The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
- All Manufacturers
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Contact Plating | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Acting | Base Product Number | Base/Housing Material | Body Orientation | Brand | Capacitance tolerance | Capacitors series | Case - inch | Case - mm | Clock Frequency-Max | Coil resistance | Contact Materials | Data RAM Size | Data ROM Size | Date Of Intro | Dielectric strength | Factory Pack QuantityFactory Pack Quantity | Gross weight | I/O Voltage | Ihs Manufacturer | Interface Type | Kind of capacitor | L1 Cache Data Memory | L1 Cache Instruction Memory | L2 Cache Instruction / Data Memory | Manufacturer | Maximum Clock Frequency | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting hole size | Mounting Styles | Number of contacts in group/number of groups (total contacts) | Number of switching cycles (electrical) | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Part Package Code | Processor Series | Product Status | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Switching scheme | Termination Method | Tradename | Transport packaging size/quantity | Type of capacitor | Voltage, Rating | Watchdog Timers | Wire Size | Operating temperature | Operating Temperature | Packaging | Series | Tolerance | JESD-609 Code | Part Status | ECCN Code | Connector Type | Type | Terminal Finish | Gender | HTS Code | Capacitance | Subcategory | Pitch | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Depth | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Housing Color | Operating Supply Voltage | Dielectric | Contact resistance | Temperature Grade | Interface | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Program Memory Size | Supply Current-Max | Bit Size | Family | Data Bus Width | Seated Height-Max | Address Bus Width | Product Type | Operating temperature range | Shielded | Rated current | Switching voltage | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Number of Cores | Number of External Interrupts | On Chip Data RAM Width | Security Features | Display & Interface Controllers | Number of DMA Channels | SATA | Operating voltage | Product Category | Turns Ratio | Product Length | Product Width | Height | Length | Width |
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 | Mfr Part No MCIMX7U3DVK07SD | NXP | Datasheet | 30 |
| Min: 1 Mult: 1 | Surface Mount | 361-VFBGA | 361-VFBGA (10x10) | MCIMX7 | NXP Semiconductors | 240 | NXP | NXP USA Inc. | Tray | 935402105557 | Active | Details | 0°C ~ 95°C (TJ) | Tray | i.MX7ULP | Microprocessors - MPU | 720MHz | ARM® Cortex®-A7 | Microprocessors - MPU | - | - | 2 Core, 32-Bit | Yes | LPDDR2, LPDDR3 | USB 2.0 (2) | FlexIO, GPIO, I²C, I²S, SPI, UART | ARM® Cortex®-M4 | Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot | MIPI-DSI | - | Microprocessors - MPU | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MCIMX7U5DVP07SD | NXP | Datasheet | 24 |
| Min: 1 Mult: 1 | Surface Mount | 393-LFBGA | 393-VFBGA (14x14) | MCIMX7 | NXP Semiconductors | 152 | NXP | NXP USA Inc. | Tray | 935402114557 | Active | Details | 0°C ~ 95°C (TJ) | Tray | i.MX7ULP | Microprocessors - MPU | 720MHz | ARM® Cortex®-A7 | Microprocessors - MPU | - | - | 2 Core, 32-Bit | Yes | LPDDR2, LPDDR3 | USB 2.0 (2) | FlexIO, GPIO, I²C, I²S, SPI, UART | ARM® Cortex®-M4 | Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot | MIPI-DSI | - | Microprocessors - MPU | 1:1 | 11.43 | 11.43 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MCIMX6G2AVM05ABR | NXP | Datasheet | 30 |
| Min: 1 Mult: 1 | MAPBGA-289 | NXP Semiconductors | 128 kB | 96 kB | 1000 | CAN, Ethernet, I2C, I2S, SPI, UART | 32 kB | 32 kB | 128 kB | NXP | 528 MHz | + 125 C | DDR3, DDR3L, LPDDR2, NAND Flash, NOR Flash, eMMC | - 40 C | Yes | SMD/SMT | 935346154518 | i.MX 6UltraLite | i.MX | Watchdog Timer | Reel | i.MX 6UltraLite | Microprocessors - MPU | 1.3 V | Heat Shrink Tubing | 32 bit | Microprocessors - MPU | 1 Core | Microprocessors - MPU | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MIMX8DX6FVLFZAC | NXP | Datasheet | - | - | Min: 1 Mult: 1 | Gold | Thermoplastic | Right Angle | NXP Semiconductors | Phosphor Bronze | 60 | NXP | Cable Mount | 935407421557 | IDT | -65 to 105 °C | Tray | i.MX 8DualXPlus | Receptacle | Microprocessors - MPU | 2.5400 mm | Black | Microprocessors - MPU | Microprocessors - MPU | 35.56 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MIMX8QX1FVLFZAC | NXP | Datasheet | - | - | Min: 1 Mult: 1 | Non-Time Delay | NXP Semiconductors | 60 | NXP | 935407403557 | 32 V | Tray | i.MX 8QuadXPlus | Limiter | Microprocessors - MPU | Microprocessors - MPU | Microprocessors - MPU | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MIMX8QM6AVUFFABR | NXP | Datasheet | - | - | Min: 1 Mult: 1 | Gold | Straight | NXP Semiconductors | Copper Alloy | 350 | NXP | Cable Mount | 935385047518 | Details | Crimp | 28 to 22, 28 AWG | -55 to 105 °C | Reel | i.MX 8QuadMax | Connector Power | Receptacle | Microprocessors - MPU | Microprocessors - MPU | No | Microprocessors - MPU | 7.9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MIMX8UX5FVLFZAC | NXP | Datasheet | - | - | Min: 1 Mult: 1 | NXP Semiconductors | 60 | NXP | 935407673557 | Tray | i.MX8X | Microprocessors - MPU | Microprocessors - MPU | Microprocessors - MPU | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IBM25PPC750CXEJR7012T | IBM | Datasheet | - | - | Min: 1 Mult: 1 | Bulk | * | Active | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No FS32R274KSK2MMM | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | 4 Weeks | YES | 257 | 40 MHz | 2018-06-21 | NXP SEMICONDUCTORS | 3 | 125 °C | -40 °C | PLASTIC/EPOXY | LFBGA | MABGA-257 | BGA257,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Yes | 1.31 V | 1.19 V | 1.25 V | e2 | 5A992.C | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8 mm | compliant | 40 | S-PBGA-B257 | 240 MHz | MICROPROCESSOR, RISC | 1642 mA | 32 | 1.51 mm | YES | YES | ISO 26262 | FLOATING-POINT | YES | 1572864 | 1 | 8 | 32 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC8360EVVALFHA | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | 4 Weeks | YES | 740 | 66.67 MHz | NXP SEMICONDUCTORS | 3 | 70 °C | PLASTIC/EPOXY | LBGA | 37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, TBGA-740 | BGA740,37X37,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | Yes | 1.35 V | 1.25 V | 1.3 V | e2 | 5A002.A.1 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1 mm | compliant | 40 | S-PBGA-B740 | Not Qualified | 667 MHz | MICROPROCESSOR, RISC | 32 | 1.69 mm | 32 | YES | YES | 32 | FLOATING POINT | YES | 37.5 mm | 37.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IBMPPC750GXECR5592T | IBM | Datasheet | - | - | Min: 1 Mult: 1 | Bulk | * | Active | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 25PPC604E2PE233DE1 | IBM | Datasheet | - | - | Min: 1 Mult: 1 | Bulk | * | Active | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 25EMPPC603E2BB200F | IBM | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 278-BBGA, FCBGA | 278-FCPBGA (21x21) | 0°C ~ 105°C (TJ) | Bulk | Active | 200MHz | PowerPC EM603e | 2.5V, 3.3V | 1 Core, 32-Bit | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No TSPC603RMGU12LC | Teledyne e2v | Datasheet | - | - | Min: 1 Mult: 1 | YES | 255 | GCQ | 0201 | 0603 | 266 MHz | 0.03 g | E2V TECHNOLOGIES PLC | MLCC | SMD | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | BGA | 2.625 V | 2.375 V | 2.5 V | ceramic | -55...125°C | ±2% | 3A991.A.2 | 8542.31.00.01 | 18pF | BOTTOM | BALL | 1.27 mm | unknown | 255 | S-CBGA-B255 | Not Qualified | C0G (NP0) | MILITARY | 266 MHz | MICROPROCESSOR, RISC | 32 | 3 mm | 32 | YES | YES | 64 | FLOATING POINT | YES | 50V | 21 mm | 21 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No TSPC603RMGU12LC | Atmel Corporation | Datasheet | 464 | - | Min: 1 Mult: 1 | YES | 255 | ±0.1pF | GCM | 0402 | 1005 | 75 MHz | 0.03 g | ATMEL CORP | MLCC | SMD | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, BGA255,16X16,50 | BGA255,16X16,50 | SQUARE | GRID ARRAY | Transferred | BGA | No | 2.625 V | 2.375 V | 2.5 V | ceramic | -55...125°C | e0 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | 0.36pF | BOTTOM | BALL | 1.27 mm | unknown | 255 | S-CBGA-B255 | Not Qualified | C0G (NP0) | MILITARY | 266 MHz | MICROPROCESSOR, RISC | 32 | 3 mm | 32 | YES | YES | 64 | FLOATING POINT | YES | 100V | 21 mm | 21 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AST2500A2-GP | Aspeed Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | 1000 (at U_brk.dc=500 V) MOhm | 1500 (50 Hz, 1 min) V | 6.30 | ASPEED TECHNOLOGY INC | Ф6 mm | 3/ 2 (6P) | 10000 min | TFBGA-456 | Contact Manufacturer | ON-ON, DPDT | 42*28*18.5/2500 | 35.6 mm | unknown | 20 mOhm max | -25…+85 °C | 3 (6) A | 250 (125) V | 13.2 mm | 12.7 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IBM25PPC750GXECB6543T | IBM | Datasheet | - | - | Min: 1 Mult: 1 | Bulk | * | Active | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IBM25PPC750FL-GR1033V | IBM | Datasheet | - | - | Min: 1 Mult: 1 | Bulk | * | Active | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IBMPPC750FX-GR2523T | IBM | Datasheet | - | - | Min: 1 Mult: 1 | Bulk | * | Active | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No R9A07G044L28GBG#AC0 | Renesas | Datasheet | 128 |
| Min: 1 Mult: 1 | Surface Mount | 551-LFBGA | 551-LFBGA (21x21) | Renesas Electronics | 60 | 1.8, 2.5, 2.8, 3.15 V | Renesas Electronics | Renesas Electronics America Inc | Tray | Active | Details | -40 to 105 °C | Tray | RZ/G2L | Microprocessors - MPU | 1.5 V | CAN/Ethernet/I2C/I2S | 200MHz, 1.2GHz | 128 KB | ARM® Cortex®-A55, ARM® Cortex®-M33 | 96 KB | 32 Bit | Microprocessors - MPU | 1.8V, 3.3V | 10/100/1000Mbps (2) | 3 Core, 64-Bit | No | DDR3L, DDR4 | USB 2.0 (2) | CANbus, eMMC/SD/SDIO, I²C, SPI, UART | ARM® Mali-G31 | AES, RSA, SHA-1, SHA-224, SHA-256, TRNG | MIPI/CSI, MIPI/DSI | - | Microprocessors - MPU |
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MCIMX7U3DVK07SD
NXP
Package:Embedded - Microprocessors
16.972085
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MCIMX7U5DVP07SD
NXP
Package:Embedded - Microprocessors
16.547294
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MCIMX6G2AVM05ABR
NXP
Package:Embedded - Microprocessors
22.095268
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MIMX8DX6FVLFZAC
NXP
Package:Embedded - Microprocessors
Price: please inquire
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MIMX8QX1FVLFZAC
NXP
Package:Embedded - Microprocessors
Price: please inquire
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MIMX8QM6AVUFFABR
NXP
Package:Embedded - Microprocessors
Price: please inquire
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MIMX8UX5FVLFZAC
NXP
Package:Embedded - Microprocessors
Price: please inquire
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IBM25PPC750CXEJR7012T
IBM
Package:Embedded - Microprocessors
Price: please inquire
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FS32R274KSK2MMM
NXP Semiconductors
Package:Embedded - Microprocessors
Price: please inquire
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MPC8360EVVALFHA
NXP Semiconductors
Package:Embedded - Microprocessors
Price: please inquire
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IBMPPC750GXECR5592T
IBM
Package:Embedded - Microprocessors
Price: please inquire
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25PPC604E2PE233DE1
IBM
Package:Embedded - Microprocessors
Price: please inquire
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25EMPPC603E2BB200F
IBM
Package:Embedded - Microprocessors
Price: please inquire
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TSPC603RMGU12LC
Teledyne e2v
Package:Embedded - Microprocessors
Price: please inquire
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TSPC603RMGU12LC
Atmel Corporation
Package:Embedded - Microprocessors
Price: please inquire
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AST2500A2-GP
Aspeed Technology Inc
Package:Embedded - Microprocessors
Price: please inquire
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IBM25PPC750GXECB6543T
IBM
Package:Embedded - Microprocessors
Price: please inquire
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IBM25PPC750FL-GR1033V
IBM
Package:Embedded - Microprocessors
Price: please inquire
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IBMPPC750FX-GR2523T
IBM
Package:Embedded - Microprocessors
Price: please inquire
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R9A07G044L28GBG#AC0
Renesas
Package:Embedded - Microprocessors
23.472706