The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Material | Number of Terminals | Capacitance tolerance | Capacitors series | Case - inch | Case - mm | Clock Frequency-Max | Gross weight | Ihs Manufacturer | Kind of capacitor | Moisture Sensitivity Levels | Mounting | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Thread | Transport packaging size/quantity | Type of capacitor | Operating temperature | Packaging | Series | Tolerance | JESD-609 Code | Pbfree Code | Part Status | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Capacitance | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Dielectric | Temperature Grade | Speed | uPs/uCs/Peripheral ICs Type | Supply Current-Max | Bit Size | Data Bus Width | Seated Height-Max | Address Bus Width | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | RAM (words) | Number of External Interrupts | Saturation Current | Operating voltage | Shaft diameter | Length | Width |
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![]() | Mfr Part No SAB80186-1-N | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | YES | 68 | 20 MHz | INFINEON TECHNOLOGIES AG | 70 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-68 | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | No | 5.5 V | 4.5 V | 5 V | e0 | TIN LEAD | PROGRAMMABLE CHIP SELECT; 3 INTERNAL PROGRAMMABLE TIMERS | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | not_compliant | 68 | S-PQCC-J68 | Not Qualified | COMMERCIAL | 10 MHz | MICROPROCESSOR | 550 mA | 16 | 5.1 mm | 20 | NO | NO | 16 | FIXED POINT | NO | 24.3 mm | 24.3 mm | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No TMS9981JDL | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | TEXAS INSTRUMENTS INC | 70 °C | CERAMIC | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 8542.31.00.01 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 2.54 mm | not_compliant | NOT SPECIFIED | R-XDIP-T40 | Not Qualified | COMMERCIAL | MICROPROCESSOR | 16 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AM29040-66KC | AMD | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No RCPXA260B1C400 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 294 | 3.6864 MHz | INTEL CORP | 1 | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | BGA | No | 1.43 V | 1.235 V | 1.3 V | 8542.31.00.01 | BOTTOM | BALL | compliant | 294 | S-PBGA-B294 | Not Qualified | 400 MHz | MICROPROCESSOR, RISC | 32 | 26 | YES | YES | 32 | FIXED POINT | YES | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No P5021PSE72QC | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1295 | FREESCALE SEMICONDUCTOR INC | 105 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | Yes | 1.23 V | 1.17 V | 1.2 V | e1 | 5A002.A | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1295 | OTHER | 2200 MHz | MICROPROCESSOR, RISC | 3.53 mm | 16 | YES | YES | 64 | FIXED POINT | YES | 37.5 mm | 37.5 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No RCPXA270C0C416 | Marvell Technology Group Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 356 | 13.002 MHz | MARVELL SEMICONDUCTOR INC | PLASTIC/EPOXY | VFBGA | VFBGA, | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | No | 1.705 V | 1.2825 V | 1.35 V | e0 | No | TIN LEAD | 8542.31.00.01 | BOTTOM | BALL | 0.5 mm | unknown | 356 | S-PBGA-B356 | Not Qualified | 416 MHz | MICROPROCESSOR | 1 mm | 26 | YES | YES | 32 | FIXED POINT | YES | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC6800CLD | Motorola Semiconductor Products | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | MOTOROLA INC | 85 °C | -40 °C | CERAMIC | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T40 | INDUSTRIAL | 1 MHz | MICROPROCESSOR, RISC | 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PPC405EX-SSC600T | Applied Micro Circuits Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 388 | 666.66 MHz | APPLIED MICRO CIRCUITS CORP | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA388,26X26,40 | BGA388,26X26,40 | SQUARE | GRID ARRAY | Obsolete | BGA | Yes | 1.3 V | 1.2 V | 1.25 V | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1 mm | unknown | NOT SPECIFIED | 388 | S-PBGA-B388 | Not Qualified | INDUSTRIAL | 600 MHz | MICROPROCESSOR, RISC | 32 | 2.65 mm | YES | YES | FIXED POINT | YES | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No P1750AE-30PGMB | Pyramid Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 68 | 30 MHz | PYRAMID SEMICONDUCTOR CORP | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | PGA | PGA-68 | SQUARE | GRID ARRAY | Active | PGA | No | 5.5 V | 4.5 V | 5 V | No | 3A991.A.2 | 2.7 MIPS DAIS MIX; TWO PROGRAMMABLE TIMERS; FAST POLYNOMIAL EXPANSION ALGORITHM | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | NOT SPECIFIED | 2.54 mm | compliant | NOT SPECIFIED | 68 | S-CPGA-P68 | Not Qualified | MILITARY | 30 MHz | MICROPROCESSOR | 16 | 4.572 mm | 16 | NO | NO | 16 | FLOATING POINT | NO | 28.56 mm | 28.56 mm | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No Z8400AC1 | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 4 MHz | STMICROELECTRONICS | 70 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-44 | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | No | 5.25 V | 4.75 V | 5 V | e0 | TIN LEAD | DRAM REFRESH CONTROLLER | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | not_compliant | 44 | S-PQCC-J44 | Not Qualified | COMMERCIAL | 4 MHz | MICROPROCESSOR | 200 mA | 8 | 4.57 mm | 16 | NO | NO | 8 | FIXED POINT | NO | 0 | 2 | 16.5862 mm | 16.5862 mm | |||||||||||||||||||||||||||||||
