The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Packaging | Series | JESD-609 Code | Part Status | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Speed | uPs/uCs/Peripheral ICs Type | Supply Current-Max | Bit Size | Seated Height-Max | Address Bus Width | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | RAM (words) | Number of External Interrupts | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No TMPM4KNFYFG | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | TOSHIBA CORP | , | Not Recommended | 8542.31.00.01 | unknown | MICROPROCESSOR, RISC | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 212816 | EECO Switch | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IBMPPC750GXECB5H82B | IBM | Datasheet | - | - | Min: 1 Mult: 1 | Bulk | * | Active | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IBM25PPC750FX-GB0532V | IBM | Datasheet | - | - | Min: 1 Mult: 1 | Bulk | * | Active | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BX80551PE2666FN | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 775 | INTEL CORP | PLASTIC/EPOXY | LGA | LGA, LGA775,30X33,46/43 | LGA775,30X33,46/43 | RECTANGULAR | GRID ARRAY | Obsolete | 1.3 V | 3A991.A.1 | 8473.30.11.80 | BOTTOM | NO LEAD | 1.1 mm | unknown | R-PBGA-N775 | Not Qualified | 2.6 MHz | MICROPROCESSOR, RISC | 125000 mA | 32 | ||||||||||||||||||||||||||||||
![]() | Mfr Part No R6512AP | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 2 MHz | CONEXANT SYSTEMS | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.25 V | 4.75 V | 5 V | e0 | TIN LEAD | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | 40 | R-PDIP-T40 | Not Qualified | COMMERCIAL | 2 MHz | MICROPROCESSOR | 133 mA | 8 | 5.08 mm | 16 | NO | NO | 8 | FIXED POINT | NO | 0 | 2 | 52.07 mm | 15.24 mm | ||||||||||
![]() | Mfr Part No R6512AP | Rockwell Automation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | ROCKWELL AUTOMATION | 70 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Contact Manufacturer | 5.25 V | 4.75 V | 5 V | 8542.31.00.01 | DUAL | THROUGH-HOLE | compliant | R-PDIP-T40 | COMMERCIAL | 2 MHz | MICROPROCESSOR | 8 | 16 | NO | NO | 8 | FIXED POINT | NO | |||||||||||||||||||||||||
![]() | Mfr Part No TMS9981JDL | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | TEXAS INSTRUMENTS INC | 70 °C | CERAMIC | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 8542.31.00.01 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 2.54 mm | not_compliant | NOT SPECIFIED | R-XDIP-T40 | Not Qualified | COMMERCIAL | MICROPROCESSOR | 16 | |||||||||||||||||||||||||||||
![]() | Mfr Part No AM29040-66KC | AMD | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XPC755BRX300LB | Motorola Semiconductor Products | Datasheet | - | - | Min: 1 Mult: 1 | YES | 360 | 300 MHz | MOTOROLA INC | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | 2.1 V | 1.9 V | 2 V | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | S-CBGA-B360 | Not Qualified | 300 MHz | MICROPROCESSOR, RISC | 32 | 3.2 mm | 32 | YES | YES | 64 | FLOATING POINT | YES | 25 mm | 25 mm | ||||||||||||||||||||
![]() | Mfr Part No QLPXA262B1C200 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 294 | 3.6864 MHz | INTEL CORP | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | BGA | 1.1 V | 0.95 V | 1 V | 8542.31.00.01 | BOTTOM | BALL | unknown | 294 | S-PBGA-B294 | Not Qualified | 200 MHz | MICROPROCESSOR, RISC | 32 | 26 | YES | YES | 32 | FIXED POINT | YES | |||||||||||||||||||||||
![]() | Mfr Part No BCM1455 | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | BROADCOM CORP | , | Obsolete | No | 8542.31.00.01 | compliant | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AMD-K6-2/333AFR | AMD | Datasheet | - | - | Min: 1 Mult: 1 | NO | 321 | 333 MHz | ADVANCED MICRO DEVICES INC | 70 °C | CERAMIC, METAL-SEALED COFIRED | IPGA | IPGA, SPGA321,37X37 | SPGA321,37X37 | SQUARE | GRID ARRAY, INTERSTITIAL PITCH | Obsolete | PGA | No | 2.3 V | 2.1 V | 2.2 V | e0 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | 321 | S-CPGA-P321 | Not Qualified | COMMERCIAL | 333 MHz | MICROPROCESSOR, RISC | 32 | 3.63 mm | 32 | YES | YES | 64 | FLOATING POINT | NO | 49.53 mm | 49.53 mm | ||||||||||||
