The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
- All Manufacturers
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Memory Types | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Memory Size | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Supply Current-Max | Bit Size | Access Time | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | ROM Programmability | Number of Cores | Security Features | Display & Interface Controllers | Number of DMA Channels | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No MPC8347VVAGDB | NXP USA Inc. | Datasheet | 2344 |
| Min: 1 Mult: 1 | 12 Weeks | 620-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 672 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B672 | 1.26V | 1.2V | 1.14V | 400MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | 1.69mm | 35mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC8306SCVMAFDCA | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 369-LFBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 369 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | MPC8306 | S-PBGA-B369 | 1.05V | 11.83.3V | 0.95V | 333MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 66.67MHz | 32 | YES | YES | FLOATING POINT | YES | 1.8V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | DUART, I2C, SPI, TDM | Communications; QUICC Engine | 1.61mm | 19mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SPEAR600-2 | STMicroelectronics | Datasheet | 16 | - | Min: 1 Mult: 1 | Surface Mount | 420-FBGA | 420 | 24 | -40°C~85°C TC | Tray | SPEAr® | e2 | Active | 3 (168 Hours) | 420 | 3A991.A.2 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 333MHz | SPEAR600 | 420 | 3.3V | 3.6V | Ethernet, I2C, IrDA, SPI, UART, USB | 16kB | 30 MHz | 8kB | MICROCONTROLLER, RISC | ARM926EJ-S | 32 | YES | YES | 32b | NO | NO | 10 | ARM | 10/100/1000Mbps (1) | 2 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (3) | I2C, I2S, IrDA, Microwire, SPI, UART | FLASH | LCD, Touchscreen | 2.06mm | 23mm | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC8260AZUPIBB | NXP USA Inc. | Datasheet | 2135 | - | Min: 1 Mult: 1 | 12 Weeks | 480-LBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 1994 | MPC82xx | e0 | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | 30 | PC8260 | S-PBGA-B480 | 2.2V | 1.9V | 300MHz | MICROPROCESSOR, RISC | PowerPC G2 | 66.66MHz | 32 | 32 | YES | NO | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC68EN360VR33L | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 357-BBGA | YES | 46 | 0°C~70°C TA | Tray | 1995 | M683xx | e1 | Last Time Buy | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 5V | 1.27mm | 40 | MC68EN360 | S-PBGA-B357 | 5.25V | 4.75V | 33MHz | MICROCONTROLLER, RISC | CPU32+ | 6MHz | 32 | NO | YES | NO | 32 | 32 | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | SCC, SMC, SPI | Communications; CPM | 1.86mm | 25mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC860PVR80D4 | NXP USA Inc. | Datasheet | 1326 | - | Min: 1 Mult: 1 | 8 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 80MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC860SRCVR66D4 | NXP USA Inc. | Datasheet | 12 | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | -40°C~95°C TA | Tray | 1995 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC8308VMAGD | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 473-LFBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Obsolete | 3 (168 Hours) | 473 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 40 | MPC8308 | S-PBGA-B473 | 400MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | DUART, HSSI, I2C, MMC/SD/SDIO, SPI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC9328MXLCVM15 | NXP USA Inc. | Datasheet | 128 | - | Min: 1 Mult: 1 | 256-LFBGA | -40°C~85°C TA | Tray | 1994 | i.MXL | Not For New Designs | 3 (168 Hours) | MC9328MXL | 150MHz | ARM920T | 1.8V 3.0V | 1 Core 32-Bit | No | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, MMC/SD, UART | LCD | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC9328MXLDVP15 | NXP USA Inc. | Datasheet | 1121 |
| Min: 1 Mult: 1 | 26 Weeks | 225-LFBGA | 225-MAPBGA (13x13) | -30°C~70°C TA | Tray | 1994 | i.MXL | Not For New Designs | 3 (168 Hours) | MC9328MXL | 150MHz | ARM920T | 1.8V 3.0V | 1 Core 32-Bit | No | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, MMC/SD, UART | LCD | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC7448VU1250ND | NXP USA Inc. | Datasheet | 8068 | - | Min: 1 Mult: 1 | 12 Weeks | 360-CBGA, FCCBGA | YES | 0°C~105°C TA | Tray | 1994 | MPC74xx | e2 | Active | 1 (Unlimited) | 360 | 3A991.