The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
- All Manufacturers
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Memory Types | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Supply Current-Max | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Address Bus Width | Core Architecture | CPU Family | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | ROM Programmability | Number of Cores | Security Features | Display & Interface Controllers | SATA | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No MPC8569EVJAQLJB | NXP USA Inc. | Datasheet | 2016 |
| Min: 1 Mult: 1 | 26 Weeks | 783-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC85xx | e1 | Last Time Buy | 3 (168 Hours) | 783 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 30 | S-PBGA-B783 | 1.03V | 12.5/3.3V | 0.97V | 1.067GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 133MHz | 32 | 16 | YES | YES | 64 | FLOATING POINT | YES | 1.0V 1.5V 1.8V 2.5V 3.3V | 10/100Mbps (8), 1Gbps (4) | 1 Core 32-Bit | No | DDR2, DDR3, SDRAM | USB 2.0 (1) | DUART, HSSI, I2C, MMC/SD, PCI, RapidIO, SPI, TDM, UART | Communications; QUICC Engine, Security; SEC | Cryptography, Random Number Generator | 3.94mm | 29mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC860PCZQ66D4 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | -40°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No P1024NXN5DFB | NXP USA Inc. | Datasheet | 21 | - | Min: 1 Mult: 1 | 12 Weeks | 561-FBGA | -40°C~125°C TA | Tray | 2002 | QorIQ P1 | Active | 3 (168 Hours) | 3A991.A.2 | 8542.31.00.01 | 260 | P1024 | 667MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No P1010NXN5KHB | NXP USA Inc. | Datasheet | 16 | - | Min: 1 Mult: 1 | 12 Weeks | 425-FBGA | -40°C~105°C TA | Tray | 2002 | QorIQ P1 | Active | 3 (168 Hours) | P1010 | 1.0GHz | PowerPC e500v2 | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (1) | CAN, DUART, I2C, MMC/SD, SPI | SATA 3Gbps (2) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No P1010NXE5KHB | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 425-FBGA | -40°C~105°C TA | Tray | 2002 | QorIQ P1 | Active | 3 (168 Hours) | P1010 | 1.0GHz | PowerPC e500v2 | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (1) | CAN, DUART, I2C, MMC/SD, SPI | Security; SEC 4.4 | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | SATA 3Gbps (2) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8360ZUAJDGA | NXP USA Inc. | Datasheet | 52 |
| Min: 1 Mult: 1 | 740-LBGA | YES | 0°C~105°C TA | Tray | 2006 | MPC83xx | e0 | Obsolete | 3 (168 Hours) | 740 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1mm | 40 | MPC8360 | S-PBGA-B740 | 1.35V | 1.15V | 533MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine | 1.69mm | 37.5mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC8569CVJAQLJB | NXP USA Inc. | Datasheet | 9 | - | Min: 1 Mult: 1 | 12 Weeks | 783-BBGA, FCBGA | -40°C~105°C TA | Tray | 2002 | MPC85xx | Last Time Buy | 3 (168 Hours) | 1.067GHz | PowerPC e500v2 | 1.0V 1.5V 1.8V 2.5V 3.3V | 10/100Mbps (8), 1Gbps (4) | 1 Core 32-Bit | No | DDR2, DDR3, SDRAM | USB 2.0 (1) | DUART, HSSI, I2C, MMC/SD, PCI, RapidIO, SPI, TDM, UART | Communications; QUICC Engine | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MCIMX31LDVKN5DR2 | NXP USA Inc. | Datasheet | 27 |
| Min: 1 Mult: 1 | 15 Weeks | 457-LFBGA | YES | -20°C~70°C TA | Tape & Reel (TR) | 2008 | i.MX31 | Active | 3 (168 Hours) | 457 | 8542.31.00.01 | BOTTOM | BALL | 0.5mm | MCIMX31 | S-PBGA-B457 | Not Qualified | 1.2/1.51.8/3.3V | 532MHz | GRAPHICS PROCESSOR | ARM1136JF-S | 1.8V 2.0V 2.5V 2.7V 3.0V | 1 Core 32-Bit | Yes | DDR | USB 2.0 (3) | 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART | Multimedia; GPU, IPU, MPEG-4, VFP | Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory | Keyboard, Keypad, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No OMAP3525ECUSA | Texas Instruments | Datasheet | 788 |
| Min: 1 Mult: 1 | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | Surface Mount | 423-LFBGA, FCBGA | 423 | L2 Cache, ROM, SRAM | -40°C~105°C TJ | Tray | OMAP-35xx | e1 | Active | 4 (72 Hours) | 423 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 0.65mm | 600MHz | OMAP3525 | 423 | 1.35V | I2C, SPI, UART, USB | 1.35V | 985mV | 112kB | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32b | ARM | 1.8V 3.0V | 3 | 1 Core 32-Bit | Yes | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | LCD | 1.4mm | 16mm | 16mm | 960μm | No | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MCIMX508CVM8B | NXP USA Inc. | Datasheet | 20 |
| Min: 1 Mult: 1 | 15 Weeks | 400-LFBGA | YES | Commercial grade | 0°C~70°C TA | Tray | 2008 | i.MX50 | e1 | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.225V | 0.8mm | 40 | MCIMX508 | S-PBGA-B400 | Not Qualified | 1.275V | 1.175V | 800MHz | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A8 | 800MHz | YES | 131072 | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, LPDDR2, DDR2 | USB 2.0 + PHY (2) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | Boot Security, Cryptography, Secure JTAG | EPDC, LCD | 1.6mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MCIMX31LCVKN5DR2 | NXP USA Inc. | Datasheet | 4 |
| Min: 1 Mult: 1 | 15 Weeks | 457-LFBGA | YES | -40°C~85°C TA | Tape & Reel (TR) | 2008 | i.MX31 | Active | 3 (168 Hours) | 457 | 8542.31.00.01 | BOTTOM | BALL | 0.5mm | MCIMX31 | S-PBGA-B457 | Not Qualified | 1.2/1.51.8/3.3V | 532MHz | GRAPHICS PROCESSOR | ARM1136JF-S | 1.8V 2.0V 2.5V 2.7V 3.0V | 1 Core 32-Bit | Yes | DDR | USB 2.0 (3) | 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART | Multimedia; GPU, IPU, MPEG-4, VFP | Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory | Keyboard, Keypad, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8347EVVAJD | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 672-LBGA | 0°C~105°C TA | Tray | 2009 | MPC83xx | Obsolete | 3 (168 Hours) | 5A002.A.1 | 8542.31.00.01 | MPC8347 | 533MHz | PowerPC e300 | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | Security; SEC | Cryptography, Random Number Generator | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AT91SAM9M10C-CU-999 | Microchip Technology | Datasheet | 400 |
| Min: 1 Mult: 1 | 10 Weeks | Silver, Tin | Surface Mount | 324-TFBGA | 324 | L1 Cache, ROM, SRAM | 160 | -40°C~85°C TA | Cut Tape (CT) | 2010 | SAM9M | yes | Active | 3 (168 Hours) | 324 | BOTTOM | BALL | 1V | 0.8mm | 400MHz | AT91SAM9M10 | 1V | 2-Wire, EBI/EMI, Ethernet, I2C, SPI, UART, USART, USB | 1.1V | 900mV | 64kB | Internal | 64kB | MICROCONTROLLER, RISC | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | 32 | YES | YES | 32b | YES | NO | 26 | ARM | 1.8V 3.3V | 10/100Mbps | 1 Core 32-Bit | No | LPDDR, LPSDR, DDR2, SDR, SRAM | USB 2.0 (3) | AC97, EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | FLASH | 1 | LCD, Touchscreen, Video Decoder | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No KC80526LY400128SL544 | Intel | Datasheet | 575 |
| Min: 1 Mult: 1 | Surface Mount | 495-BBGA | 495 | 495-BGA (31x27.2) | 0°C~100°C TJ | Tray | 2001 | Mobile Celeron | Obsolete | Not Applicable | 400MHz | 1.35V | 400MHz | No | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No R7S721020VCFP#AA1 | Renesas Electronics America | Datasheet | 128 | - | Min: 1 Mult: 1 | 20 Weeks | 176-LQFP | YES | 176 | ROMless | 78 | 3145728 | 0 | -40°C~85°C TA | Tray | 2016 | RZ/A1L | yes | Active | 3 (168 Hours) | 176 | QUAD | GULL WING | 1.18V | 0.5mm | 400MHz | 176 | Not Qualified | 1.26V | 1.183.3V | 1.1V | CAN, EBI/EMI, Ethernet, I2C, LIN, SCI, SPI, UART, USART, USB | External | 3MB | MICROCONTROLLER | ARM® Cortex®-A9 | DMA, POR, PWM, WDT | 492mA | 32 | YES | YES | YES | 26 | ARM | CORTEX-A9 | 32 | 1.2V 3.3V | 10/100Mbps | 1 Core 32-Bit | Yes | SDRAM, SRAM | USB 2.0 (2) | CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | Multimedia; NEON™ MPE | VDC | 24mm | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC8541VTAJD | NXP USA Inc. | Datasheet | 40 | - | Min: 1 Mult: 1 | 783-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC85xx | e2 | Obsolete | 3 (168 Hours) | 783 | 5A992 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8541 | R-PBGA-B783 | 1.26V | 1.14V | 533MHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | 64 | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | DUART, I2C, PCI | 3.75mm | 29mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No P1012NXN2HFB | NXP USA Inc. | Datasheet | 2174 |
