The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Contact plating | Surface Mount | Number of pins | Housing Material | Number of Terminals | Bundle Center to Mounting Center | Clock Frequency-Max | Conductor Diameter (Cross Section) | Connector | Connector pinout layout | Contacts pitch | Date Of Intro | Electrical mounting | Gross weight | Gross Weight | Ihs Manufacturer | Kind of connector | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Row pitch | Spatial orientation | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Transport packaging size/quantity | Type of connector | Wire Insulation Color | Wire Length | Operating temperature | Operating Temperature | JESD-609 Code | Pbfree Code | ECCN Code | Connector Type | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Depth | Reach Compliance Code | Current rating | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Number of Contacts | Power Supplies | Temperature Grade | Speed | uPs/uCs/Peripheral ICs Type | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Seated Height-Max | Address Bus Width | Coil Type | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | Rated voltage | Number of Timers | ROM Programmability | Number of External Interrupts | On Chip Data RAM Width | Number of DMA Channels | Profile | Saturation Current | Height | Length | Width | Plating thickness | Flammability rating |
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![]() | Mfr Part No XPC750PRX300LE | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 360 | 100 MHz | FREESCALE SEMICONDUCTOR INC | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | BGA | 2 V | 1.8 V | 1.9 V | 3A991.A.2 | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 360 | S-CBGA-B360 | Not Qualified | 300 MHz | MICROPROCESSOR, RISC | 32 | 3.2 mm | NO | YES | FIXED POINT | NO | 25 mm | 25 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PC8640MGH1067NE | Teledyne e2v | Datasheet | - | - | Min: 1 Mult: 1 | 166.66 MHz | TELEDYNE E2V (UK) LTD | 125 °C | -40 °C | Obsolete | 1.1 V | 1 V | 1.05 V | 3A991.A.2 | 8542.31.00.01 | unknown | 1067 MHz | MICROPROCESSOR, RISC | 32 | 32 | YES | 64 | FLOATING POINT | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GG8067402570603 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1667 | 2017-04-20 | INTEL CORP | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | 5A992.C | 8542.31.00.01 | BOTTOM | BALL | compliant | S-PBGA-B1667 | 2100 MHz | MICROPROCESSOR | NO | NO | FIXED POINT | YES | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TMS9980AJDL | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | gold-plated | NO | 66 | 40 | socket | 2x33 | 2.54mm | THT | 3.57 g | TEXAS INSTRUMENTS INC | female | 70 °C | CERAMIC | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 2.54mm | straight | pin strips | -40...163°C | 8542.31.00.01 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 2.54 mm | not_compliant | 1.5A | NOT SPECIFIED | R-XDIP-T40 | Not Qualified | COMMERCIAL | MICROPROCESSOR, RISC | 16 | 60V | beryllium copper | 0.75µm | UL94V-0 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No R7S910025CBG | Renesas Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | gold-plated | YES | 22 | 320 | 0 | 25 MHz | socket | 2x11 | 2.54mm | SMT | 1.05 g | RENESAS ELECTRONICS CORP | female | 209 | 125 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, | BGA320,20X20,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | 2.54mm | straight | 1.26 V | 1.14 V | 1.2 V | pin strips | -40...163°C | 8542.31.00.01 | BOTTOM | BALL | 0.8 mm | compliant | 1.5A | S-PBGA-B320 | AUTOMOTIVE | 450 MHz | MICROCONTROLLER, RISC | 651 mA | 32 | YES | YES | YES | NO | 1.75 mm | 1048576 | CORTEX-R4 | YES | YES | 32 | FLOATING POINT | YES | 60V | 33 | ROM LESS | 20 | 8 | 32 | beryllium copper | 17 mm | 17 mm | 0.254µm | UL94V-0 | |||||||||||||||||||||||||||||
