-S | 32 | 23 | ARM | YES | YES | 16 | FIXED POINT | YES | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR2 | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | I2C, McASP, McBSP, SPI, MMC/SD, UART | System Control; CP15 | 1 | LCD | SATA 3Gbps (1) | ROHS3 Compliant | Contains Lead | |||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8572ECPXAVND | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 1023-BFBGA, FCBGA | -40°C~105°C TA | Tray | 2008 | MPC85xx | Obsolete | 3 (168 Hours) | MPC8572 | 1.5GHz | PowerPC e500 | 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 2 Core 32-Bit | No | DDR2, DDR3 | DUART, HSSI, I2C, RapidIO | Signal Processing; SPE, Security; SEC | Cryptography, Random Number Generator | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MC68HC000CRC12 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 68-BCPGA | -40°C~85°C TA | Tray | 1995 | M680x0 | Obsolete | 3 (168 Hours) | MC68HC000 | 12MHz | EC000 | 5.0V | 1 Core 32-Bit | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No TMPN3120FE3M | Toshiba | Datasheet | 408 | - | Min: 1 Mult: 1 | Surface Mount | SOP | 32 | 20MHz | 11 | 2003 | e0 | Discontinued | 32 | TIN LEAD | 85°C | -40°C | 8542.31.00.01 | DUAL | GULL WING | 5V | 1.27mm | 20MHz | 32 | 5V | 5V | INDUSTRIAL | 5.5V | 4.5V | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 55mA | 8b | NO | YES | 2000 | 5 | 8 | 0.3125 MBps | NRZ | 2.8mm | 20.6mm | No | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8321ECZQADDC | NXP USA Inc. | Datasheet | 18 | - | Min: 1 Mult: 1 | 516-BBGA | 516-FPBGA (27x27) | -40°C~105°C TA | Tray | 2004 | MPC83xx | Obsolete | 3 (168 Hours) | MPC8321 | 266MHz | PowerPC e300c2 | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine, Security; SEC 2.2 | Cryptography | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No KU80386EXTB25 | Intel | Datasheet | 403 | - | Min: 1 Mult: 1 | Surface Mount | QFP | 117°C | -40°C | Bulk | 1998 | e0 | Discontinued | 132 | 3A001.A.3 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.635mm | 25MHz | NOT SPECIFIED | 132 | Not Qualified | INDUSTRIAL | 3.3V | MICROPROCESSOR | 32 | 25 μs | 26 | YES | YES | 16 | FIXED POINT | NO | 0 | 3 | 12 | 2 | 4.57mm | 24.13mm | 24.13mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No P1014NXN5DFB | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 425-FBGA | YES | -40°C~105°C TA | Tray | 2002 | QorIQ P1 | e2 | Active | 3 (168 Hours) | 425 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | P1014 | S-PBGA-B425 | 1.05V | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | YES | YES | FLOATING POINT | YES | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, SPI | SATA 3Gbps (2) | 1.9mm | 19mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC8572CLVTAULD | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 1023-BFBGA, FCBGA | -40°C~105°C TA | Tray | 2008 | MPC85xx | Obsolete | 3 (168 Hours) | MPC8572 | 1.333GHz | PowerPC e500 | 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 2 Core 32-Bit | No | DDR2, DDR3 | DUART, HSSI, I2C, RapidIO | Signal Processing; SPE | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MCIMX6D5EYM12CE | NXP USA Inc. | Datasheet | 2089 |
| Min: 1 Mult: 1 | 14 Weeks | 624-LFBGA, FCBGA | -20°C~105°C TJ | Tray | i.MX6D | Active | 3 (168 Hours) | 1.2GHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No T1013NSE7PQA | NXP USA Inc. | Datasheet | 1031 |
| Min: 1 Mult: 1 | 18 Weeks | 525-FBGA, FCBGA | 0°C~105°C TA | 2014 | QorIQ T1 | Active | 3 (168 Hours) | 1.4GHz | PowerPC e5500 | GbE (8) | 1 Core 64-Bit | No | DDR3L, DDR4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | SATA 3Gbps (2) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LS1088ASE7MQA | NXP USA Inc. | Datasheet | 1943 |
| Min: 1 Mult: 1 | 18 Weeks | 780-BFBGA, FCBGA | 0°C~105°C | QorIQ® Layerscape | Active | 3 (168 Hours) | 8542.39.00.01 | 250 | 30 | 1.2GHz | ARM® Cortex®-A53 | 10GbE (2), 1GbE (8) | 8 Core 64-Bit | DDR4 | USB 3.0 (2) + PHY | Secure Boot, TrustZone® | SATA 6Gbps (1) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No N80L186EB16 | Intel | Datasheet | 8000 | - | Min: 1 Mult: 1 | Surface Mount | LCC | 70°C | Bulk | 1996 | e0 | Discontinued | 84 | Tin/Lead (Sn/Pb) | DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE | QUAD | J BEND | NOT SPECIFIED | 3.3V | 1.27mm | 16MHz | NOT SPECIFIED | 84 | S-PQCC-J84 | Not Qualified | 3/5V | COMMERCIAL | 3V | MICROPROCESSOR | 54mA | 16 | 16 μs | 20 | NO | YES | 16 | FIXED POINT | NO | 0 | 2 | 6 | 4.83mm | 29.3116mm | 29.3116mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No GCIXP1200GB | Intel | Datasheet | 8000 | - | Min: 1 Mult: 1 | Surface Mount | BGA | 432 | 70°C | Bulk | e0 | Discontinued | 432 | 3A001.A.3 | TIN LEAD | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT APPLICABLE | 2V | 1.27mm | 200MHz | NOT APPLICABLE | 432 | Not Qualified | COMMERCIAL | 3.3V | MICROPROCESSOR, RISC | 32 | 200 μs | 32 | YES | NO | 32 | FIXED POINT | YES | 1.67mm | 40mm | 40mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LS2044AXN7V1B | NXP USA Inc. | Datasheet | 2245 |