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | 260 | 1.1V | 1.27mm | 40 | MC7448 | S-CBGA-N360 | 1.15V | 1.31.8/2.5V | 1.05V | 1.25GHz | MICROPROCESSOR, RISC | PowerPC G4 | 1250MHz | 32 | NO | YES | FIXED POINT | NO | 1.5V 1.8V 2.5V | 1 Core 32-Bit | No | Multimedia; SIMD | 2.8mm | 25mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC8358ECVRAGDGA | NXP USA Inc. | Datasheet | 1756 | - | Min: 1 Mult: 1 | 12 Weeks | 668-BBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 668 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8358 | S-PBGA-B668 | 1.26V | 1.14V | 400MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine, Security; SEC | Cryptography, Random Number Generator | 2.46mm | 29mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6S7CVM08AB | NXP USA Inc. | Datasheet | 8000 | - | Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | YES | -40°C~105°C TA | Tray | 2002 | i.MX6S | e1 | Not For New Designs | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | MCIMX6 | S-PBGA-B624 | 1.5V | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 32 | 26 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC7410THX500LE | NXP USA Inc. | Datasheet | 1 | - | Min: 1 Mult: 1 | 360-BCBGA, FCCBGA | YES | -40°C~105°C TA | Tray | 1994 | MPC74xx | Obsolete | 1 (Unlimited) | 3A991.A.1 | 8542.31.00.01 | BOTTOM | BALL | 1.8V | MPC7410 | R-PBGA-B | 1.9V | 1.7V | 500MHz | MICROPROCESSOR, RISC | PowerPC G4 | NO | NO | FIXED POINT | NO | 1.8V 2.5V 3.3V | 1 Core 32-Bit | No | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC8250AZUMHBC | NXP USA Inc. | Datasheet | 100 | - | Min: 1 Mult: 1 | 480-LBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 1997 | MPC82xx | e0 | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | 30 | MPC8250 | S-PBGA-B480 | 2.2V | 1.9V | 266MHz | MICROPROCESSOR, RISC | PowerPC G2 | 32 | 32 | YES | NO | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AM5K2E02ABDA4 | Texas Instruments | Datasheet | 1632 |
| Min: 1 Mult: 1 | 26 Weeks | ACTIVE (Last Updated: 3 days ago) | 1089-BFBGA, FCBGA | YES | 1089 | -40°C~100°C TC | Tray | Sitara™ | e1 | yes | Active | 4 (72 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1V | 0.8mm | 1.4GHz | AM5K2E02 | 1.05V | 0.95V | 1400 MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | ARM | YES | YES | FLOATING POINT | YES | 1.35V 1.5V 1.8V 3.3V | 1GBE (8) | 2 Core 32-Bit | No | DDR3, SRAM | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, TSIP, UART, USIM | Network | 2 | 32 | 3.55mm | 27mm | 27mm | 2.98mm | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SB80L188EC13 | Intel | Datasheet | 225 | - | Min: 1 Mult: 1 | Surface Mount | 100-BFQFP | 100 | 0°C~70°C TA | Tray | 1996 | i186 | e0 | Obsolete | 3 (168 Hours) | 100 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | 3V | 0.5mm | 13MHz | 100 | 3/5V | 3V | MICROPROCESSOR | 80C186 | 36mA | 16 | 13 μs | 20 | NO | YES | 8 | FIXED POINT | NO | 3.0V | 1 Core 16-Bit | No | DRAM | Serial Communications Unit (SCU) | 1.66mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC68340AG25E | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 144-LQFP | 0°C~70°C TA | Tray | 1995 | M683xx | Not For New Designs | 3 (168 Hours) | MC68340 | 25MHz | CPU32 | 5.0V | 1 Core 32-Bit | No | DRAM | USART | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC852TCZT100A | NXP USA Inc. | Datasheet | 16 | - | Min: 1 Mult: 1 | 12 Weeks | 256-BBGA | YES | -40°C~100°C TA | Tray | 1999 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | 30 | MPC852 | S-PBGA-B256 | 1.9V | 1.83.3V | 1.7V | 100MHz | MICROPROCESSOR, RISC | 66MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, PCMCIA, SPI, UART | Communications; CPM | 2.54mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AM3352ZCE27 | Texas Instruments | Datasheet | 480 | - | Min: 1 Mult: 1 | Copper, Silver, Tin | 298-LFBGA | YES | 298 | Cache, RAM, ROM | 0°C~90°C TJ | Tray | Sitara™ | e1 | yes | Obsolete | 3 (168 Hours) | 298 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 0.65mm | 275MHz | AM3352 | 298 | 1.1V | 1.15V | CAN, Ethernet, I2C, SPI, UART, USB | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | 28 | ARM | YES | YES | FIXED POINT | YES | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | Cryptography, Random Number Generator | LCD, Touchscreen | No | ROHS3 Compliant | Lead Free |
MPC8347VVAGDB
NXP USA Inc.
Package:Embedded - Microprocessors
111.433621
MPC8306SCVMAFDCA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
SPEAR600-2
STMicroelectronics
Package:Embedded - Microprocessors
Price: please inquire
MPC8260AZUPIBB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MC68EN360VR33L
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC860PVR80D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC860SRCVR66D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC8308VMAGD
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MC9328MXLCVM15
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MC9328MXLDVP15
NXP USA Inc.
Package:Embedded - Microprocessors
17.233440
MC7448VU1250ND
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC8358ECVRAGDGA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6S7CVM08AB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC7410THX500LE
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC8250AZUMHBC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
AM5K2E02ABDA4
Texas Instruments
Package:Embedded - Microprocessors
195.144831
SB80L188EC13
Intel
Package:Embedded - Microprocessors
Price: please inquire
MC68340AG25E
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC852TCZT100A
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
AM3352ZCE27
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