![]() | Mfr Part No MC68HC000P10 | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 64 | MOTOROLA SEMICONDUCTOR PRODUCTS | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP64,.9 | DIP64,.9 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T64 | Not Qualified | 5 V | COMMERCIAL | 10 MHz | MICROPROCESSOR, RISC | 30 mA | 32 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC750ARX266TH | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | nylon PA66 (UL94V0), black | 255 | 266 MHz | 0.12mm2 (26AWG), insulation - PVC 0.4mm | 4.48 | FREESCALE SEMICONDUCTOR INC | 105 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | BGA | CERAMIC, BGA-255 | BGA360,19X19,50 | SQUARE | GRID ARRAY | Obsolete | BGA | No | 2.6 V | 48*32*22.5/3000 | red; black | 4*300mm | 0…+80 °C | e0 | 3A991 | BLS-4 with 2.54mm pitch | Interconnect Power Cable Connector (F - F) 2 x BLS | TIN LEAD | ALSO REQUIRES 3.3V I/O SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | connector housing - 14mm | not_compliant | 255 | S-CBGA-B255 | Not Qualified | 4 | INDUSTRIAL | 266 MHz | MICROPROCESSOR, RISC | 32 | 32 | NO | YES | 64 | FLOATING POINT | YES | 1 | connector housing - 2.6mm | connector housing - 10.16mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TDA2HVBRQABCRQ1 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | gold-plated | YES | 6 | 760 | socket | 2x3 | 2.54mm | THT | 0.36 g | TEXAS INSTRUMENTS INC | female | 125 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 2.54mm | straight | 1.2 V | 1.11 V | 1.15 V | pin strips | -40...163°C | e1 | Yes | 5A992.C | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 1.5A | 30 | S-PBGA-B760 | AUTOMOTIVE | SoC | 2.96 mm | AEC-Q100 | 60V | beryllium copper | 3 | 23 mm | 23 mm | 0.75µm | UL94V-0 | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AMD-K6-2/400ACK | AMD | Datasheet | 799 | - | Min: 1 Mult: 1 | gold-plated | NO | 49 | 321 | 100 MHz | socket | 1x49 | 2.54mm | THT | 4.66 g | ADVANCED MICRO DEVICES INC | female | 80 °C | CERAMIC, METAL-SEALED COFIRED | PGA | PGA, SPGA321,37X37 | SPGA321,37X37 | SQUARE | GRID ARRAY | Obsolete | PGA | No | straight | 2.1 V | 1.9 V | 2 V | pin strips | -40...163°C | e0 | 3A991.A.2 | TIN LEAD | ALSO REQUIRES 3.135V TO 3.6V FOR I/O | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | 1.5A | 321 | S-CPGA-P321 | Not Qualified | COMMERCIAL EXTENDED | 400 MHz | MICROPROCESSOR, RISC | 32 | 3.63 mm | 32 | YES | YES | 64 | FLOATING POINT | YES | 60V | beryllium copper | 49.53 mm | 49.53 mm | 0.75µm | UL94V-0 | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TDA2SXBTQABCQ1 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | gold-plated | YES | 31 | 760 | 38.4 MHz | socket | 1x31 | 2.54mm | THT | 2.95 g | TEXAS INSTRUMENTS INC | female | 125 °C | -40 °C | PLASTIC/EPOXY | HBGA | FCBGA-760 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Obsolete | Yes | straight | 1.2 V | 1.11 V | 1.15 V | pin strips | -40...163°C | e1 | No | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | unknown | 1.5A | 30 | S-PBGA-B760 | AUTOMOTIVE | 1176 MHz | MICROPROCESSOR, RISC | 32 | 2.96 mm | 16 | YES | YES | AEC-Q100 | 32 | FLOATING POINT | NO | 60V | beryllium copper | 3 | 23 mm | 23 mm | 0.75µm | UL94V-0 | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IBM25PPC403GA-JC33C1 | IBM | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SB80486SX-25 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XPC745BPX350LD | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 255 | NXP SEMICONDUCTORS | PLASTIC/EPOXY | BGA | BGA, | RECTANGULAR | GRID ARRAY | Active | 2.1 V | 1.9 V | 2 V | 8542.31.00.01 | BOTTOM | BALL | unknown | R-PBGA-B255 | 350 MHz | MICROPROCESSOR, RISC | YES | NO | FIXED POINT | NO | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No