The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
- All Manufacturers
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Memory Types | Number of I/Os | Operating Temperature (Max.) | ROM(word) | Watchdog Timers | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | CPU Family | Max Frequency | Boundary Scan | Low Power Mode | External Data Bus Width | Number of Programmable I/O | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Number of ADC Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | ROM Programmability | Number of Cores | Number of I2C Channels | Security Features | Display & Interface Controllers | Number of SPI Channels | SATA | Number of Ethernet Channels | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
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 | Mfr Part No AT91SAM9XE256-QU | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 208-BFQFP | 208 | 208-PQFP (28x28) | FLASH, ROM | 96 | Yes | -40°C~85°C TA | Tray | 2010 | SAM9XE | Obsolete | 3 (168 Hours) | 85°C | -40°C | 180MHz | AT91SAM9XE256 | 3.3V | 2-Wire, EBI/EMI, Ethernet, I2C, I2S, MMC, SPI, UART, USART, USB | 3.6V | 1.65V | 32kB | Internal | 180MHz | 32kB | ARM926EJ-S | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 32b | 6 | ARM | 180MHz | 96 | 1.8V 2.5V 3.3V | 1 | 4 | 10/100Mbps | 1 Core 32-Bit | No | SDRAM, SRAM | USB 2.0 (3) | EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | 2 | LCD, Touchscreen | 2 | 1 | 3.6mm | 28mm | 28mm | No | No SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MCIMX6U6AVM10AC | NXP USA Inc. | Datasheet | 3 |
| Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | YES | -40°C~125°C TJ | Tray | 2017 | i.MX6DL | Active | 3 (168 Hours) | 624 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.8mm | NOT SPECIFIED | S-PBGA-B624 | 1.5V | 1.4V | 1GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8360CVVAJDGA | NXP USA Inc. | Datasheet | 84 | - | Min: 1 Mult: 1 | 12 Weeks | 740-LBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 740 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1mm | 40 | MPC8360 | S-PBGA-B740 | 1.35V | 1.8/2.53.3V | 1.15V | 533MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine | 1.69mm | 37.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AM1705DPTP3 | Texas Instruments | Datasheet | 8004 | - | Min: 1 Mult: 1 | 6 Weeks | ACTIVE (Last Updated: 2 days ago) | Gold | Surface Mount | 176-LQFP Exposed Pad | 176 | L1 Cache, RAM, ROM | 0°C~90°C TJ | Tube | Sitara™ | e4 | yes | Active | 4 (72 Hours) | 176 | QUAD | GULL WING | 260 | 1.3V | 0.5mm | 375MHz | AM1705 | 1.2V | Ethernet, I2C, SPI, UART, USB | 1.32V | 1.14V | 64kB | 128kB | MICROPROCESSOR, RISC | ARM926EJ-S | 32 | 32b | ARM | YES | YES | FIXED POINT | YES | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 2.0 + PHY (1) | I2C, McASP, SPI, MMC/SD, UART | System Control; CP15 | 1 | 1.6mm | 24mm | 24mm | 1.4mm | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8358EVRAGDDA | NXP USA Inc. | Datasheet | 1991 |
| Min: 1 Mult: 1 | 12 Weeks | 668-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 668 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8358 | S-PBGA-B668 | 1.26V | 1.21.8/2.52.5/3.3V | 1.14V | 400MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine, Security; SEC | Cryptography, Random Number Generator | 2.46mm | 29mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AM3352ZCZ60 | Texas Instruments | Datasheet | 132 | - | Min: 1 Mult: 1 | Copper, Silver, Tin | 324-LFBGA | YES | 324 | 1.713814g | Cache, RAM, ROM | 0°C~90°C TJ | Tray | Sitara™ | e1 | yes | Obsolete | 3 (168 Hours) | 324 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 0.8mm | 600MHz | AM3352 | 324 | 1.15V | CAN, Ethernet, I2C, SPI, UART, USB | 1.144V | 912mV | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | 16 | ARM | YES | YES | FIXED POINT | YES | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | Cryptography, Random Number Generator | LCD, Touchscreen | No | No SVHC | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8247ZQMIBA | NXP USA Inc. | Datasheet | 151 | - | Min: 1 