![]() | Mfr Part No IBM25PPC750GXECR5522V | IBM | Datasheet | - | - | Min: 1 Mult: 1 | Bulk | * | Active | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IBM25PPC750FX-GB0532V | IBM | Datasheet | - | - | Min: 1 Mult: 1 | Bulk | * | Active | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No I7-860 | Intel Corporation | Datasheet | 1824 | - | Min: 1 Mult: 1 | INTEL CORP | , | Obsolete | 8542.31.00.01 | compliant | MICROPROCESSOR | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IBMPPC750GXECB5H82B | IBM | Datasheet | - | - | Min: 1 Mult: 1 | Bulk | * | Active | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TSPC860SRVZQU66D | Teledyne LeCroy | Datasheet | - | - | Min: 1 Mult: 1 | 32 Bit | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XPC850SRCZT66BU | Motorola Mobility LLC | Datasheet | - | - | Min: 1 Mult: 1 | YES | Brass | 256 | 33 MHz | 1.35 | MOTOROLA INC | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,50 | BGA256,16X16,50 | SQUARE | GRID ARRAY | Transferred | BGA | 3.465 V | 3.135 V | 3.3 V | M5 | 28.5*21*19/5000 | 3A991.A.2 | Threaded bushing with hole series BN1035 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 256 | S-PBGA-B256 | Not Qualified | 66 MHz | MICROPROCESSOR, RISC | 32 | 2.35 mm | 26 | YES | YES | 32 | FIXED POINT | YES | 5.5 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No TSPC603RMGU12LC | Teledyne e2v | Datasheet | - | - | Min: 1 Mult: 1 | YES | 255 | GCQ | 0201 | 0603 | 266 MHz | 0.03 g | E2V TECHNOLOGIES PLC | MLCC | SMD | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | BGA | 2.625 V | 2.375 V | 2.5 V | ceramic | -55...125°C | ±2% | 3A991.A.2 | 8542.31.00.01 | 18pF | BOTTOM | BALL | 1.27 mm | unknown | 255 | S-CBGA-B255 | Not Qualified | C0G (NP0) | MILITARY | 266 MHz | MICROPROCESSOR, RISC | 32 | 3 mm | 32 | YES | YES | 64 | FLOATING POINT | YES | 50V | 21 mm | 21 mm | |||||||||||||||||||||||||
![]() | Mfr Part No TSPC603RMGU12LC | Atmel Corporation | Datasheet | 464 | - | Min: 1 Mult: 1 | YES | 255 | ±0.1pF | GCM | 0402 | 1005 | 75 MHz | 0.03 g | ATMEL CORP | MLCC | SMD | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, BGA255,16X16,50 | BGA255,16X16,50 | SQUARE | GRID ARRAY | Transferred | BGA | No | 2.625 V | 2.375 V | 2.5 V | ceramic | -55...125°C | e0 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | 0.36pF | BOTTOM | BALL | 1.27 mm | unknown | 255 | S-CBGA-B255 | Not Qualified | C0G (NP0) | MILITARY | 266 MHz | MICROPROCESSOR, RISC | 32 | 3 mm | 32 | YES | YES | 64 | FLOATING POINT | YES | 100V | 21 mm | 21 mm | |||||||||||||||||||||
![]() | Mfr Part No TDA2SGBRQABCQ1 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 760 | TEXAS INSTRUMENTS INC | 125 °C | -40 °C | PLASTIC/EPOXY | FBGA | FCBGA-760 | SQUARE | GRID ARRAY, FINE PITCH | Obsolete | Yes | 1.2 V | 1.11 V | 1.15 V | e1 | Yes | 5A992.C | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B760 | AUTOMOTIVE | SoC | 2.96 mm | AEC-Q100 | 3 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TSPC603RMGU6LC | Teledyne e2v | Datasheet | - | - | Min: 1 Mult: 1 | YES | 255 | 166 MHz | E2V TECHNOLOGIES PLC | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | BGA | 2.625 V | 2.375 V | 2.5 V | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 255 | S-CBGA-B255 | Not Qualified | MILITARY | 166 MHz | MICROPROCESSOR, RISC | 32 | 3 mm | 32 | YES | YES | 64 | FLOATING POINT | YES | 21 mm | 21 mm |
SAB80186-1-N
Infineon Technologies AG
Package:Embedded - Microprocessors
Price: please inquire
TMS9981JDL
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
AM29040-66KC
AMD
Package:Embedded - Microprocessors
Price: please inquire
RCPXA260B1C400
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
P5021PSE72QC
Freescale Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
RCPXA270C0C416
Marvell Technology Group Ltd
Package:Embedded - Microprocessors
Price: please inquire
MC6800CLD
Motorola Semiconductor Products
Package:Embedded - Microprocessors
Price: please inquire
PPC405EX-SSC600T
Applied Micro Circuits Corporation
Package:Embedded - Microprocessors
Price: please inquire
P1750AE-30PGMB
Pyramid Semiconductor Corporation
Package:Embedded - Microprocessors
Price: please inquire
Z8400AC1
STMicroelectronics
Package:Embedded - Microprocessors
Price: please inquire
IBM25PPC750GXECR5522V
IBM
Package:Embedded - Microprocessors
Price: please inquire
IBM25PPC750FX-GB0532V
IBM
Package:Embedded - Microprocessors
Price: please inquire
I7-860
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
IBMPPC750GXECB5H82B
IBM
Package:Embedded - Microprocessors
Price: please inquire
TSPC860SRVZQU66D
Teledyne LeCroy
Package:Embedded - Microprocessors
Price: please inquire
XPC850SRCZT66BU
Motorola Mobility LLC
Package:Embedded - Microprocessors
Price: please inquire
TSPC603RMGU12LC
Teledyne e2v
Package:Embedded - Microprocessors
Price: please inquire
TSPC603RMGU12LC
Atmel Corporation
Package:Embedded - Microprocessors
Price: please inquire
TDA2SGBRQABCQ1
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
TSPC603RMGU6LC
Teledyne e2v
Package:Embedded - Microprocessors
Price: please inquire
