The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
- All Manufacturers
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Memory Types | Number of I/Os | Usage Level | Watchdog Timers | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Timers | Co-Processors/DSP | ROM Programmability | Number of Cores | Bus Compatibility | Barrel Shifter | Internal Bus Architecture | Security Features | Data Transfer Rate-Max | Display & Interface Controllers | Communication Protocol | SATA | Data Encoding/Decoding Method | Height | Height Seated (Max) | Length | Width | Thickness | RoHS Status | Lead Free |
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 | Mfr Part No P1022NSN2LFB | NXP USA Inc. | Datasheet | 1873 |
| Min: 1 Mult: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | QorIQ P1 | e2 | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | P1022 | S-PBGA-B689 | 1.05V | 0.95V | 1.055GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 133MHz | 32 | 16 | YES | YES | 64 | FLOATING POINT | YES | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, I2S, MMC/SD, SPI | LCD | SATA 3Gbps (2) | 2.46mm | 31mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8555CVTAJD | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 783-BBGA, FCBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC85xx | e2 | Obsolete | 3 (168 Hours) | 783 | 5A992 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8555 | S-PBGA-B783 | 1.26V | 1.14V | 533MHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | 64 | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; CPM | 3.75mm | 29mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LS1020AXN7HNB | NXP USA Inc. | Datasheet | 437 |
| Min: 1 Mult: 1 | 18 Weeks | 525-FBGA, FCBGA | YES | -40°C~105°C | Tray | 2002 | QorIQ® Layerscape | Active | 3 (168 Hours) | 525 | 3A991.A.1 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | S-PBGA-B525 | 1.03V | 0.97V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7 | 133.3MHz | 32 | 16 | YES | YES | 32 | FLOATING POINT | YES | GbE (3) | 2 Core 32-Bit | DDR3L, DDR4 | USB 2.0 (1), USB 3.0 + PHY | Multimedia; NEON™ SIMD | Secure Boot, TrustZone® | SATA 3Gbps (1) | 2.07mm | 19mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AT91SAM9CN12B-CFU | Microchip Technology | Datasheet | 25 |
| Min: 1 Mult: 1 | 9 Weeks | Copper, Silver, Tin | Surface Mount | 247-LFBGA | 217 | 205.307246mg | L1 Cache, ROM, SRAM | 105 | Yes | -40°C~85°C TA | Tray | 2004 | SAM9CN | e1 | yes | Active | 3 (168 Hours) | 247 | TIN SILVER COPPER | BOTTOM | BALL | 1V | 0.5mm | 400MHz | AT91SAM9CN | 2-Wire, EBI/EMI, I2C, SPI, Serial, UART, USART, USB | 1.1V | 900mV | 128kB | Internal | 32kB | MICROPROCESSOR, RISC | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | 32 | 32b | 2 | 26 | ARM | YES | YES | FIXED POINT | YES | 1.8V 3.3V | 1 Core 32-Bit | No | LPDDR, LPDDR2, DDR2, SDR, SRAM | USB 2.0 (2) | EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | 1 | LCD, Touchscreen | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC860PVR50D4 | NXP USA Inc. | Datasheet | 34 | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC8536EBVJAULA | NXP USA Inc. | Datasheet | 1722 |
| Min: 1 Mult: 1 | 18 Weeks | 783-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC85xx | Active | 3 (168 Hours) | 783 | 5A002.A.1 | 8542.31.00.01 | BOTTOM | BALL | 1V | 1mm | MPC8536 | S-PBGA-B783 | 1.05V | 11.5/1.81.8/3.3V | 0.95V | 1.333GHz | MICROPROCESSOR, RISC | PowerPC e500 | 133MHz | 32 | 16 | YES | YES | 64 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 (3) | DUART, I2C, MMC/SD, PCI, SPI | Security; SEC | Cryptography | SATA 3Gbps (2) | 2.76mm | 29mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No P4080NSN1PNB | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 1295-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2008 | QorIQ P4 | e1 | Obsolete | 3 (168 Hours) | 3A991.A.1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 30 | P4080 | S-PBGA-B1295 | 1.05V | 0.95V | 1.5GHz | MICROPROCESSOR, RISC | PowerPC e500mc | 133.3MHz | 32 | YES | YES | 16 | FIXED POINT | YES | 1.8V 2.5V 3.3V | 1Gbps (8), 10Gbps (2) | 8 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | 3.53mm | 37.