The category is 'Embedded - Microprocessors'

  • All Manufacturers
  • Package / Case
  • Packaging
  • Moisture Sensitivity Level (MSL)
  • RoHS Status
  • Core Processor
  • Graphics Acceleration
  • Number of Cores/Bus Width
  • Operating Temperature
  • Part Status
  • RAM Controllers
  • Series
  • USB

Image

Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Mounting Type

Package / Case

Surface Mount

Supplier Device Package

Number of Terminals

Clock Frequency-Max

Ihs Manufacturer

Moisture Sensitivity Levels

Operating Temperature-Max

Operating Temperature-Min

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part Life Cycle Code

Part Package Code

Rohs Code

Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom

Operating Temperature

Packaging

Series

JESD-609 Code

Pbfree Code

Part Status

ECCN Code

Terminal Finish

Additional Feature

HTS Code

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Terminal Pitch

Reach Compliance Code

Time@Peak Reflow Temperature-Max (s)

Pin Count

JESD-30 Code

Qualification Status

Temperature Grade

Speed

uPs/uCs/Peripheral ICs Type

Core Processor

Supply Current-Max

Bit Size

Seated Height-Max

Address Bus Width

Boundary Scan

Low Power Mode

Screening Level

External Data Bus Width

Format

Integrated Cache

RAM (words)

