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      Home / All Categories / Integrated Circuits (ICs) / Embedded - Microprocessors /

      The category is 'Embedded - Microprocessors'

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      • Part Status
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      Image

      Part Number

      Manufacturer

      Datasheet

      Availability

      Pricing(USD)

      Quantity

      RoHS

      Surface Mount

      Number of Terminals

      Clock Frequency-Max

      Date Of Intro

      Ihs Manufacturer

      Moisture Sensitivity Levels

      Operating Temperature-Max

      Operating Temperature-Min

      Package Body Material

      Package Code

      Package Description

      Package Equivalence Code

      Package Shape

      Package Style

      Part Life Cycle Code

      Part Package Code

      Rohs Code

      Supply Voltage-Max

      Supply Voltage-Min

      Supply Voltage-Nom

      Packaging

      Series

      JESD-609 Code

      Pbfree Code

      Part Status

      ECCN Code

      Terminal Finish

      Additional Feature

      HTS Code

      Terminal Position

      Terminal Form

      Peak Reflow Temperature (Cel)

      Terminal Pitch

      Reach Compliance Code

      Time@Peak Reflow Temperature-Max (s)

      Pin Count

      JESD-30 Code

      Qualification Status

      Temperature Grade

      Speed

      uPs/uCs/Peripheral ICs Type

      Supply Current-Max

      Bit Size

      Seated Height-Max

      Address Bus Width

      Boundary Scan

      Low Power Mode

      Screening Level

      External Data Bus Width

      Format

      Integrated Cache

      RAM (words)

      Number of External Interrupts

      Number of DMA Channels

      Saturation Current

      Length

      Width
      8155PP5

      Mfr Part No

      8155PP5

      		Hifn Inc Datasheet

      -

      -

      Min: 1

      Mult: 1

      YES

      576

      HIFN

      70 °C

      PLASTIC/EPOXY

      BGA

      BGA, BGA576,30X30,50

      BGA576,30X30,50

      SQUARE

      GRID ARRAY

      Transferred

      No

      e0

      Tin/Lead (Sn/Pb)

      8542.31.00.01

      BOTTOM

      BALL

      1.27 mm

      unknown

      S-PBGA-B576

      Not Qualified

      COMMERCIAL

      MPC8280CZUUPEA

      Mfr Part No

      MPC8280CZUUPEA

      		Rochester Electronics LLC Datasheet

      -

      -

      Min: 1

      Mult: 1

      YES

      480

      100 MHz

      ROCHESTER ELECTRONICS LLC

      70 °C

      PLASTIC/EPOXY

      LBGA

      37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, TBGA-480

      SQUARE

      GRID ARRAY, LOW PROFILE

      Active

      BGA

      No

      1.6 V

      1.45 V

      1.5 V

      e0

      No

      TIN LEAD

      ALSO REQUIRES 3.3V SUPPLY

      BOTTOM

      BALL

      260

      1.27 mm

      unknown

      40

      480

      S-PBGA-B480

      COMMERCIAL

      COMMERCIAL

      450 MHz

      MICROPROCESSOR, RISC

      32

      1.65 mm

      32

      YES

      NO

      64

      FLOATING POINT

      YES

      4

      37.5 mm

      37.5 mm

      TSPC603RMGU10LC

      Mfr Part No

      TSPC603RMGU10LC

      		Teledyne e2v Datasheet

      -

      -

      Min: 1

      Mult: 1

      YES

      255

      233 MHz

      E2V TECHNOLOGIES PLC

      125 °C

      -55 °C

      CERAMIC, METAL-SEALED COFIRED

      BGA

      BGA,

      SQUARE

      GRID ARRAY

      Obsolete

      BGA

      2.625 V

      2.375 V

      2.5 V

      3A991.A.2

      8542.31.00.01

      BOTTOM

      BALL

      1.27 mm

      unknown

      255

      S-CBGA-B255

      Not Qualified

      MILITARY

      233 MHz

      MICROPROCESSOR, RISC

      32

      3 mm

      32

      YES

      YES

      64

      FLOATING POINT

      YES

      21 mm

      21 mm

      TSPC603RMGU14LC

      Mfr Part No

      TSPC603RMGU14LC

      		Atmel Corporation Datasheet

      -

      -

      Min: 1

      Mult: 1

      YES

      255

      75 MHz

      ATMEL CORP

      125 °C

      -55 °C

      CERAMIC, METAL-SEALED COFIRED

      BGA

      BGA, BGA255,16X16,50

      BGA255,16X16,50

      SQUARE

      GRID ARRAY

      Transferred

      BGA

      No

      2.625 V

      2.375 V

      2.5 V

      e0

      3A991.A.2

      Tin/Lead (Sn/Pb)

      8542.31.00.01

      BOTTOM

      BALL

      1.27 mm

      unknown

      255

      S-CBGA-B255

      Not Qualified

      MILITARY

      300 MHz

      MICROPROCESSOR, RISC

      32

      3 mm

      32

      YES

      YES

      64

      FLOATING POINT

      YES

      21 mm

      21 mm

      IBM25PPC750FX-GB1033V

      Mfr Part No

      IBM25PPC750FX-GB1033V

      		IBM Datasheet

      -

      -

      Min: 1

      Mult: 1

      Bulk

      *

      Active

      SC1100UFH-233

      Mfr Part No

      SC1100UFH-233

      		AMD Datasheet

      -

      -

      Min: 1

      Mult: 1

      YES

      388

      27 MHz

      ADVANCED MICRO DEVICES INC

      3

      85 °C

      PLASTIC/EPOXY

      HBGA

      35 X 35 MM, 2.38 MM HEIGHT, 1.27 MM PITCH, MS-034BAR-2, TEPBGA-388

      BGA388,26X26,50

      SQUARE

      GRID ARRAY, HEAT SINK/SLUG

      Obsolete

      BGA

      No

      1.89 V

      1.71 V

      1.8 V

      e0

      3A991.A.2

      TIN LEAD

      8542.31.00.01

      BOTTOM

      BALL

      260

      1.27 mm

      not_compliant

      388

      S-PBGA-B388

      Not Qualified

      OTHER

      233 MHz

      MICROPROCESSOR

      32

      2.59 mm

      13

      YES

      YES

      64

      FLOATING POINT

      YES

      35 mm

      35 mm

      HW8076503693501

      Mfr Part No

      HW8076503693501

      		Intel Corporation Datasheet

      -

      -

      Min: 1

      Mult: 1

      2018-07-27

      INTEL CORP

      Active

      5A992.C

      8542.31.00.01

      compliant

      MICROPROCESSOR

      GWIXP465AE

      Mfr Part No

      GWIXP465AE

      		Intel Corporation Datasheet

      -

      -

      Min: 1

      Mult: 1

      YES

      544

      66 MHz

      INTEL CORP

      70 °C

      PLASTIC/EPOXY

      HBGA

      HBGA, BGA544,26X26,50

      BGA544,26X26,50

      SQUARE

      GRID ARRAY, HEAT SINK/SLUG

      Obsolete

      BGA

      No

      1.47 V

      1.33 V

      1.4 V

      e0

      3A991.A.2

      TIN LEAD

      8542.31.00.01

      BOTTOM

      BALL

      1.27 mm

      compliant

      544

      S-PBGA-B544

      Not Qualified

      COMMERCIAL

      667 MHz

      MICROPROCESSOR, RISC

      2.51 mm

      YES

      NO

      FIXED POINT

      YES

      35 mm

      35 mm

      RJ80536GC0332M

      Mfr Part No

      RJ80536GC0332M

      		Intel Corporation Datasheet

      -

      -

      Min: 1

      Mult: 1

      INTEL CORP

      ,

      Obsolete

      No

      8473.30.11.80

      unknown

      MICROPROCESSOR

      XPC860ENZP50D3

      Mfr Part No

      XPC860ENZP50D3

      		Freescale Semiconductor Datasheet

      -

      -

      Min: 1

      Mult: 1

      YES

      357

      50 MHz

      FREESCALE SEMICONDUCTOR INC

      PLASTIC/EPOXY

      BGA

      BGA,

      SQUARE

      GRID ARRAY

      Obsolete

      BGA

      3.465 V

      3.135 V

      3.3 V

      5A991

      8542.31.00.01

      BOTTOM

      BALL

      1.27 mm

      unknown

      357

      S-PBGA-B357

      Not Qualified

      50 MHz

      MICROPROCESSOR, RISC

      32

      2.05 mm

      32

      YES

      YES

      32

      FIXED POINT

      YES

      25 mm

      25 mm

      IBM25PPC403GA-JC33C1

      Mfr Part No

      IBM25PPC403GA-JC33C1

      		IBM Datasheet

      -

      -

      Min: 1

      Mult: 1

      SB80486SX-25

      Mfr Part No

      SB80486SX-25

      		Intel Corporation Datasheet

      -

      -

      Min: 1

      Mult: 1

      XPC745BPX350LD

      Mfr Part No

      XPC745BPX350LD

      		NXP Semiconductors Datasheet

      -

      -

      Min: 1

      Mult: 1

      YES

      255

      NXP SEMICONDUCTORS

      PLASTIC/EPOXY

      BGA

      BGA,

      RECTANGULAR

      GRID ARRAY

      Active

      2.1 V

      1.9 V

      2 V

      8542.31.00.01

      BOTTOM

      BALL

      unknown

      R-PBGA-B255

      350 MHz

      MICROPROCESSOR, RISC

      YES

      NO

      FIXED POINT

      NO

      P80C88AL

      Mfr Part No

      P80C88AL

      		Intel Corporation Datasheet

      -

      -

      Min: 1

      Mult: 1

      NO

      40

      INTEL CORP

      70 °C

      PLASTIC/EPOXY

      DIP

      DIP, DIP40,.6

      DIP40,.6

      RECTANGULAR

      IN-LINE

      Obsolete

      No

      5 V

      e0

      Tin/Lead (Sn/Pb)

      8542.31.00.01

      DUAL

      THROUGH-HOLE

      2.54 mm

      compliant

      R-PDIP-T40

      Not Qualified

      COMMERCIAL

      5 MHz

      MICROPROCESSOR, RISC

      50 mA

      16

      SME1701CPGA-400

      Mfr Part No

      SME1701CPGA-400

      		Sun Microsystems Inc Datasheet

      -

      -

      Min: 1

      Mult: 1

      NO

      370

      SUN MICROSYSTEMS INC

      CERAMIC

      PGA

      PGA, PGA370(UNSPEC)

      PGA370(UNSPEC)

      GRID ARRAY

      Obsolete

      8542.31.00.01

      PERPENDICULAR

      PIN/PEG

      unknown

      Not Qualified

      400 MHz

      MICROPROCESSOR, RISC

      64

      MC68010L12

      Mfr Part No

      MC68010L12

      		Motorola Semiconductor Products Datasheet

      -

      -

      Min: 1

      Mult: 1

      NO

      64

      12.5 MHz

      MOTOROLA INC

      70 °C

      CERAMIC, METAL-SEALED COFIRED

      DIP

      DIP, DIP64,.9

      DIP64,.9

      RECTANGULAR

      IN-LINE

      Obsolete

      No

      5.25 V

      4.75 V

      5 V

      e0

      TIN LEAD

      8542.31.00.01

      DUAL

      THROUGH-HOLE

      2.54 mm

      unknown

      R-CDIP-T64

      Not Qualified

      COMMERCIAL

      12.5 MHz

      MICROPROCESSOR

      32

      4.32 mm

      24

      NO

      YES

      16

      FIXED POINT

      NO

      0

      3

      81.28 mm

      22.86 mm

      UPD70208HGF-16

      Mfr Part No

      UPD70208HGF-16

      		NEC Electronics Group Datasheet

      -

      -

      Min: 1

      Mult: 1

      UPD70208HGF-16

      Mfr Part No

      UPD70208HGF-16

      		Renesas Electronics Corporation Datasheet

      -

      -

      Min: 1

      Mult: 1

      YES

      80

      RENESAS ELECTRONICS CORP

      70 °C

      -10 °C

      PLASTIC/EPOXY

      QFP

      QFP80,.7X.9,32

      RECTANGULAR

      FLATPACK

      Active

      No

      5.5 V

      4.5 V

      5 V

      e0

      Tin/Lead (Sn/Pb)

      8542.31.00.01

      QUAD

      GULL WING

      0.8 mm

      unknown

      R-PQFP-G80

      Not Qualified

      COMMERCIAL

      16 MHz

      MICROPROCESSOR, RISC

      112.5 mA

      8

      20

      YES

      YES

      16

      FIXED POINT

      NO

      4

      MD80C86/883

      Mfr Part No

      MD80C86/883

      		Intersil Corporation Datasheet

      -

      -

      Min: 1

      Mult: 1

      NO

      40

      5 MHz

      INTERSIL CORP

      125 °C

      -55 °C

      CERAMIC, GLASS-SEALED

      DIP

      DIP, DIP40,.6

      DIP40,.6

      RECTANGULAR

      IN-LINE

      Obsolete

      DIP

      No

      5.5 V

      4.5 V

      5 V

      e0

      3A001.A.2.C

      TIN LEAD

      8542.31.00.01

      DUAL

      THROUGH-HOLE

      2.54 mm

      not_compliant

      40

      R-GDIP-T40

      Not Qualified

      MILITARY

      5 MHz

      MICROPROCESSOR

      50 mA

      16

      5.715 mm

      20

      NO

      YES

      38535Q/M;38534H;883B

      16

      FIXED POINT

      NO

      52.464 mm

      15.24 mm

      MC7447RX1267LB

      Mfr Part No

      MC7447RX1267LB

      		Freescale Semiconductor Datasheet

      -

      -

      Min: 1

      Mult: 1

      YES

      360

      167 MHz

      FREESCALE SEMICONDUCTOR INC

      1

      CERAMIC, METAL-SEALED COFIRED

      BGA

      25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

      BGA360,19X19,50

      SQUARE

      GRID ARRAY

      Obsolete

      BGA

      No

      1.35 V

      1.25 V

      1.3 V

      e0

      3A991.A.2

      Tin/Lead (Sn/Pb)

      8542.31.00.01

      BOTTOM

      BALL

      220

      1.27 mm

      not_compliant

      30

      360

      S-CBGA-B360

      Not Qualified

      1267 MHz

      MICROPROCESSOR, RISC

      32

      3.2 mm

      36

      YES

      YES

      64

      FLOATING POINT

      YES

      25 mm

      25 mm