The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
- All Manufacturers
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Frequency(Max) | Memory Types | Number of I/Os | Operating Temperature (Max.) | Operating Temperature (Min.) | RAM(byte) | ROM(word) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Supply Current-Max | Bit Size | Access Time | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Address Bus Width | Core Architecture | CPU Family | Boundary Scan | Low Power Mode | External Data Bus Width | Number of Programmable I/O | Format | Integrated Cache | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | ROM Programmability | Number of Cores | Barrel Shifter | Internal Bus Architecture | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No MPC860DTZQ66D4 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 357-BBGA | 0°C~95°C TA | Tray | 2004 | MPC8xx | Obsolete | 3 (168 Hours) | MPC860 | 66MHz | MICROPROCESSOR, RISC | 3.3V | 10Mbps (2), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC862TZQ100B | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 357-BBGA | 357-PBGA (25x25) | 0°C~105°C TA | Tray | 2004 | MPC8xx | Obsolete | 3 (168 Hours) | MPC862 | 100MHz | MPC8xx | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC860DECZQ66D4 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 357-BBGA | -40°C~95°C TA | Tray | 2004 | MPC8xx | Obsolete | 3 (168 Hours) | MPC860 | 66MHz | 3.3V | 10Mbps (2) | 1 Core 32-Bit | No | DRAM | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC857DSLVR66B | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 357-BBGA | 357-PBGA (25x25) | 0°C~105°C TA | Tray | 2004 | MPC8xx | Obsolete | 3 (168 Hours) | MPC857 | 66MHz | MPC8xx | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC860DPVR50D4R2 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 357-BBGA | 0°C~95°C TA | Tape & Reel (TR) | 2004 | MPC8xx | Obsolete | 3 (168 Hours) | MPC860 | 50MHz | MICROPROCESSOR, RISC | 3.3V | 10Mbps (2), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LS1043ASE8KQB | NXP USA Inc. | Datasheet | 88 |
| Min: 1 Mult: 1 | 18 Weeks | 780-FBGA, FCBGA | 0°C~105°C | Tray | 2014 | QorIQ® Layerscape | Active | 3 (168 Hours) | 1.0GHz | ARM® Cortex®-A53 | 1GbE (7) or 10GbE (1) & 1GbE (5) | 4 Core 64-Bit | DDR3L, DDR4 | USB 3.0 (3) + PHY | Secure Boot, TrustZone® | SATA 6Gbps (1) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No UG80960HD6616SL2GN | Intel | Datasheet | 36 |
| Min: 1 Mult: 1 | Surface Mount | 208-QFP | 208 | 208-SQFP (28x28) | 0°C~85°C TC | Tray | 2002 | i960 | Obsolete | 5 (48 Hours) | 66MHz | 3.3V | 66MHz | i960 | 3.3V | 1 Core 32-Bit | No | DRAM | RoHS Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM5893PC0KFBG | Broadcom Limited | Datasheet | 16 | - | Min: 1 Mult: 1 | 22 Weeks | Active | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AT89C1051U-24SC | Atmel (Microchip Technology) | Datasheet | 2715 | - | Min: 1 Mult: 1 | DIP | YES | 20 | 24MHz | FLASH | 15 | 64 | 1024 | e0 | 2 (1 Year) | 20 | Tin/Lead (Sn/Pb) | 85°C | -40°C | 8542.31.00.01 | DUAL | GULL WING | 240 | 5V | 1.27mm | 24MHz | 30 | 20 | Not Qualified | 5V | COMMERCIAL | UART, USART | 6V | 4V | 4kB | Internal | 64B | MICROCONTROLLER | Brown-out Detect/Reset, POR | 8 | 24 μs | NO | NO | 8b | NO | NO | 8051 | 15 | 2.65mm | 12.8mm | Non-RoHS Compliant | Contains Lead | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AV80585VG0091MSLGAM | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | BGA | 956 | 1.2GHz | 956 | BOTTOM | BALL | 1.15V | 0.5mm | 1.2GHz | 1.15V | 1.05V | MICROPROCESSOR | 64 | 64b | 33 | YES | YES | FLOATING POINT | YES | 1 | No | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SB80C186EB-20 | Rochester Electronics | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 80 | 70°C | Bulk | 80 | 3A991.A.2 | 8542.31.00.01 | QUAD | GULL WING | 5V | 0.5mm | 20MHz | COMMERCIAL | 5V | MICROPROCESSOR | 16 | 20 | NO | YES | 16 | FIXED POINT | NO | 1.66mm | 12mm | 12mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LE80539GF0412MXSL9K2 | Intel | Datasheet | 94 | - | Min: 1 Mult: 1 | 479 | 2GHz | 1.3V | 32b | 2 | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No P89C51RD2FA | NXP Semiconductors / Freescale | Datasheet | - | - | Min: 1 Mult: 1 | PLCC | YES | 32 | 85°C | -40°C | 1024 | 65536 | yes | 44 | 3A991.A.2 | 8542.31.00.01 | QUAD | J BEND | 245 | 5V | 1.27mm | 40 | 44 | S-PQCC-J44 | Not Qualified | 5.5V | 5V | INDUSTRIAL | 4.5V | 33 MHz | MICROCONTROLLER | 33MHz | 8 | NO | NO | YES | NO | 16 | 8051 | 8 | FLASH | 4.57mm | 16.5862mm | 16.5862mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CM8062301044204SR05Y | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 1155 | 3.3GHz | DDR3 | 69.1°C | BOTTOM | 0.9mm | 3.3GHz | 32GB | 3300 MHz | MICROPROCESSOR | 75000mA | 64 | 64b | 2 | No | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No GDPXA255A0C300 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | BGA | 256 | Bulk | 1 (Unlimited) | 256 | 3A001.A.2.C | 85°C | 0°C | 8542.31.00.01 | BOTTOM | BALL | 225 | 1.1V | 1mm | 300MHz | NOT SPECIFIED | 256 | Not Qualified | OTHER | 3.3V | 1.3V | 950mV | MICROPROCESSOR | 32 | 26 | YES | YES | 32 | FIXED POINT | YES | 2mm | 17mm | 17mm | RoHS Compliant | Contains Lead | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AU1200-400MGD | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | 2006 | Obsolete | 4 (72 Hours) | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No OMAP3515DCUSA | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 423-LFBGA, FCBGA | 423 | L2 Cache, ROM, SRAM | -40°C~105°C TJ | Tray | OMAP-35xx | e1 | no | Obsolete | 4 (72 Hours) | 423 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 0.65mm | 600MHz | OMAP3515 | 423 | 1.35V | 1.89V | 1.71V | 64kB | DIGITAL SIGNAL PROCESSOR, OTHER | ARM® Cortex®-A8 | 32b | ARM | YES | YES | FLOATING POINT | 1.8V 3.0V | 3 | 1 Core 32-Bit | Yes | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | NO | MULTIPLE | LCD | 1.4mm | 16mm | No | ROHS3 Compliant | Contains Lead | |||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MC68HC001EI8 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 68-LCC (J-Lead) | 0°C~70°C TA | Tube | 1995 | M680x0 | Obsolete | 3 (168 Hours) | MC68HC001 | 8MHz | EC000 | 5.0V | 1 Core 32-Bit | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No T1023NXN7KQA | NXP USA Inc. | Datasheet | 16 |
| Min: 1 Mult: 1 | 18 Weeks | 525-FBGA, FCBGA | -40°C~105°C TA | QorIQ T1 | Active | 3 (168 Hours) | 1GHz | PowerPC e5500 | GbE (8) | 2 Core 64-Bit | No | DDR3L, DDR4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | SATA 3Gbps (2) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No KC80524KX366128SL3C7 | Intel | Datasheet | 40 |
| Min: 1 Mult: 1 | Surface Mount | 615-BBGA | 615 | 615-BGA (35.15x31.15) | 0°C~100°C TJ | Tray | 2000 | Mobile Celeron | Obsolete | 3 (168 Hours) | 366MHz | 1.6V | 366MHz | 366 μs | No | Non-RoHS Compliant |
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MPC860DTZQ66D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC862TZQ100B
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC860DECZQ66D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC857DSLVR66B
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC860DPVR50D4R2
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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LS1043ASE8KQB
NXP USA Inc.
Package:Embedded - Microprocessors
68.892523
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UG80960HD6616SL2GN
Intel
Package:Embedded - Microprocessors
53.412229
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BCM5893PC0KFBG
Broadcom Limited
Package:Embedded - Microprocessors
Price: please inquire
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AT89C1051U-24SC
Atmel (Microchip Technology)
Package:Embedded - Microprocessors
Price: please inquire
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AV80585VG0091MSLGAM
Intel
Package:Embedded - Microprocessors
Price: please inquire
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SB80C186EB-20
Rochester Electronics
Package:Embedded - Microprocessors
Price: please inquire
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LE80539GF0412MXSL9K2
Intel
Package:Embedded - Microprocessors
Price: please inquire
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P89C51RD2FA
NXP Semiconductors / Freescale
Package:Embedded - Microprocessors
Price: please inquire
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CM8062301044204SR05Y
Intel
Package:Embedded - Microprocessors
Price: please inquire
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GDPXA255A0C300
Intel
Package:Embedded - Microprocessors
Price: please inquire
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AU1200-400MGD
Broadcom Limited
Package:Embedded - Microprocessors
Price: please inquire
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OMAP3515DCUSA
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
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MC68HC001EI8
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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T1023NXN7KQA
NXP USA Inc.
Package:Embedded - Microprocessors
88.146542
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KC80524KX366128SL3C7
Intel
Package:Embedded - Microprocessors
68.547324