Voltage - I/O

Ethernet

Number of Cores/Bus Width

Graphics Acceleration

RAM Controllers

USB

Additional Interfaces

Co-Processors/DSP

Number of External Interrupts

Security Features

Display & Interface Controllers

Length

Width

HW8076504489901SRH4E

Mfr Part No

HW8076504489901SRH4E

Intel Corporation Datasheet

-

-

Min: 1

Mult: 1

S32G398ASBK1VUCT

Mfr Part No

S32G398ASBK1VUCT

NXP USA Inc. Datasheet

-

-

Min: 1

Mult: 1

Tray

Active

SME1430LGA-440

Mfr Part No

SME1430LGA-440

Sun Microsystems Inc Datasheet

-

-

Min: 1

Mult: 1

YES

587

66 MHz

SUN MICROSYSTEMS INC

CERAMIC, METAL-SEALED COFIRED

BGA

BGA, BGA587,28X28,50

BGA587,28X28,50

SQUARE

GRID ARRAY

Obsolete

LGA

1.96 V

1.84 V

1.9 V

3A991.A.2

8542.31.00.01

BOTTOM

BALL

1.27 mm

unknown

587

S-CBGA-B587

Not Qualified

440 MHz

MICROPROCESSOR, RISC

10500 mA

64

4.35 mm

32

YES

NO

32

FLOATING POINT

YES

37.5 mm

37.5 mm

TMPZ84C011AF-6

Mfr Part No

TMPZ84C011AF-6

Toshiba America Electronic Components Datasheet

-

-

Min: 1

Mult: 1

YES

100

12.12 MHz

TOSHIBA CORP

85 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP,

RECTANGULAR

FLATPACK

Obsolete

QFP

No

5.5 V

2.7 V

5 V

e0

TIN LEAD

8542.31.00.01

QUAD

GULL WING

0.65 mm

unknown

100

R-PQFP-G100

Not Qualified

INDUSTRIAL

6.144 MHz

MICROPROCESSOR

30 mA

8

3.05 mm

16

NO

YES

8

FIXED POINT

NO

0

2

20 mm

14 mm

PPC440GX-3CF533C

Mfr Part No

PPC440GX-3CF533C

Applied Micro Circuits Corporation Datasheet

-

-

Min: 1

Mult: 1

YES

552

83 MHz

APPLIED MICRO CIRCUITS CORP

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

BGA

BGA, BGA552,24X24,40

BGA552,24X24,40

SQUARE

GRID ARRAY

Obsolete

BGA

No

1.6 V

1.4 V

1.5 V

3A991.A.2

ALSO REQUIRES 3.3V SUPPLY

8542.31.00.01

BOTTOM

BALL

NOT SPECIFIED

1 mm

compliant

NOT SPECIFIED

552

S-CBGA-B552

Not Qualified

INDUSTRIAL

533 MHz

MICROPROCESSOR, RISC

2200 mA

32

3.977 mm

64

YES

NO

64

FIXED POINT

YES

25 mm

25 mm

P1750A-15CMB

Mfr Part No

P1750A-15CMB

Pyramid Semiconductor Corporation Datasheet

-

-

Min: 1

Mult: 1

NO

64

15 MHz

PYRAMID SEMICONDUCTOR CORP

125 °C

-55 °C

UNSPECIFIED

DIP

BRAZE, DIP-64

RECTANGULAR

IN-LINE

Active

DIP

No

5.5 V

4.5 V

5 V

No

3A001.A.2.C

TWO PROGRAMMABLE TIMERS

8542.31.00.01

DUAL

THROUGH-HOLE

NOT SPECIFIED

1.27 mm

compliant

NOT SPECIFIED

64

R-XDIP-T64

Not Qualified

MILITARY

15 MHz

MICROPROCESSOR

16

4.191 mm

16

NO

YES

MIL-STD-883 Class B

16

FLOATING POINT

NO

42.2402 mm

15.24 mm

MC68030RC25B

Mfr Part No

MC68030RC25B

Motorola Semiconductor Products Datasheet

-

-

Min: 1

Mult: 1

TMP68HC000F-12

Mfr Part No

TMP68HC000F-12

Toshiba America Electronic Components Datasheet

-

-

Min: 1

Mult: 1

YES

64

12.5 MHz

TOSHIBA CORP

70 °C

PLASTIC/EPOXY

QFP

QFP,

RECTANGULAR

FLATPACK

Obsolete

QFP

No

5.25 V

4.75 V

5 V

e0

TIN LEAD

8542.31.00.01

QUAD

GULL WING

1 mm

unknown

64

R-PQFP-G64

Not Qualified

COMMERCIAL

12.5 MHz

MICROPROCESSOR

35 mA

16

3.05 mm

23

NO

YES

16

FIXED POINT

NO

0

7

20 mm

14 mm

PPC440SP-RNC533C

Mfr Part No

PPC440SP-RNC533C

Applied Micro Circuits Corporation Datasheet

-

-

Min: 1

Mult: 1

YES

783

666.66 MHz

APPLIED MICRO CIRCUITS CORP

PLASTIC/EPOXY

BGA

BGA, BGA783,28X28,40

BGA783,28X28,40

SQUARE

GRID ARRAY

Obsolete

BGA

Yes

1.6 V

1.4 V

1.5 V

3A991.A.2

8542.31.00.01

BOTTOM

BALL

NOT SPECIFIED

1 mm

compliant

NOT SPECIFIED

783

S-PBGA-B783

Not Qualified

533 MHz

MICROPROCESSOR, RISC

3000 mA

32

3.27 mm

32

YES

YES

64

FIXED POINT

YES

29 mm

29 mm

MC6800CL

Mfr Part No

MC6800CL

Freescale Semiconductor Datasheet

-

-

Min: 1

Mult: 1

NO

40

MOTOROLA SEMICONDUCTOR PRODUCTS

85 °C

-40 °C

CERAMIC

DIP

DIP, DIP40,.6

DIP40,.6

RECTANGULAR

IN-LINE

Obsolete

No

e0

Tin/Lead (Sn/Pb)