![]() | Mfr Part No MPC8245LZU266B | Motorola Mobility LLC | Datasheet | - | - | Min: 1 Mult: 1 | YES | 352 | 66 MHz | MOTOROLA INC | PLASTIC/EPOXY | LBGA | LBGA, BGA352,26X26,50 | BGA352,26X26,50 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | BGA | 1.9 V | 1.7 V | 1.8 V | 3A991.A.2 | ALSO OPERATES AT 2V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 352 | S-PBGA-B352 | Not Qualified | 266 MHz | MICROPROCESSOR, RISC | 32 | 1.65 mm | 32 | YES | YES | 32 | FLOATING POINT | YES | 35 mm | 35 mm | ||||||||||||||||
![]() | Mfr Part No 5962-8766501XA | Pyramid Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 64 | 15 MHz | PYRAMID SEMICONDUCTOR CORP | 125 °C | -55 °C | UNSPECIFIED | DIP | DIP, SDIP64,.6,50 | SDIP64,.6,50 | RECTANGULAR | IN-LINE | Active | DIP | 5.5 V | 4.5 V | 5 V | e0 | 3A001.A.2.C | TIN LEAD | 8542.31.00.01 | DUAL | THROUGH-HOLE | 1.27 mm | compliant | 64 | R-XDIP-T64 | Not Qualified | MILITARY | 15 MHz | MICROPROCESSOR | 40 mA | 16 | 16 | NO | YES | 38535Q/M;38534H;883B | 16 | FLOATING POINT | NO | |||||||||||||
![]() | Mfr Part No PRIXP423ABB | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 492 | INTEL CORP | 70 °C | PLASTIC/EPOXY | BGA | BGA492,26X26,50 | SQUARE | GRID ARRAY | Obsolete | Yes | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | S-PBGA-B492 | Not Qualified | COMMERCIAL | MICROPROCESSOR, RISC | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No IBM25PPC750FX-GB2523T | IBM | Datasheet | - | - | Min: 1 Mult: 1 | YES | 292 | 200 MHz | IBM MICROELECTRONICS | CERAMIC, METAL-SEALED COFIRED | BGA | 21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292 | BGA292,20X20,40 | SQUARE | GRID ARRAY | Obsolete | BGA | No | 1.5 V | 1.4 V | 1.45 V | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1 mm | not_compliant | 292 | S-CBGA-B292 | Not Qualified | 800 MHz | MICROPROCESSOR, RISC | 32 | 3.087 mm | 32 | YES | YES | 64 | FLOATING POINT | YES | 21.02 mm | 21.02 mm | ||||||||||||||||
![]() | Mfr Part No IBM25PPC750GXECR5522V | IBM | Datasheet | - | - | Min: 1 Mult: 1 | Bulk | * | Active | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No I7-860 | Intel Corporation | Datasheet | 1824 | - | Min: 1 Mult: 1 | INTEL CORP | , | Obsolete | 8542.31.00.01 | compliant | MICROPROCESSOR | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IM6100AIDL | General Electric Solid State | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | GENERAL ELECTRIC SOLID STATE | 85 °C | -40 °C | CERAMIC | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T40 | Not Qualified | INDUSTRIAL | 5.71 MHz | MICROPROCESSOR, RISC | 12 |
TMPM4KNFYFG
Toshiba America Electronic Components
Package:Embedded - Microprocessors
Price: please inquire
212816
EECO Switch
Package:Embedded - Microprocessors
Price: please inquire
IBMPPC750GXECB5H82B
IBM
Package:Embedded - Microprocessors
Price: please inquire
IBM25PPC750FX-GB0532V
IBM
Package:Embedded - Microprocessors
Price: please inquire
BX80551PE2666FN
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
R6512AP
Conexant Systems Inc
Package:Embedded - Microprocessors
Price: please inquire
R6512AP
Rockwell Automation
Package:Embedded - Microprocessors
Price: please inquire
TMS9981JDL
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
AM29040-66KC
AMD
Package:Embedded - Microprocessors
Price: please inquire
XPC755BRX300LB
Motorola Semiconductor Products
Package:Embedded - Microprocessors
Price: please inquire
QLPXA262B1C200
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
BCM1455
Broadcom Limited
Package:Embedded - Microprocessors
Price: please inquire
AMD-K6-2/333AFR
AMD
Package:Embedded - Microprocessors
Price: please inquire
MPC8245LZU266B
Motorola Mobility LLC
Package:Embedded - Microprocessors
Price: please inquire
5962-8766501XA
Pyramid Semiconductor Corporation
Package:Embedded - Microprocessors
Price: please inquire
PRIXP423ABB
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
IBM25PPC750FX-GB2523T
IBM
Package:Embedded - Microprocessors
Price: please inquire
IBM25PPC750GXECR5522V
IBM
Package:Embedded - Microprocessors
Price: please inquire
I7-860
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
IM6100AIDL
General Electric Solid State
Package:Embedded - Microprocessors
Price: please inquire