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MC68MH360VR25VL | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 357-BBGA | YES | 0°C~70°C TA | Tray | 1995 | M683xx | e1 | Obsolete | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 5V | 1.27mm | 40 | MC68MH360 | S-PBGA-B357 | 5.25V | 4.75V | 25MHz | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CPU32+ | 25MHz | 32 | YES | YES | 32 | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | SCC, SMC, SPI | Communications; CPM | MC68040; MC68030 | 1.25 MBps | BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP | NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL | 1.86mm | 25mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8560PX667LC | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 784-BBGA, FCBGA | 783-FCPBGA (29x29) | 0°C~105°C TA | Tray | 2002 | MPC85xx | Obsolete | 3 (168 Hours) | MPC8560 | 667MHz | PowerPC e500 | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | I2C, PCI, RapidIO, SPI, TDM, UART | Communications; CPM | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No OMAPL138BGWTMEP | Texas Instruments | Datasheet | 1999 | - | Min: 1 Mult: 1 | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | Lead, Tin | Surface Mount | 361-LFBGA | 361 | L2 Cache, ROM, SRAM | Military grade | -55°C~125°C TJ | Tube | OMAP-L1x | e0 | Active | 3 (168 Hours) | 361 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 220 | 1.2V | 0.8mm | 345MHz | OMAPL138 | 361 | 3.3V | 1.35V | SPI | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | 32b | ARM | YES | YES | FLOATING POINT | YES | 8192 | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | 8 | Signal Processing; C674x, System Control; CP15 | MROM | NO | SINGLE | Boot Security, Cryptography | LCD | SATA 3Gbps (1) | 1.4mm | 16mm | 16mm | 900μm | Non-RoHS Compliant | Contains Lead | |||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MC8640DHX1067NE | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 16 Weeks | 1023-BCBGA, FCCBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC86xx | e0 | Obsolete | 3 (168 Hours) | 3A991.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 0.95V | 1mm | 30 | MC8640 | S-CBGA-B1023 | 1V | 11.8/2.52.5/3.3V | 0.9V | 1.067GHz | MICROPROCESSOR | PowerPC e600 | 166.66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 2 Core 32-Bit | No | DDR, DDR2 | DUART, HSSI, I2C, RapidIO | 2.97mm | 33mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MC7447AHX1420LB | NXP USA Inc. | Datasheet | 8000 | - | Min: 1 Mult: 1 | 12 Weeks | 360-BCBGA, FCCBGA | YES | 0°C~105°C TA | Tray | 1994 | MPC74xx | e0 | Not For New Designs | 1 (Unlimited) | 360 | 3A991.A.1 | Tin/Lead (Sn/Pb) | ALSO REQUIRES 1.8V OR 2.5V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1.27mm | 40 | MC7447 | S-CBGA-B360 | 1.35V | 1.25V | 1.42GHz | MICROPROCESSOR, RISC | PowerPC G4 | 167MHz | 32 | 36 | YES | YES | 64 | FLOATING POINT | YES | 1.8V 2.5V | 1 Core 32-Bit | No | Multimedia; SIMD | 3.24mm | 25mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MCIMX6X2CVN08AC | NXP USA Inc. | Datasheet | 360 | - | Min: 1 Mult: 1 | 15 Weeks | 400-LFBGA | -40°C~105°C TA | Tray | 2017 | i.MX6SX | Active | 3 (168 Hours) | 8542.39.00.01 | 260 | 40 | 200MHz, 800MHz | ARM® Cortex®-A9, ARM® Cortex®-M4 | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MCIMX6Q5EZK08AE | NXP USA Inc. | Datasheet | 1854 |
| Min: 1 Mult: 1 | 15 Weeks | 569-LFBGA | -20°C~105°C TJ | Tray | i.MX6Q | Active | 3 (168 Hours) | 8542.39.00.01 | 260 | 40 | 800MHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No ATSAMA5D43B-CUR | Microchip Technology | Datasheet | 302 |
| Min: 1 Mult: 1 | 12 Weeks | 289-LFBGA | YES | Automotive grade | -40°C~85°C TA | Tape & Reel (TR) | 2017 | SAMA5D4 | Active | 3 (168 Hours) | 289 | 8542.31.00.01 | BOTTOM | BALL | 1.26V | 0.8mm | ATSAMA5D43 | S-PBGA-B289 | 1.32V | 1.16V | 600MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | 32 | 26 | YES | YES | TS 16949 | 16 | FLOATING POINT | YES | 1.2V 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, LPDDR2, DDR2 | USB 2.0 (3) | EBI, I2C, MMC/SD/SDIO, SPI, SSC, UART, USART | Multimedia; NEON™ SIMD | AES, SHA, TDES, TRNG | LCD, Touchscreen | 1.4mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No T4240NSE7TTB | NXP USA Inc. | Datasheet | 644 | - | Min: 1 Mult: 1 | 18 Weeks | 1932-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2002 | QorIQ T4 | yes | Active | 3 (168 Hours) | BOTTOM | BALL | 250 | 1.025V | 1mm | S-PBGA-B1932 | 1.055V | 0.995V | 1.8GHz | MICROPROCESSOR, RISC | PowerPC e6500 | 133.3MHz | 16 | YES | YES | 64 | FIXED POINT | YES | 1Gbps (16), 10Gbps (4) | 12 Core 64-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, RapidIO, SPI, UART | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | SATA 3Gbps (2) | 3.33mm | 45mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8245TVV350D | NXP USA Inc. | Datasheet | 9 | - | Min: 1 Mult: 1 | 12 Weeks | 352-LBGA | YES | -40°C~105°C TA | Tray | 1998 | MPC82xx | e1 | Obsolete | 3 (168 Hours) | 352 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 2V | 1.27mm | 30 | MPC8245 | S-PBGA-B352 | 2.1V | 23.3V | 1.9V | 350MHz | MICROPROCESSOR, RISC | PowerPC 603e | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 3.3V | 1 Core 32-Bit | No | SDRAM | I2C, I2O, PCI, UART | 1.65mm | 35mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No P1022NSN2HFB | NXP USA Inc. | Datasheet | 1944 | - | Min: 1 Mult: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | QorIQ P1 | Active | 3 (168 Hours) | 689 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | P1022 | S-PBGA-B689 | 1.05V | 0.95V | 1.055GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 32 | 16 | YES | YES | 64 | FIXED POINT | YES | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, I2S, MMC/SD, SPI | LCD | SATA 3Gbps (2) | 2.46mm | 31mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8347EVVAGDB | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 672-LBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 672 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B672 | 1.26V | 1.22.53.3V | 1.14V | 400MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | Security; SEC | Cryptography, Random Number Generator | 1.69mm | 35mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MC68EN360ZQ25VL | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 357-BBGA | YES | 46 | 0°C~70°C TA | Tray | 1995 | M683xx | e0 | Last Time Buy | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 5V | 1.27mm | 40 | MC68EN360 | S-PBGA-B357 | 5.25V | 4.75V | 25MHz | MICROCONTROLLER, RISC | CPU32+ | 6MHz | 32 | NO | YES | NO | NO | 32 | 32 | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | SCC, SMC, SPI | Communications; CPM | 1.86mm | 25mm | Non-RoHS Compliant |
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P1022NSN2LFB
NXP USA Inc.
Package:Embedded - Microprocessors
123.579559
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MPC8555CVTAJD
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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LS1020AXN7HNB
NXP USA Inc.
Package:Embedded - Microprocessors
47.967724
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AT91SAM9CN12B-CFU
Microchip Technology
Package:Embedded - Microprocessors
11.572129
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MPC860PVR50D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8536EBVJAULA
NXP USA Inc.
Package:Embedded - Microprocessors
303.888899
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P4080NSN1PNB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MC68MH360VR25VL
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8560PX667LC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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OMAPL138BGWTMEP
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
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MC8640DHX1067NE
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MC7447AHX1420LB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6X2CVN08AC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6Q5EZK08AE
NXP USA Inc.
Package:Embedded - Microprocessors
125.363298
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ATSAMA5D43B-CUR
Microchip Technology
Package:Embedded - Microprocessors
13.556408
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T4240NSE7TTB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8245TVV350D
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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P1022NSN2HFB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8347EVVAGDB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MC68EN360ZQ25VL
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire