The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
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- Package / Case
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- Moisture Sensitivity Level (MSL)
- RoHS Status
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- RAM Controllers
- Series
- USB
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Part Status | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Supply Current-Max | Bit Size | Seated Height-Max | Address Bus Width | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Number of External Interrupts | Security Features | Display & Interface Controllers | Length | Width |
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![]() | Mfr Part No HW8076504489901SRH4E | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No S32G398ASBK1VUCT | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Tray | Active | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SME1430LGA-440 | Sun Microsystems Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 587 | 66 MHz | SUN MICROSYSTEMS INC | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, BGA587,28X28,50 | BGA587,28X28,50 | SQUARE | GRID ARRAY | Obsolete | LGA | 1.96 V | 1.84 V | 1.9 V | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 587 | S-CBGA-B587 | Not Qualified | 440 MHz | MICROPROCESSOR, RISC | 10500 mA | 64 | 4.35 mm | 32 | YES | NO | 32 | FLOATING POINT | YES | 37.5 mm | 37.5 mm | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No TMPZ84C011AF-6 | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 12.12 MHz | TOSHIBA CORP | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, | RECTANGULAR | FLATPACK | Obsolete | QFP | No | 5.5 V | 2.7 V | 5 V | e0 | TIN LEAD | 8542.31.00.01 | QUAD | GULL WING | 0.65 mm | unknown | 100 | R-PQFP-G100 | Not Qualified | INDUSTRIAL | 6.144 MHz | MICROPROCESSOR | 30 mA | 8 | 3.05 mm | 16 | NO | YES | 8 | FIXED POINT | NO | 0 | 2 | 20 mm | 14 mm | |||||||||||||||||||||||||||
![]() | Mfr Part No PPC440GX-3CF533C | Applied Micro Circuits Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 552 | 83 MHz | APPLIED MICRO CIRCUITS CORP | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, BGA552,24X24,40 | BGA552,24X24,40 | SQUARE | GRID ARRAY | Obsolete | BGA | No | 1.6 V | 1.4 V | 1.5 V | 3A991.A.2 | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | NOT SPECIFIED | 552 | S-CBGA-B552 | Not Qualified | INDUSTRIAL | 533 MHz | MICROPROCESSOR, RISC | 2200 mA | 32 | 3.977 mm | 64 | YES | NO | 64 | FIXED POINT | YES | 25 mm | 25 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No P1750A-15CMB | Pyramid Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 64 | 15 MHz | PYRAMID SEMICONDUCTOR CORP | 125 °C | -55 °C | UNSPECIFIED | DIP | BRAZE, DIP-64 | RECTANGULAR | IN-LINE | Active | DIP | No | 5.5 V | 4.5 V | 5 V | No | 3A001.A.2.C | TWO PROGRAMMABLE TIMERS | 8542.31.00.01 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1.27 mm | compliant | NOT SPECIFIED | 64 | R-XDIP-T64 | Not Qualified | MILITARY | 15 MHz | MICROPROCESSOR | 16 | 4.191 mm | 16 | NO | YES | MIL-STD-883 Class B | 16 | FLOATING POINT | NO | 42.2402 mm | 15.24 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No MC68030RC25B | Motorola Semiconductor Products | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TMP68HC000F-12 | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 12.5 MHz | TOSHIBA CORP | 70 °C | PLASTIC/EPOXY | QFP | QFP, | RECTANGULAR | FLATPACK | Obsolete | QFP | No | 5.25 V | 4.75 V | 5 V | e0 | TIN LEAD | 8542.31.00.01 | QUAD | GULL WING | 1 mm | unknown | 64 | R-PQFP-G64 | Not Qualified | COMMERCIAL | 12.5 MHz | MICROPROCESSOR | 35 mA | 16 | 3.05 mm | 23 | NO | YES | 16 | FIXED POINT | NO | 0 | 7 | 20 mm | 14 mm | ||||||||||||||||||||||||||||