| Min: 1 Mult: 1 | 12 Weeks | 689-BBGA Exposed Pad | -40°C~105°C TA | Tray | 2002 | QorIQ P1 | Active | 3 (168 Hours) | P1012 | 800MHz | PowerPC e500v2 | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Communications; QUICC Engine | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No PS32V234CMN1AVUB | NXP USA Inc. | Datasheet | 1854 |
| Min: 1 Mult: 1 | 14 Weeks | 621-FBGA, FCBGA | -40°C~105°C TA | Tray | 2015 | Active | 3 (168 Hours) | 260 | NOT SPECIFIED | 1.0GHz, 133MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A53, ARM® Cortex®-M4 | 1.0V 1.8V 3.3V | 1Gbps | 4 Core 64-Bit/1 Core 32-Bit | Yes | LPDDR2, DDR3, DDR3L | Multimedia; NEON™ MPE | AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG | APEX2-CL, DCU (2D-ACE), ISP, MIPICSI2, VIU | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MCIMX6S4AVM08ACR | NXP USA Inc. | Datasheet | 400 |
| Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | -40°C~125°C TJ | Tape & Reel (TR) | 2002 | i.MX6S | Active | 3 (168 Hours) | 800MHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8272ZQTIEA | NXP USA Inc. | Datasheet | 91 | - | Min: 1 Mult: 1 | 8 Weeks | 516-BBGA | YES | 57 | 0°C~105°C TA | Tray | 1994 | MPC82xx | e0 | Last Time Buy | 3 (168 Hours) | 516 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | MPC8272 | S-PBGA-B516 | 1.575V | 1.53.3V | 1.425V | 400MHz | MICROCONTROLLER, RISC | PowerPC G2_LE | 66.7MHz | 32 | NO | YES | NO | 30 | 64 | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM, Security; SEC | Cryptography, Random Number Generator | 27mm | Non-RoHS Compliant |
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MPC8569EVJAQLJB
NXP USA Inc.
Package:Embedded - Microprocessors
188.624232
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MPC860PCZQ66D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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P1024NXN5DFB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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P1010NXN5KHB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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P1010NXE5KHB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8360ZUAJDGA
NXP USA Inc.
Package:Embedded - Microprocessors
26.777298
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MPC8569CVJAQLJB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX31LDVKN5DR2
NXP USA Inc.
Package:Embedded - Microprocessors
47.480488
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OMAP3525ECUSA
Texas Instruments
Package:Embedded - Microprocessors
49.345109
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MCIMX508CVM8B
NXP USA Inc.
Package:Embedded - Microprocessors
22.666349
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MCIMX31LCVKN5DR2
NXP USA Inc.
Package:Embedded - Microprocessors
62.596722
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MPC8347EVVAJD
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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AT91SAM9M10C-CU-999
Microchip Technology
Package:Embedded - Microprocessors
25.762139
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KC80526LY400128SL544
Intel
Package:Embedded - Microprocessors
67.934308
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R7S721020VCFP#AA1
Renesas Electronics America
Package:Embedded - Microprocessors
Price: please inquire
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MPC8541VTAJD
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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P1012NXN2HFB
NXP USA Inc.
Package:Embedded - Microprocessors
110.137117
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PS32V234CMN1AVUB
NXP USA Inc.
Package:Embedded - Microprocessors
120.586742
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MCIMX6S4AVM08ACR
NXP USA Inc.
Package:Embedded - Microprocessors
41.950966
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MPC8272ZQTIEA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire