The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
- All Manufacturers
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Memory Types | Number of I/Os | ROM(word) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | Primary Clock/Crystal Frequency-Nom | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Output Clock Frequency-Max | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Number of Timers | Co-Processors/DSP | ROM Programmability | Number of External Interrupts | Barrel Shifter | Internal Bus Architecture | Security Features | Display & Interface Controllers | SATA | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No ATSAMA5D22B-CUR | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 196-TFBGA, CSBGA | External Program Memory | 72 | -40°C~85°C TA | Tape & Reel (TR) | 2017 | SAMA5D2 | yes | Obsolete | 3 (168 Hours) | 500MHz | ATSAMA5D22 | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, MMC, SD, SDIO, SPI, UART, USART, USB | Internal | ARM® Cortex®-A5 | DMA, LCD, POR, PWM, WDT | ARM | 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | Multimedia; NEON™ MPE | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MCIMX6L8DVN10AC | NXP USA Inc. | Datasheet | 4 |
| Min: 1 Mult: 1 | 12 Weeks | 432-TFBGA | YES | 0°C~95°C TJ | Tray | i.MX6SL | Active | 3 (168 Hours) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.5mm | 40 | S-PBGA-B | 1.5V | 1.375V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.1mm | 13mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No Z84C1510AEG | Zilog | Datasheet | 18 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 100-LQFP | 100 | 16 | 0 | -40°C~100°C TA | Tray | 2002 | Z80 | e3 | yes | Active | 3 (168 Hours) | 100 | MATTE TIN | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 10MHz | 40 | Z84C15 | 100 | 5V | 5V | MICROCONTROLLER | 8 | NO | NO | NO | NO | 16 | NO | YES | 8 | FIXED POINT | NO | 0 | 5.0V | 1 Core 8-Bit | No | 2 | 1 | 2 | 1.6mm | 14mm | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8308CZQAGDA | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 473-LFBGA | -40°C~105°C TA | Tray | 2002 | MPC83xx | e0 | Active | 3 (168 Hours) | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | 260 | 40 | MPC8308 | 400MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | DUART, HSSI, I2C, MMC/SD/SDIO, SPI | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC860ENZQ50D4R2 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tape & Reel (TR) | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XOMAPL137DZKBA3 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | 256-BGA | YES | -40°C~105°C TJ | Tray | OMAP-L1x | e1 | no | Obsolete | 4 (72 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | OMAPL137 | 256 | S-PBGA-B256 | 1.32V | 1.14V | 375MHz | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | 30MHz | 15 | YES | YES | 16 | FLOATING POINT | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | NO | SINGLE | LCD | 2.05mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8313ECVRAGDB | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 516-BBGA Exposed Pad | -40°C~105°C TA | Tray | 2004 | MPC83xx | Obsolete | 3 (168 Hours) | MPC8313 | 400MHz | PowerPC e300c3 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | Security; SEC 2.2 | Cryptography | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY2254ASC-1T | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | SOIC | 28 | Tape and Reel | e0 | 1 (Unlimited) | 28 | EAR99 | TIN LEAD | 70°C | 0°C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | DUAL | GULL WING | 225 | 3.3V | 1.27mm | 30 | 28 | Not Qualified | 3.6V | COMMERCIAL | 3.135V | CLOCK GENERATOR, PROCESSOR SPECIFIC | 14.318MHz | 66.66MHz | 2.65mm | 17.9mm | 7.5mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8541ECPXALF | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 783-BBGA, FCBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC85xx | e0 | Obsolete | 3 (168 Hours) | 783 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.2V | 1mm | 30 | MPC8541 | R-PBGA-B783 | 1.26V | 1.14V | 667MHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | 64 | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | DUART, I2C, PCI | Security; SEC | Cryptography, Random Number Generator | 3.75mm | 29mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No P1010NXE5DFA | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 425-FBGA | YES | -40°C~105°C TA | Tray | 2010 | QorIQ P1 | e2 | Obsolete | 3 (168 Hours) | 425 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | 1V | P1010 | 1V | 1.0GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 32 | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (1) | CAN, DUART, I2C, MMC/SD, SPI | Security; SEC 4.4 | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | SATA 3Gbps (2) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC850DSLCVR50BU | NXP USA Inc. | Datasheet | 80000 | - | Min: 1 Mult: 1 | 12 Weeks | 256-BBGA | YES | -40°C~95°C TA | Tray | 1997 | MPC8xx | e1 | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1.27mm | 40 | MPC850 | S-PBGA-B256 | 3.6V | 3.3V | 3V | 50MHz | MICROPROCESSOR, RISC | 32 | 26 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | 2.54mm | 23mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8321CVRADDC | NXP USA Inc. | Datasheet | 240 | - | Min: 1 Mult: 1 | 516-BBGA | YES | -40°C~105°C TA | Tray | 2004 | MPC83xx | e2 | Obsolete | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8321 | S-PBGA-B516 | 1.05V | 0.95V | 266MHz | MICROPROCESSOR, RISC | PowerPC e300c2 | 66.67MHz | 32 | YES | YES | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine | 2.55mm | 27mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC8321EVRADDC | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 516-BBGA | YES | 0°C~105°C TA | Tray | 1999 | MPC83xx | e2 | Obsolete | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8321 | S-PBGA-B516 | 1.05V | 0.95V | 266MHz | MICROPROCESSOR, RISC | PowerPC e300c2 | 66.67MHz | 32 | YES | YES | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine, Security; SEC 2.2 | Cryptography | 2.55mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8343CVRADDB | NXP USA Inc. | Datasheet | 16 |
| Min: 1 Mult: 1 | 12 Weeks | 620-BBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 620 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8343 | S-PBGA-B620 | 1.26V | 1.21.8/2.52.5/3.3V | 1.14V | 266MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | 2.46mm | 29mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MC9328MX1DVM15 | NXP USA Inc. | Datasheet | 8 |
| Min: 1 Mult: 1 | 10 Weeks | 256-MAPBGA | -30°C~70°C TA | Tray | 1994 | i.MX1 | Not For New Designs | 3 (168 Hours) | MC9328MX1 | 150MHz | ARM920T | 1.8V 3.0V | 1 Core 32-Bit | No | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, MMC/SD, UART | LCD, Touch Panel | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No OMAP3503ECUS72 | Texas Instruments | Datasheet | 16 |
| Min: 1 Mult: 1 | 12 Weeks | ACTIVE (Last Updated: 4 days ago) | Surface Mount | 423-LFBGA, FCBGA | 423 | L2 Cache, ROM, SRAM | 0°C~90°C TJ | Tray | OMAP-35xx | e1 | Active | 4 (72 Hours) | 423 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 0.65mm | 720MHz | OMAP3503 | 423 | 1.35V | I2C, SPI, UART, USB | 1.89V | 1.71V | DIGITAL SIGNAL PROCESSOR, OTHER | ARM® Cortex®-A8 | 32b | ARM | YES | YES | FLOATING POINT | YES | 64000 | 1.8V 3.0V | 3 | 1 Core 32-Bit | No | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 15 | Multimedia; NEON™ SIMD | MROM | NO | SINGLE | LCD | 1.4mm | 16mm | 16mm | 960μm | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No OMAPL137BZKBA3 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | Copper, Silver, Tin | Surface Mount | 256-BGA | 256 | 16 | -40°C~105°C TJ | Tray | OMAP-L1x | e1 | no | Obsolete | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 1mm | 375MHz | OMAPL137 | 256 | 1.32V | 1.32V | 1.14V | 128kB | 8kB | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | 32b | 2 | 13 | ARM | YES | YES | FLOATING POINT | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | NO | MULTIPLE | LCD | 17mm | ROHS3 Compliant | Contains Lead | ||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MC68EC020AA25 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 100-BQFP | 100-QFP (14x20) | 0°C~70°C TA | Tray | 1995 | M680x0 | Obsolete | 3 (168 Hours) | MC68EC020 | 25MHz | 68020 | 5.0V | 1 Core 32-Bit | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC8545EVJANGD | NXP USA Inc. | Datasheet | 2263 |
| Min: 1 Mult: 1 | 18 Weeks | 783-BBGA, FCBGA | 0°C~105°C TA | Tray | 2011 | MPC85xx | Active | 3 (168 Hours) | 800MHz | PowerPC e500 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | DUART, I2C, PCI, RapidIO | Signal Processing; SPE, Security; SEC | Cryptography, Random Number Generator | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No OMAP3530DCBC | Texas Instruments | Datasheet | 88 |
| Min: 1 Mult: 1 | Surface Mount | 515-VFBGA, FCBGA | 515 | L2 Cache, ROM, SRAM | 0°C~90°C TJ | Tray | OMAP-35xx | no | Obsolete | 3 (168 Hours) | 515 | BOTTOM | BALL | 1.8V | 0.65mm | 720MHz | OMAP3530 | 515 | 1.35V | I2C, MMC, SDIO, UART, USB | 1.35V | 985mV | 600 MHz | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | 12 | 26 | ARM | YES | YES | FLOATING POINT | YES | 1.8V 3.0V | 3 | 1 Core 32-Bit | Yes | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | LCD | 1mm | 14mm | No | ROHS3 Compliant | Contains Lead |
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ATSAMA5D22B-CUR
Microchip Technology
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6L8DVN10AC
NXP USA Inc.
Package:Embedded - Microprocessors
36.803868
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Z84C1510AEG
Zilog
Package:Embedded - Microprocessors
14.199979
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MPC8308CZQAGDA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC860ENZQ50D4R2
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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XOMAPL137DZKBA3
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
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MPC8313ECVRAGDB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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CY2254ASC-1T
Cypress Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
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MPC8541ECPXALF
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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P1010NXE5DFA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC850DSLCVR50BU
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8321CVRADDC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8321EVRADDC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8343CVRADDB
NXP USA Inc.
Package:Embedded - Microprocessors
75.636580
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MC9328MX1DVM15
NXP USA Inc.
Package:Embedded - Microprocessors
26.749769
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OMAP3503ECUS72
Texas Instruments
Package:Embedded - Microprocessors
55.117785
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OMAPL137BZKBA3
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
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MC68EC020AA25
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8545EVJANGD
NXP USA Inc.
Package:Embedded - Microprocessors
149.399844
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OMAP3530DCBC
Texas Instruments
Package:Embedded - Microprocessors
52.365820