The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
- All Manufacturers
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Memory Types | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Nominal Supply Current | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Bit Size | Access Time | Data Bus Width | Halogen Free | Number of Timers/Counters | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Number of Cores | Barrel Shifter | Internal Bus Architecture | Security Features | Display & Interface Controllers | SATA | Height | Height Seated (Max) | Length | Width | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No MC68SEC000FU16 | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | 757 |
| Min: 1 Mult: 1 | QFP | YES | Bulk | e0 | 1 (Unlimited) | 64 | EAR99 | 70°C | 0°C | CAN ALSO OPERATE WITH 5V SUPPLY | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.8mm | 16MHz | NOT SPECIFIED | 64 | Not Qualified | 5V | COMMERCIAL | MICROPROCESSOR | 32 | 16 μs | Not Halogen Free | 24 | YES | 16 | FIXED POINT | NO | 1 | 2.45mm | RoHS Compliant | Contains Lead | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No BSC9131NSN1KHKB | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 520-FBGA, FCBGA | YES | 0°C~105°C TA | Bulk | 2002 | QorIQ Qonverge BSC | e1 | Obsolete | 3 (168 Hours) | 520 | 3A991.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 0.8mm | 30 | S-PBGA-B520 | 1.05V | 0.97V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500 | 32 | 16 | YES | YES | 32 | FIXED POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 (1) | AIC, DUART, I2C, MMC/SD, SPI, USIM | Signal Processing; SC3850 | 1.97mm | 21mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MCIMX6X3CVO08AC | NXP USA Inc. | Datasheet | 340 |
| Min: 1 Mult: 1 | 15 Weeks | 400-LFBGA | -40°C~105°C TA | Tray | i.MX6SX | Active | 3 (168 Hours) | 8542.39.00.01 | 260 | 40 | 200MHz, 800MHz | ARM® Cortex®-A9, ARM® Cortex®-M4 | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No ATSAMA5D27A-CU | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 19 Weeks | Copper, Silver, Tin | Surface Mount | 289-LFBGA | 289 | External Program Memory, ROM | 128 | -40°C~85°C TA | Tray | 2016 | SAMA5D2 | yes | Obsolete | 3 (168 Hours) | 500MHz | ATSAMA5D27 | 1.2V | CAN, EBI/EMI, Ethernet, I2C, I2S, IrDA, LIN, MMC, SD, SDIO, SPI, UART, USART, USB | 1.32V | 1.1V | 160kB | Internal | 128kB | ARM® Cortex®-A5 | DMA, LCD, POR, PWM, WDT | 32b | 6 | ARM | 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | Multimedia; NEON™ MPE | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | No SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LS1012ASE7HKA | NXP USA Inc. | Datasheet | 2074 | - | Min: 1 Mult: 1 | 24 Weeks | 211-VFLGA | 0°C~105°C | Tray | 2016 | QorIQ® Layerscape | Active | 3 (168 Hours) | 800MHz | ARM® Cortex®-A53 | GbE (2) | 1 Core 64-Bit | DDR3L | USB 2.0 (1), USB 3.0 + PHY | Secure Boot, TrustZone® | SATA 6Gbps (1) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8379CVRALGA | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | -40°C~125°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8379 | S-PBGA-B689 | 1.05V | 11.8/2.52.5/3.3V | 0.95V | 667MHz | MICROPROCESSOR | PowerPC e300c4s | 32 | 15 | YES | YES | 64 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | SATA 3Gbps (4) | 2.46mm | 31mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MIMX8MD6DVAJZAA | NXP USA Inc. | Datasheet | 35 |
| Min: 1 Mult: 1 | 16 Weeks | 621-FBGA, FCBGA | Commercial grade | 0°C~95°C TJ | Tray | 2016 | i.MX8MD | Not For New Designs | 3 (168 Hours) | 260 | compliant | NOT SPECIFIED | 1.5GHz | ARM® Cortex®-A53 | GbE | 2 Core 32-Bit | Yes | DDR3L, DDR4, LPDDR4 | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, UART, uSDHC | ARM® Cortex®-M4 | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | eDP, HDMI, MIPI-CSI, MIPI-DSI | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MC68302EH25CB1 | NXP USA Inc. | Datasheet | 75 |
| Min: 1 Mult: 1 | 132-BQFP Bumpered | YES | 0°C~70°C TA | Tray | 1995 | M683xx | Not For New Designs | 3 (168 Hours) | 132 | 8542.31.00.01 | QUAD | GULL WING | 0.635mm | MC68302 | S-PQFP-G132 | 25MHz | M68000 | 5.0V | 1 Core 8/16-Bit | No | DRAM | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XOMAP3530BCBB | Texas Instruments | Datasheet | 10 | - | Min: 1 Mult: 1 | Surface Mount | 515-VFBGA, FCBGA | 515 | FLASH | 188 | 0°C~90°C TJ | Tray | OMAP-35xx | Obsolete | 3 (168 Hours) | 515 | 8542.31.00.01 | BOTTOM | BALL | 1.8V | 0.4mm | 600MHz | OMAP3530 | 515 | 3V | 1.35V | I2C, MMC, SDIO, UART, USB | 256kB | 2mA | 64kB | MICROPROCESSOR | ARM® Cortex®-A8 | 32b | 12 | YES | YES | FLOATING POINT | YES | 1.8V 3.0V | 1 Core 32-Bit | Yes | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | LCD | 0.9mm | No | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC860SRCZQ50D4 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | -40°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MCIMX6S6AVM10AC | NXP USA Inc. | Datasheet | 80000 |
| Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | YES | -40°C~125°C TJ | Tray | i.MX6S | Active | 3 (168 Hours) | 624 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.8mm | NOT SPECIFIED | S-PBGA-B624 | 1.5V | 1.4V | 1GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC8378VRAGDA | NXP USA Inc. | Datasheet | 33 |