![]() | Mfr Part No PPC440SP-RNC533C | Applied Micro Circuits Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 783 | 666.66 MHz | APPLIED MICRO CIRCUITS CORP | PLASTIC/EPOXY | BGA | BGA, BGA783,28X28,40 | BGA783,28X28,40 | SQUARE | GRID ARRAY | Obsolete | BGA | Yes | 1.6 V | 1.4 V | 1.5 V | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | NOT SPECIFIED | 783 | S-PBGA-B783 | Not Qualified | 533 MHz | MICROPROCESSOR, RISC | 3000 mA | 32 | 3.27 mm | 32 | YES | YES | 64 | FIXED POINT | YES | 29 mm | 29 mm | ||||||||||||||||||||||||||||||
![]() | Mfr Part No MC6800CL | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | MOTOROLA SEMICONDUCTOR PRODUCTS | 85 °C | -40 °C | CERAMIC | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T40 | Not Qualified | INDUSTRIAL | 1 MHz | MICROPROCESSOR, RISC | 8 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PC7410VG500LE | Teledyne e2v | Datasheet | - | - | Min: 1 Mult: 1 | YES | 360 | 133 MHz | TELEDYNE E2V (UK) LTD | CERAMIC, METAL-SEALED COFIRED | BGA | 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | BGA360,19X19,50 | SQUARE | GRID ARRAY | Obsolete | BGA | 1.9 V | 1.7 V | 1.8 V | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | compliant | 360 | S-CBGA-B360 | Not Qualified | 500 MHz | MICROPROCESSOR, RISC | 32 | 3.2 mm | 32 | YES | YES | 64 | FLOATING POINT | YES | 25 mm | 25 mm | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PC7410VG500LE | Atmel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 360 | 133 MHz | ATMEL CORP | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, BGA360,19X19,50 | BGA360,19X19,50 | SQUARE | GRID ARRAY | Transferred | BGA | 1.9 V | 1.7 V | 1.8 V | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 360 | S-CBGA-B360 | Not Qualified | 500 MHz | MICROPROCESSOR, RISC | 32 | 3.2 mm | 32 | YES | YES | 64 | FLOATING POINT | YES | 25 mm | 25 mm | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC8548VTATGA | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 783 | FREESCALE SEMICONDUCTOR INC | 3 | 105 °C | -40 °C | PLASTIC/EPOXY | BGA | 29 X 29 MM, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, FCBGA-783 | BGA783,28X28,40 | SQUARE | GRID ARRAY | Obsolete | BGA | Yes | 1.155 V | 1.045 V | 1.1 V | 8542.31.00.01 | BOTTOM | BALL | 260 | 1 mm | not_compliant | 40 | 783 | S-PBGA-B783 | Not Qualified | SoC | 3.38 mm | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TMPZ84C00AP-10 | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 10 MHz | TOSHIBA CORP | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | DIP | 5.5 V | 4.5 V | 5 V | BUILT-IN REFRESH CIRCUIT FOR DYNAMIC MEMORY | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | 40 | R-PDIP-T40 | Not Qualified | INDUSTRIAL | 10 MHz | MICROPROCESSOR | 50 mA | 8 | 4.8 mm | 16 | NO | YES | 8 | FIXED POINT | NO | 0 | 2 | 50.7 mm | 15.24 mm | |||||||||||||||||||||||||||||
![]() | Mfr Part No XPC860ENZP66C1 | Motorola Mobility LLC | Datasheet | - | - | Min: 1 Mult: 1 | YES | 357 | 66 MHz | MOTOROLA INC | PLASTIC/EPOXY | BGA | BGA, BGA357,19X19,50 | BGA357,19X19,50 | SQUARE | GRID ARRAY | Obsolete | BGA | No | 3.465 V | 3.135 V | 3.3 V | e0 | 3A991.A.2 | TIN LEAD | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 357 | S-PBGA-B357 | Not Qualified | 66 MHz | MICROPROCESSOR, RISC | 32 | 2.05 mm | 32 | 32 | 25 mm | 25 mm | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC68LC060FE50 | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | 50 MHz | FREESCALE SEMICONDUCTOR INC | CERAMIC, METAL-SEALED COFIRED | QFP | QFP, | SQUARE | FLATPACK | Obsolete | QFP | 3.465 V | 3.135 V | 3.3 V | 3A991.A.2 | 8542.31.00.01 | QUAD | GULL WING | 2.54 mm | unknown | 208 | S-CQFP-G208 | Not Qualified | 50 MHz | MICROPROCESSOR | 32 | 4.15 mm | 32 | YES | NO | 32 | FLOATING POINT | YES | 27.305 mm | 27.305 mm | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IBM27-82353B | IBM | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AM6232ATGGHIALWR | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 425-VFBGA, FCCSPBGA | 425-FCCSP (13x13) | -40°C ~ 125°C (TJ) | Tape & Reel (TR) | Sitara™ | Active | 1.4GHz | ARM® Cortex®-A53 | 1.1V, 1.2V, 1.8V, 3.3V | 10/100/1000Mbps (2) | 2 Core, 64-Bit | No | DDR4, LPDDR4 | USB 2.0 (2) | DMA, GPIO, I2C, I2S, MMC/SD, QSPI, SPDIF, SPI, TDM, UART/USART | ARM® Cortex®-M4F, ARM® Cortex®-R5F, Multimedia; NEON™ | AES, ARM TZ, Cryptography, DRBG, ECC, MD5, PKA, Random Number Generator, RSA, Secure Boot, SHA2, SMS | LVDS, MIPI/CSI, MIPI-DPI, OLDI | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PR3000A-33MQ160C | Pyramid Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 160 | 66 MHz | PERFORMANCE SEMICONDUCTOR CORP | 70 °C | PLASTIC/EPOXY | QFP | QFP, QFP160,1.2SQ | QFP160,1.2SQ | SQUARE | FLATPACK | Obsolete | QFP | No | 5.25 V | 4.75 V | 5 V | e0 | 3A991.A.2 | TIN LEAD | 28 VAX MIPS; 5 PIPELINE STAGES | 8542.31.00.01 | QUAD | GULL WING | 0.64 mm | unknown | 160 | S-PQFP-G160 | Not Qualified | COMMERCIAL | 33 MHz | MICROPROCESSOR, RISC | 700 mA | 32 | 3.85 mm | 32 | NO | NO | 32 | FIXED POINT | NO | 0 | 6 | 27.65 mm | 27.65 mm | |||||||||||||||||||||||||
![]() | Mfr Part No XPC860DPZP66D3 | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 357 | 66 MHz | FREESCALE SEMICONDUCTOR INC | PLASTIC/EPOXY | BGA | BGA, BGA357,19X19,50 | BGA357,19X19,50 | SQUARE | GRID ARRAY | Obsolete | BGA | 3.465 V | 3.135 V | 3.3 V | 5A991 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 357 | S-PBGA-B357 | Not Qualified | 66 MHz | MICROPROCESSOR, RISC | 32 | 2.05 mm | 32 | YES | YES | 32 | FIXED POINT | YES | 25 mm | 25 mm |
HW8076504489901SRH4E
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
S32G398ASBK1VUCT
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
SME1430LGA-440
Sun Microsystems Inc
Package:Embedded - Microprocessors
Price: please inquire
TMPZ84C011AF-6
Toshiba America Electronic Components
Package:Embedded - Microprocessors
Price: please inquire
PPC440GX-3CF533C
Applied Micro Circuits Corporation
Package:Embedded - Microprocessors
Price: please inquire
P1750A-15CMB
Pyramid Semiconductor Corporation
Package:Embedded - Microprocessors
Price: please inquire
MC68030RC25B
Motorola Semiconductor Products
Package:Embedded - Microprocessors
Price: please inquire
TMP68HC000F-12
Toshiba America Electronic Components
Package:Embedded - Microprocessors
Price: please inquire
PPC440SP-RNC533C
Applied Micro Circuits Corporation
Package:Embedded - Microprocessors
Price: please inquire
MC6800CL
Freescale Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
PC7410VG500LE
Teledyne e2v
Package:Embedded - Microprocessors
Price: please inquire
PC7410VG500LE
Atmel Corporation
Package:Embedded - Microprocessors
Price: please inquire
MPC8548VTATGA
Freescale Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
TMPZ84C00AP-10
Toshiba America Electronic Components
Package:Embedded - Microprocessors
Price: please inquire
XPC860ENZP66C1
Motorola Mobility LLC
Package:Embedded - Microprocessors
Price: please inquire
MC68LC060FE50
Freescale Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
IBM27-82353B
IBM
Package:Embedded - Microprocessors
Price: please inquire
AM6232ATGGHIALWR
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
PR3000A-33MQ160C
Pyramid Semiconductor Corporation
Package:Embedded - Microprocessors
Price: please inquire
XPC860DPZP66D3
Freescale Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