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-XDIP-T40

Not Qualified

INDUSTRIAL

1 MHz

MICROPROCESSOR, RISC

8

PC7410VG500LE

Mfr Part No

PC7410VG500LE

Teledyne e2v Datasheet

-

-

Min: 1

Mult: 1

YES

360

133 MHz

TELEDYNE E2V (UK) LTD

CERAMIC, METAL-SEALED COFIRED

BGA

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

BGA360,19X19,50

SQUARE

GRID ARRAY

Obsolete

BGA

1.9 V

1.7 V

1.8 V

3A991.A.2

8542.31.00.01

BOTTOM

BALL

1.27 mm

compliant

360

S-CBGA-B360

Not Qualified

500 MHz

MICROPROCESSOR, RISC

32

3.2 mm

32

YES

YES

64

FLOATING POINT

YES

25 mm

25 mm

PC7410VG500LE

Mfr Part No

PC7410VG500LE

Atmel Corporation Datasheet

-

-

Min: 1

Mult: 1

YES

360

133 MHz

ATMEL CORP

CERAMIC, METAL-SEALED COFIRED

BGA

BGA, BGA360,19X19,50

BGA360,19X19,50

SQUARE

GRID ARRAY

Transferred

BGA

1.9 V

1.7 V

1.8 V

3A991.A.2

8542.31.00.01

BOTTOM

BALL

1.27 mm

unknown

360

S-CBGA-B360

Not Qualified

500 MHz

MICROPROCESSOR, RISC

32

3.2 mm

32

YES

YES

64

FLOATING POINT

YES

25 mm

25 mm

MPC8548VTATGA

Mfr Part No

MPC8548VTATGA

Freescale Semiconductor Datasheet

-

-

Min: 1

Mult: 1

YES

783

FREESCALE SEMICONDUCTOR INC

3

105 °C

-40 °C

PLASTIC/EPOXY

BGA

29 X 29 MM, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, FCBGA-783

BGA783,28X28,40

SQUARE

GRID ARRAY

Obsolete

BGA

Yes

1.155 V

1.045 V

1.1 V

8542.31.00.01

BOTTOM

BALL

260

1 mm

not_compliant

40

783

S-PBGA-B783

Not Qualified

SoC

3.38 mm

29 mm

29 mm

TMPZ84C00AP-10

Mfr Part No

TMPZ84C00AP-10

Toshiba America Electronic Components Datasheet

-

-

Min: 1

Mult: 1

NO

40

10 MHz

TOSHIBA CORP

85 °C

-40 °C

PLASTIC/EPOXY

DIP

DIP,

RECTANGULAR

IN-LINE

Obsolete

DIP

5.5 V

4.5 V

5 V

BUILT-IN REFRESH CIRCUIT FOR DYNAMIC MEMORY

8542.31.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

40

R-PDIP-T40

Not Qualified

INDUSTRIAL

10 MHz

MICROPROCESSOR

50 mA

8

4.8 mm

16

NO

YES

8

FIXED POINT

NO

0

2

50.7 mm

15.24 mm

XPC860ENZP66C1

Mfr Part No

XPC860ENZP66C1

Motorola Mobility LLC Datasheet

-

-

Min: 1

Mult: 1

YES

357

66 MHz

MOTOROLA INC

PLASTIC/EPOXY

BGA

BGA, BGA357,19X19,50

BGA357,19X19,50

SQUARE

GRID ARRAY

Obsolete

BGA

No

3.465 V

3.135 V

3.3 V

e0

3A991.A.2

TIN LEAD

8542.31.00.01

BOTTOM

BALL

1.27 mm

unknown

357

S-PBGA-B357

Not Qualified

66 MHz

MICROPROCESSOR, RISC

32

2.05 mm

32

32

25 mm

25 mm

MC68LC060FE50

Mfr Part No

MC68LC060FE50

Freescale Semiconductor Datasheet

-

-

Min: 1

Mult: 1

YES

208

50 MHz

FREESCALE SEMICONDUCTOR INC

CERAMIC, METAL-SEALED COFIRED

QFP

QFP,

SQUARE

FLATPACK

Obsolete

QFP

3.465 V

3.135 V

3.3 V

3A991.A.2

8542.31.00.01

QUAD

GULL WING

2.54 mm

unknown

208

S-CQFP-G208

Not Qualified

50 MHz

MICROPROCESSOR

32

4.15 mm

32

YES

NO

32

FLOATING POINT

YES

27.305 mm

27.305 mm

IBM27-82353B

Mfr Part No

IBM27-82353B

IBM Datasheet

-

-

Min: 1

Mult: 1

AM6232ATGGHIALWR

Mfr Part No

AM6232ATGGHIALWR

Texas Instruments Datasheet

-

-

Min: 1

Mult: 1

Surface Mount

425-VFBGA, FCCSPBGA

425-FCCSP (13x13)

-40°C ~ 125°C (TJ)

Tape & Reel (TR)

Sitara™

Active

1.4GHz

ARM® Cortex®-A53

1.1V, 1.2V, 1.8V, 3.3V

10/100/1000Mbps (2)

2 Core, 64-Bit

No

DDR4, LPDDR4

USB 2.0 (2)

DMA, GPIO, I2C, I2S, MMC/SD, QSPI, SPDIF, SPI, TDM, UART/USART

ARM® Cortex®-M4F, ARM® Cortex®-R5F, Multimedia; NEON™

AES, ARM TZ, Cryptography, DRBG, ECC, MD5, PKA, Random Number Generator, RSA, Secure Boot, SHA2, SMS

LVDS, MIPI/CSI, MIPI-DPI, OLDI

PR3000A-33MQ160C

Mfr Part No

PR3000A-33MQ160C

Pyramid Semiconductor Corporation Datasheet

-

-

Min: 1

Mult: 1

YES

160

66 MHz

PERFORMANCE SEMICONDUCTOR CORP

70 °C

PLASTIC/EPOXY

QFP

QFP, QFP160,1.2SQ

QFP160,1.2SQ

SQUARE

FLATPACK

Obsolete

QFP

No

5.25 V

4.75 V

5 V

e0

3A991.A.2

TIN LEAD

28 VAX MIPS; 5 PIPELINE STAGES

8542.31.00.01

QUAD

GULL WING

0.64 mm

unknown

160

S-PQFP-G160

Not Qualified

COMMERCIAL

33 MHz

MICROPROCESSOR, RISC

700 mA

32

3.85 mm

32

NO

NO

32

FIXED POINT

NO

0

6

27.65 mm

27.65 mm

XPC860DPZP66D3

Mfr Part No

XPC860DPZP66D3

Freescale Semiconductor Datasheet

-

-

Min: 1

Mult: 1

YES

357

66 MHz

FREESCALE SEMICONDUCTOR INC

PLASTIC/EPOXY

BGA

BGA, BGA357,19X19,50

BGA357,19X19,50

SQUARE

GRID ARRAY

Obsolete

BGA

3.465 V

3.135 V

3.3 V

5A991

8542.31.00.01

BOTTOM

BALL

1.27 mm

unknown

357

S-PBGA-B357

Not Qualified

66 MHz

MICROPROCESSOR, RISC

32

2.05 mm

32

YES

YES

32

FIXED POINT

YES

25 mm

25 mm