Mult: 1 | 12 Weeks | 516-BBGA | YES | 57 | 0°C~105°C TA | Tray | 1994 | MPC82xx | e0 | Last Time Buy | 3 (168 Hours) | 516 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | MPC8247 | S-PBGA-B516 | 1.575V | 1.53.3V | 1.425V | 266MHz | MICROCONTROLLER, RISC | PowerPC G2_LE | 66.7MHz | 32 | NO | YES | NO | 30 | 64 | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MCIMX6D6AVT10AC | NXP USA Inc. | Datasheet | 8000 | - | Min: 1 Mult: 1 | 15 Weeks | 624-FBGA, FCBGA | YES | -40°C~125°C TJ | Tray | 2002 | i.MX6D | e1 | Not For New Designs | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | MCIMX6 | S-PBGA-B624 | 1.5V | 1.35V | 1.0GHz | MICROPROCESSOR | ARM® Cortex®-A9 | 24MHz | YES | YES | FLOATING POINT | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MCIMX7D2DVK12SC | NXP USA Inc. | Datasheet | 4 |
| Min: 1 Mult: 1 | 18 Weeks | 488-TFBGA | YES | 0°C~85°C TJ | Tray | 2012 | i.MX7D | Active | 3 (168 Hours) | 488 | BOTTOM | BALL | 260 | 1.225V | 0.4mm | 40 | S-PBGA-B488 | 1.25V | 1.2V | 1.2GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7, ARM® Cortex®-M4 | 32 | 26 | YES | YES | 16 | FLOATING POINT | YES | 1.8V 3.3V | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | 1.1mm | 12mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8313VRAGDC | NXP USA Inc. | Datasheet | 45 | - | Min: 1 Mult: 1 | 8 Weeks | 516-BBGA Exposed Pad | YES | 105°C | Tray | 2002 | e2 | Active | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8313 | S-PBGA-B516 | Not Qualified | 1.05V | 11.8/2.53.3V | OTHER | 0.95V | 400 MHz | MICROPROCESSOR, RISC | 32 | 15 | YES | YES | 32 | FLOATING POINT | YES | 2.55mm | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AM3703CBPD100 | Texas Instruments | Datasheet | 80 |
| Min: 1 Mult: 1 | NRND (Last Updated: 3 days ago) | Copper, Silver, Tin | 515-WFBGA, FCBGA | YES | 515 | ROM | -40°C~90°C TJ | Tray | Sitara™ | e1 | yes | Not For New Designs | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 1GHz | AM3703 | 515 | 1.1V | 1.8V | I2C, SPI, UART, USB | 1.5V | 32kB | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | ARM | YES | YES | FLOATING POINT | YES | 65536 | 4 | 1 Core 32-Bit | No | SDRAM | USB 2.0 (4) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | LCD | 700μm | 12mm | 12mm | 500μm | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No T1042NXE7WQB | NXP USA Inc. | Datasheet | 2232 |
| Min: 1 Mult: 1 | 18 Weeks | 780-FBGA, FCBGA | YES | -40°C~105°C TA | 2014 | QorIQ T1 | Active | 3 (168 Hours) | 780 | 5A002.A.1 | 8542.31.00.01 | BOTTOM | BALL | 250 | 1V | 0.8mm | S-PBGA-B780 | 1.03V | 0.97V | 1.5GHz | MICROPROCESSOR, RISC | PowerPC e5500 | 133.3MHz | 32 | 16 | YES | YES | 64 | FIXED POINT | YES | 1Gbps (5) | 4 Core 64-Bit | No | DDR3L, DDR4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | SATA 3Gbps (2) | 2.07mm | 23mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MVF50NN151CMK50 | NXP USA Inc. | Datasheet | 360 |
| Min: 1 Mult: 1 | 15 Weeks | 364-LFBGA | YES | 131 | 0 | -40°C~85°C TA | Tray | 2002 | Vybrid, VF5xx | e1 | Active | 3 (168 Hours) | 364 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.23V | 0.8mm | 40 | MVF50NN151 | S-PBGA-B364 | Not Qualified | 1.26V | 3.3V | 1.16V | 500MHz | MICROCONTROLLER, RISC | ARM® Cortex®-A5 | 16 | YES | YES | NO | YES | 16 | CORTEX-A5 | 16 | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | FLASH | DCU, GPU, LCD, VideoADC, VIU | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC8313VRAFFB | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | 0°C~105°C TA | Tray | 2008 | MPC83xx | Obsolete | 3 (168 Hours) | MPC8313 | 333MHz | PowerPC e300c3 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC860TZQ50D4 | NXP USA Inc. | Datasheet | 1 | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MC9328MX21CVK | NXP USA Inc. | Datasheet | 36 | - | Min: 1 Mult: 1 | 15 Weeks | 289-LFBGA | YES | -40°C~85°C TA | Tray | 2006 | i.MX21 | e1 | Not For New Designs | 3 (168 Hours) | 289 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 0.65mm | 40 | MC9328MX21 | S-PBGA-B289 | 1.65V | 1.45V | 266MHz | MICROPROCESSOR | ARM926EJ-S | 32MHz | 32 | 26 | YES | YES | 32 | FIXED POINT | YES | 1.8V 3.0V | 1 Core 32-Bit | No | SDRAM | USB 1.x (2) | 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART | Keypad, LCD | 1.49mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MCIMX6D5EYM10ADR | NXP USA Inc. | Datasheet | 80000 | - | Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA, FCBGA | -20°C~105°C TJ | Tape & Reel (TR) | 2011 | i.MX6D | Active | 3 (168 Hours) | 1.0GHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8280CZUUPEA | NXP USA Inc. | Datasheet | 158 | - | Min: 1 Mult: 1 | 18 Weeks | 480-LBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 1994 | MPC82xx | e0 | Active | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | 40 | MPC8280 | S-PBGA-B480 | 1.6V | 1.53.3V | 1.45V | 450MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | 100MHz | 32 | 32 | YES | NO | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC8250ACZUMHBC | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 480-LBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 1997 | MPC82xx | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | 30 | MPC8250 | S-PBGA-B480 | 2.2V | 1.9V | 266MHz | MICROPROCESSOR, RISC | PowerPC G2 | 32 | 32 | YES | NO | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AT91SAM9CN12B-CFUR | Microchip Technology | Datasheet | 4 |
| Min: 1 Mult: 1 | 9 Weeks | Copper, Silver, Tin | Surface Mount | 247-LFBGA | 247 | 205.307246mg | L1 Cache, ROM, SRAM | 105 | Yes | -40°C~85°C TA | Tape & Reel (TR) | 2004 | SAM9CN | e1 | yes | Active | 3 (168 Hours) | 247 | TIN SILVER COPPER | BOTTOM | BALL | 1V | 0.5mm | 400MHz | AT91SAM9CN | 2-Wire, EBI/EMI, I2C, SPI, Serial, UART, USART, USB | 1.1V | 900mV | 128kB | Internal | 32kB | MICROPROCESSOR, RISC | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | 32 | 32b | 2 | 26 | ARM | YES | YES | FIXED POINT | YES | 1.8V 3.3V | 1 Core 32-Bit | No | LPDDR, LPDDR2, DDR2, SDR, SRAM | USB 2.0 (2) | EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | 1 | LCD, Touchscreen | ROHS3 Compliant |
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AT91SAM9XE256-QU
Microchip Technology
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6U6AVM10AC
NXP USA Inc.
Package:Embedded - Microprocessors
56.164066
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MPC8360CVVAJDGA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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AM1705DPTP3
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
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MPC8358EVRAGDDA
NXP USA Inc.
Package:Embedded - Microprocessors
115.189623
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AM3352ZCZ60
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
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MPC8247ZQMIBA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6D6AVT10AC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX7D2DVK12SC
NXP USA Inc.
Package:Embedded - Microprocessors
15.795873
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MPC8313VRAGDC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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AM3703CBPD100
Texas Instruments
Package:Embedded - Microprocessors
46.073026
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T1042NXE7WQB
NXP USA Inc.
Package:Embedded - Microprocessors
149.114042
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MVF50NN151CMK50
NXP USA Inc.
Package:Embedded - Microprocessors
25.475693
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MPC8313VRAFFB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC860TZQ50D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MC9328MX21CVK
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6D5EYM10ADR
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8280CZUUPEA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8250ACZUMHBC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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AT91SAM9CN12B-CFUR
Microchip Technology
Package:Embedded - Microprocessors
11.282537