| Min: 1 Mult: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | 0°C~125°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8378 | S-PBGA-B689 | 1.05V | 11.8/2.52.5/3.3V | 0.95V | 400MHz | MICROPROCESSOR | PowerPC e300c4s | 66.66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | 2.46mm | 31mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No OMAPL138BZCEA3 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 361-LFBGA | 361 | -40°C~105°C TJ | Tray | OMAP-L1x | e1 | yes | Obsolete | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 0.65mm | 375MHz | OMAPL138 | 361 | 1.35V | 950mV | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | ARM | YES | YES | FLOATING POINT | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | 1 | NO | MULTIPLE | Boot Security, Cryptography | LCD | SATA 3Gbps (1) | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AT91SAM9G45B-CU-999 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 324-TFBGA | 324 | 324-TFBGA (15x15) | ROM | 160 | -40°C~85°C TA | Cut Tape (CT) | 2009 | SAM9G | Obsolete | 3 (168 Hours) | 85°C | -40°C | 400MHz | AT91SAM9G45 | 1.1V | EBI/EMI, Ethernet, I2C, IrDA, MMC, SPI, UART, USART, USB | 64kB | Internal | 400MHz | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | ARM | 1.8V 3.3V | 10/100Mbps | 1 Core 32-Bit | No | LPDDR, LPSDR, DDR2, SDR, SRAM | USB 2.0 (3) | AC97, EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | LCD, Touchscreen | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No SVF511R3K1CMK4 | NXP USA Inc. | Datasheet | 20 |
| Min: 1 Mult: 1 | 15 Weeks | 364-LFBGA | YES | -40°C~85°C TA | Tray | 2014 | Vybrid, VF5xxR | e1 | Active | 3 (168 Hours) | 364 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | 40 | SVF511 | S-PBGA-B364 | 3.6V | 3V | 400MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | 16 | YES | YES | 16 | FLOATING POINT | YES | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | 1.5mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8313EZQAFFC | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 516-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e0 | Last Time Buy | 3 (168 Hours) | 516 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8313 | S-PBGA-B516 | 1.05V | 11.8/2.53.3V | 0.95V | 333MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 32 | 15 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | Security; SEC 2.2 | Cryptography | 2.55mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC880ZP133 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1999 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 357 | 5A992 | TIN LEAD | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC880 | S-PBGA-B357 | 1.9V | 1.83.3V | 1.7V | 133MHz | MICROPROCESSOR, RISC | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (2), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No OMAPL138BZCEA3E | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 361-LFBGA | 361 | -40°C~105°C TJ | Tray | OMAP-L1x | e1 | yes | Obsolete | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 0.65mm | 375MHz | OMAPL138 | 361 | 1.35V | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | YES | YES | FLOATING POINT | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | NO | MULTIPLE | Boot Security, Cryptography | LCD | SATA 3Gbps (1) | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No P4040NSN1PNB | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 1295-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2009 | QorIQ P4 | e1 | Obsolete | 3 (168 Hours) | 3A991.A.1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 30 | P4040 | S-PBGA-B1295 | 1.05V | 0.95V | 1.5GHz | MICROPROCESSOR, RISC | PowerPC e500mc | 133.3MHz | 16 | YES | YES | 64 | FIXED POINT | YES | 1.8V 2.5V 3.3V | 1Gbps (8), 10Gbps (2) | 4 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | 3.53mm | 37.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No Z8L18020FSG | Zilog | Datasheet | 400 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 80-BQFP | 80 | ROMless | 0°C~70°C TA | Tray | 2000 | Z180 | e3 | yes | Active | 3 (168 Hours) | 80 | TIN | QUAD | GULL WING | 225 | 5V | 0.8mm | 20MHz | 30 | 80 | 5V | 5V | SCI, UART | MICROPROCESSOR | Z8L180 | 8 | 8b | 2 | Z8 | NO | YES | FIXED POINT | NO | 3.3V | 1 Core 8-Bit | No | DRAM | ASCI, CSIO, UART | 2.8mm | 20.1mm | 14.1mm | ROHS3 Compliant | Lead Free |
-
MC68SEC000FU16
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - Microprocessors
14.006848
-
BSC9131NSN1KHKB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MCIMX6X3CVO08AC
NXP USA Inc.
Package:Embedded - Microprocessors
18.856930
-
ATSAMA5D27A-CU
Microchip Technology
Package:Embedded - Microprocessors
Price: please inquire
-
LS1012ASE7HKA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MPC8379CVRALGA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MIMX8MD6DVAJZAA
NXP USA Inc.
Package:Embedded - Microprocessors
58.381248
-
MC68302EH25CB1
NXP USA Inc.
Package:Embedded - Microprocessors
72.749095
-
XOMAP3530BCBB
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
-
MPC860SRCZQ50D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MCIMX6S6AVM10AC
NXP USA Inc.
Package:Embedded - Microprocessors
68.317663
-
MPC8378VRAGDA
NXP USA Inc.
Package:Embedded - Microprocessors
95.050077
-
OMAPL138BZCEA3
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
-
AT91SAM9G45B-CU-999
Microchip Technology
Package:Embedded - Microprocessors
Price: please inquire
-
SVF511R3K1CMK4
NXP USA Inc.
Package:Embedded - Microprocessors
99.668181
-
MPC8313EZQAFFC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MPC880ZP133
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
OMAPL138BZCEA3E
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
-
P4040NSN1PNB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
Z8L18020FSG
Zilog
Package:Embedded - Microprocessors
18.635085