UPD70208L-8 | NEC Electronics Group | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No HW8076503693501 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 2018-07-27 | INTEL CORP | Active | 5A992.C | 8542.31.00.01 | compliant | MICROPROCESSOR | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No LR33310MC-40 | Avago Technologies | Datasheet | - | - | Min: 1 Mult: 1 | YES | 160 | AVAGO TECHNOLOGIES INC | 70 °C | METAL | QFP | QFP, QFP160,1.2SQ | QFP160,1.2SQ | SQUARE | FLATPACK | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | 0.635 mm | compliant | S-MQFP-G160 | Not Qualified | COMMERCIAL | 40 MHz | MICROPROCESSOR, RISC | 620 mA | 32 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CN6880-1200BG1936-AAP-Y22-G | Cavium Networks | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XPC862DTZP80 | Motorola Mobility LLC | Datasheet | - | - | Min: 1 Mult: 1 | YES | 357 | 80 MHz | MOTOROLA INC | PLASTIC/EPOXY | BGA | BGA, BGA357,19X19,50 | BGA357,19X19,50 | SQUARE | GRID ARRAY | Obsolete | BGA | 3.465 V | 3.135 V | 3.3 V | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 357 | S-PBGA-B357 | Not Qualified | 80 MHz | MICROPROCESSOR, RISC | 32 | 2.05 mm | 32 | YES | YES | 32 | FIXED POINT | YES | 25 mm | 25 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No ST40RA200XH6 | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 372 | 27 MHz | STMICROELECTRONICS | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | 27 X 27 MM, 2.33 MM HEIGHT, PLASTIC, BGA-372 | BGA372,20X20,50 | SQUARE | GRID ARRAY | Not Recommended | BGA | No | 1.95 V | 1.8 V | 1.87 V | e0 | No | 3A991.A.2 | TIN LEAD | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | not_compliant | 372 | S-PBGA-B372 | Not Qualified | INDUSTRIAL | 200 MHz | MICROPROCESSOR, RISC | 32 | 2.6 mm | 32 | YES | YES | 32 | FLOATING POINT | YES | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XPC823ZT50Z3 | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | FREESCALE SEMICONDUCTOR INC | 70 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | 8542.31.00.01 | BOTTOM | BALL | unknown | S-PBGA-B256 | COMMERCIAL | 50 MHz | MICROPROCESSOR | 32 | YES | YES | FIXED POINT | YES |
XPC750PRX300LE
Freescale Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
PC8640MGH1067NE
Teledyne e2v
Package:Embedded - Microprocessors
Price: please inquire
GG8067402570603
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
TMS9980AJDL
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
R7S910025CBG
Renesas Electronics Corporation
Package:Embedded - Microprocessors
Price: please inquire
MC68HC000P10
Freescale Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
MPC750ARX266TH
Freescale Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
TDA2HVBRQABCRQ1
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
AMD-K6-2/400ACK
AMD
Package:Embedded - Microprocessors
Price: please inquire
TDA2SXBTQABCQ1
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
IBM25PPC403GA-JC33C1
IBM
Package:Embedded - Microprocessors
Price: please inquire
SB80486SX-25
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
XPC745BPX350LD
NXP Semiconductors
Package:Embedded - Microprocessors
Price: please inquire
UPD70208L-8
NEC Electronics Group
Package:Embedded - Microprocessors
Price: please inquire
HW8076503693501
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
LR33310MC-40
Avago Technologies
Package:Embedded - Microprocessors
Price: please inquire
CN6880-1200BG1936-AAP-Y22-G
Cavium Networks
Package:Embedded - Microprocessors
Price: please inquire
XPC862DTZP80
Motorola Mobility LLC
Package:Embedded - Microprocessors
Price: please inquire
ST40RA200XH6
STMicroelectronics
Package:Embedded - Microprocessors
Price: please inquire
XPC823ZT50Z3
Freescale Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