| Min: 1 Mult: 1 | 18 Weeks | 1292-BFBGA, FCBGA | -40°C~105°C | QorIQ® Layerscape | Active | 3 (168 Hours) | 2.0GHz | ARM® Cortex®-A72 | 10GbE (8) or 1GbE (16) & 2.5GbE (1) | 4 Core 64-Bit | DDR4 | USB 3.0 (2) + PHY | Secure Boot, TrustZone® | SATA (2) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LS2048AXE7TTB | NXP USA Inc. | Datasheet | 1736 |
| Min: 1 Mult: 1 | 18 Weeks | 1292-BFBGA, FCBGA | -40°C~105°C | QorIQ® Layerscape | Active | 3 (168 Hours) | 1.8GHz | ARM® Cortex®-A72 | 10GbE (8) or 1GbE (16) & 2.5GbE (1) | 4 Core 64-Bit | DDR4 | USB 3.0 (2) + PHY | SATA 6Gbps (2) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LS2048AXN7TTB | NXP USA Inc. | Datasheet | 1977 |
| Min: 1 Mult: 1 | 18 Weeks | 1292-BFBGA, FCBGA | -40°C~105°C | QorIQ® Layerscape | Active | 3 (168 Hours) | 1.8GHz | ARM® Cortex®-A72 | 10GbE (8) or 1GbE (16) & 2.5GbE (1) | 4 Core 64-Bit | DDR4 | USB 3.0 (2) + PHY | SATA 6Gbps (2) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LS2044ASE7TTB | NXP USA Inc. | Datasheet | 1639 |
| Min: 1 Mult: 1 | 18 Weeks | 1292-BFBGA, FCBGA | 0°C~105°C | QorIQ® Layerscape | Active | 3 (168 Hours) | 1.8GHz | ARM® Cortex®-A72 | 10GbE (8) or 1GbE (16) & 2.5GbE (1) | 4 Core 64-Bit | DDR4 | USB 3.0 (2) + PHY | Secure Boot, TrustZone® | SATA (2) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LS2044AXE7TTB | NXP USA Inc. | Datasheet | 2001 |
| Min: 1 Mult: 1 | 18 Weeks | 1292-BFBGA, FCBGA | -40°C~105°C | QorIQ® Layerscape | Active | 3 (168 Hours) | 1.8GHz | ARM® Cortex®-A72 | 10GbE (8) or 1GbE (16) & 2.5GbE (1) | 4 Core 64-Bit | DDR4 | USB 3.0 (2) + PHY | Secure Boot, TrustZone® | SATA (2) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AM1705CPTPA3 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 176-LQFP Exposed Pad | 176 | -40°C~105°C TJ | Tube | Sitara™ | e4 | no | Obsolete | 4 (72 Hours) | 176 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | GULL WING | 260 | 1.2V | 0.5mm | 375MHz | AM1705 | 1.32V | SPI, USB | 1.32V | 1.14V | 16kB | 8kB | MICROPROCESSOR, RISC | ARM926EJ-S | 32 | 32b | 13 | ARM | YES | YES | FIXED POINT | YES | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 2.0 + PHY (1) | I2C, McASP, SPI, MMC/SD, UART | System Control; CP15 | 1.6mm | 24mm | ROHS3 Compliant | Contains Lead | |||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC823VR66B2T | NXP USA Inc. | Datasheet | 2400 | - | Min: 1 Mult: 1 | 256-BBGA | 0°C~95°C TA | Tray | 1999 | MPC8xx | Obsolete | 3 (168 Hours) | MPC823 | 66MHz | PowerPC | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | I2C, SMC, SCC, SPI, UART | Communications; RISC CPM | LCD, Video | ROHS3 Compliant |
-
AM1808BZWTT3
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
-
MPC8572ECPXAVND
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MC68HC000CRC12
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
TMPN3120FE3M
Toshiba
Package:Embedded - Microprocessors
Price: please inquire
-
MPC8321ECZQADDC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
KU80386EXTB25
Intel
Package:Embedded - Microprocessors
Price: please inquire
-
P1014NXN5DFB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MPC8572CLVTAULD
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MCIMX6D5EYM12CE
NXP USA Inc.
Package:Embedded - Microprocessors
125.081318
-
T1013NSE7PQA
NXP USA Inc.
Package:Embedded - Microprocessors
94.844211
-
LS1088ASE7MQA
NXP USA Inc.
Package:Embedded - Microprocessors
137.820355
-
N80L186EB16
Intel
Package:Embedded - Microprocessors
Price: please inquire
-
GCIXP1200GB
Intel
Package:Embedded - Microprocessors
Price: please inquire
-
LS2044AXN7V1B
NXP USA Inc.
Package:Embedded - Microprocessors
376.304962
-
LS2048AXE7TTB
NXP USA Inc.
Package:Embedded - Microprocessors
341.355440
-
LS2048AXN7TTB
NXP USA Inc.
Package:Embedded - Microprocessors
332.342023
-
LS2044ASE7TTB
NXP USA Inc.
Package:Embedded - Microprocessors
278.168044
-
LS2044AXE7TTB
NXP USA Inc.
Package:Embedded - Microprocessors
310.524724
-
AM1705CPTPA3
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
-
MPC823VR66B2T
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire