The category is 'Memory Cards'
Memory Cards (4503)
- All Manufacturers
- Memory Size
- Series
- Part Status
- RoHS Status
- Memory Types
- Operating Temperature
- Factory Lead Time
- Moisture Sensitivity Level (MSL)
- Speed
- JESD-30 Code
- Published
- Terminal Position
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Surface Mount | Weight | Number of Terminals | Access Time-Max | Card | CAS Latency | Chip Configuration | Chip Density (bit) | Chip Density (byte) | Chip Package Type | Connecting Mode | Conntact Coatings | Contact Materials | Data Bus Width (bit) | ECC Support | ECCN (US) | Height from mounting surface (mm) | HTS | Ihs Manufacturer | Interface Type | Lead Shape | Manufacturer | Manufacturer Part Number | Max. Access Time (ns) | Maximum Clock Rate (MHz) | Maximum Operating Supply Voltage (V) | Maximum Operating Temperature (°C) | Maximum Self Height | Memory | Memory capacity | Minimum Operating Supply Voltage (V) | Minimum Operating Temperature (°C) | Model | Module | Module Density | Module Sides | Mounting | Name | Number of Chip Banks | Number of Chip per Module | Number of Ranks | Number of Words | Number of Words Code | Operating Current (mA) | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Overall Dimension | Package Body Material | Package Code | Package Description | Package Height | Package Length | Package Shape | Package Specifications | Package Style | Package Width | Part Life Cycle Code | Part Package Code | PC Type | PCB changed | Programmability | Programmable | Rad Hardened | Risk Rank | Rohs Code | Soldering Temp (Max) | SPD EEPROM Support | Standard Package Name | Supplier Package | Supplier Temperature Grade | Supply Voltage-Nom (Vsup) | Typical Operating Supply Voltage (V) | Packaging | Part Status | ECCN Code | Type | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Card Type | Configuration | Number of Ports | Operating Mode | Organization | Memory Width | Memory Density | PLL | Memory IC Type | Access Mode | Features | Self Refresh | Module Type | RoHS Status |
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 | Mfr Part No XKTF-001C | XKB CONNECTIVITY | Datasheet | 160000 |
| Min: 1 Mult: 1 | 0.854 | Self-ejecting | Gold plated | Copper alloys | 1.85 | 1.85mm | #REF! | W15.25XD14.0XH1.85 | SMD | 260°C | Active | 8 | MicroSD卡(TF卡) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XKSIM-304 | XKB CONNECTIVITY | Datasheet | 160000 |
| Min: 1 Mult: 1 | 0.499 | Plug and Play | Gold plated | Phosphor Bronze | 1.35 | 1.35mm | #REF! | W12.3XD10.05XH1.35 | SMD | 260°C | Active | 6 | NanoSIM卡 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XKSIM-2652-P6 | XKB CONNECTIVITY | Datasheet | - | - | Min: 1 Mult: 1 | 0 | Plug and Play | Gold plated | Phosphor Bronze | 2.65mm | #REF! | SMD | 260°C | Active | MicroSIM卡 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XKSD-1150-G | XKB CONNECTIVITY | Datasheet | - | - | Min: 1 Mult: 1 | 0 | Plug and Play | Gold plated | Phosphor Bronze | 3.43mm | #REF! | SMD | 260°C | Active | 标准SD卡 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XKSIM-2653-P6 | XKB CONNECTIVITY | Datasheet | - | - | Min: 1 Mult: 1 | 0 | Plug and Play | Gold plated | Copper alloys | 2.65mm | #REF! | SMD | 260°C | Active | MicroSIM卡 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XKSIM-115 | XKB CONNECTIVITY | Datasheet | - | - | Min: 1 Mult: 1 | 2.365 | Self-ejecting | Gold plated | Copper alloys | 2.15 | 2.2mm | #REF! | W26.50XD19.35XH2.15 | SMD | 260°C | Active | 8 | MicroSIM卡 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XKSIM-036-A | XKB CONNECTIVITY | Datasheet | - | - | Min: 1 Mult: 1 | 0.718 | Plug and Play | Gold plated | Copper alloys | 2.4 | 2.4mm | #REF! | W15.6XD10.3XH2.4 | SMD | 260°C | Active | 6 | MiniSIM卡 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XKSIM-003-P7 | XKB CONNECTIVITY | Datasheet | 160000 |
| Min: 1 Mult: 1 | 1.023 | Self-ejecting | Gold plated | Copper alloys | 1.5 | 1.5mm | #REF! | W17.17XD15.75XH1.5 | SMD | 260°C | Active | 7 | MicroSIM卡 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XKSIM-816-P8 | XKB CONNECTIVITY | Datasheet | - | - | Min: 1 Mult: 1 | 5.11 | Drawer type | Gold plated | Copper alloys | 3.1mm | #REF! | SMD | 260°C | Active | MiniSIM卡 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No KVR16N11H/8 | Kingston Technology | Datasheet | - | - | Min: 1 Mult: 1 | 4 Weeks, 2 Days | 0.03 | 11 | 512Mx8 | 4G | FBGA | 64 | No | EAR99 | 8473.30.11.40 | KINGSTON TECHNOLOGY COMPANY INC | No Lead | Kingston Technology Company | KVR16N11H/8 | 1600 | 1.575 | 85 | 8GB | 8GB | 1.425 | 0 | ValueRAM | DRAM Module | 8Gbyte | Double | Socket | 16 | Dual | , | 30 | 133.35 | Contact Manufacturer | PC3-12800 | 240 | 5.71 | Yes | DIM | DIMM | 1.5 | Active | ValueRAM | unknown | 240 | 240-pin DIMM | 1Gx64 | 8 | No | Unbuffered,Dual Rank | Yes | 240DIMM | Yes with exemptions | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No KVR16R11S8/4 | Kingston Technology | Datasheet | - | - | Min: 1 Mult: 1 | 11 | 512Mx8 | 4G | FBGA | 72 | Yes | EAR99 | No Lead | 800 | 1.575 | 85 | 1.425 | 0 | DRAM Module | 4Gbyte | Double | Socket | 9 | Single | 30 | 133.35 | PC3-12800 | 240 | Yes | DIM | RDIMM | 1.5 | Obsolete | 240 | 512Mx72 | Yes | Yes | 240RDIMM | Supplier Unconfirmed | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M386A8K40CM2-CRC | Samsung Electronics | Datasheet | - | - | Min: 1 Mult: 1 | 4Gx4 | 16G | 78FBGA | 72 | Yes | 8473.30.11.40 | 1.26 | 1.14 | DRAM Module | 64Gbyte | Double | 16 | 36 | Quad | No | Extended | 1.2 | Active | 8Gx72 | No | Yes | 288LRDIMM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M393A2K43BB1-CTD7Q | Samsung Electronics | Datasheet | - | - | Min: 1 Mult: 1 | 19 | 1Gx8 | 8G | FBGA | 72 | No | 4A994.a | 8542.32.00.71 | No Lead | 2666 | 85 | 0 | DRAM Module | 16Gbyte | Socket | 18 | Dual | 31.25 | 133.35 | 3.9(Max) | 288 | DIM | RDIMM | Commercial | 1.2 | Active | 288 | 2Gx72 | 288RDIMM | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No WF128K32N-70H1M5 | Microsemi | Datasheet | - | - | Min: 1 Mult: 1 | 128Kx8 | 1M | HIP | 32 | No | 4A994.a | 70 | 5.5 | 125 | 4.5 | -55 | Flash Module | 4Mbit | Through Hole | 4 | 140 | 3.71(Max) | 27.3 | 27.3 | 66 | HIP | Military | 5 | Obsolete | 66 | 128Kx32 | No | Supplier Unconfirmed | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No KVR24N17S6L/4 | Kingston Technology | Datasheet | - | - | Min: 1 Mult: 1 | 17 | 512Mx16 | 8G | FBGA | 64 | No | EAR99 | 8473.30.11.40 | 2400 | 85 | 0 | DRAM Module | 4Gbyte | Single | Socket | 4 | Single | 18.75 | 133.35 | PC4-2400 | 288 | Yes | VLP DIMM | 1.2 | LTB | 288 | 512Mx64 | Yes | 288DIMM | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W3H128M72E-400SBI | Microsemi | Datasheet | - | - | Min: 1 Mult: 1 | 4 | 1.8G | PBGA | 72 | Yes | 4A994.a | 1.35 | 400 | 1.9 | 85 | 1.7 | -40 | DRAM Module | 1Gbyte | Surface Mount | 8 | 5 | 900 | 4.57(Max) | 22.1(Max) | 16.1(Max) | 208 | No | BGA | Industrial | 1.8 | Active | 208 | 128Mx72 | No | Yes | Supplier Unconfirmed | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W3H128M72E-667NBM | Microsemi | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | 0.5 ns | 6 | 1.8G | PBGA | 72 | Yes | 4A994.a | MICROSEMI CORP | Microsemi Corporation | W3H128M72E-667NBM | 1.25 | 667 | 1.9 | 125 | 1.7 | -55 | DRAM Module | 1Gbyte | Surface Mount | 8 | 5 | 134217728 words | 128000000 | 1375 | 125 °C | -55 °C | PLASTIC/EPOXY | BGA | BGA, | 3.94(Max) | 22.1(Max) | RECTANGULAR | GRID ARRAY | 16.1(Max) | Transferred | BGA | 208 | 5.43 | No | No | BGA | Military | 1.8 V | 1.8 | EAR99 | AUTO/SELF REFRESH | 8542.32.00.36 | CMOS | BOTTOM | BALL | 1 | 1 mm | compliant | 208 | R-PBGA-B208 | Not Qualified | 1.9 V | MILITARY | 1.7 V | 1 | SYNCHRONOUS | 128Mx72 | 72 | 9663676416 bit | No | DDR DRAM | MULTI BANK PAGE BURST | Yes | Supplier Unconfirmed | |||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No TS8FCFSAR00ISI | Transcend Information | Datasheet | - | - | Min: 1 Mult: 1 | CompactFlash | 8G | EAR99 | 8523.80.20.00 | IDE/PCMCIA | 3.63|5.5 | 85 | 2.97|4.5 | -40 | Socket | 3.63/5.5(V) | 2.97/4.5(V) | 3.3/5(V) | 85C | -40C | Industrial | 3.93 | 42.8 | 36.4 | 50 | Yes | Yes | No | Industrial | 5|3.3 | Bulk | Active | CompactFlash | 50 | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M470T2864EH3-CE600 | Samsung Electronics | Datasheet | - | - | Min: 1 Mult: 1 | 5 | 64Mx16 | 1G | FBGA | 64 | No | 4A994.a | 8473.30.11.40 | No Lead | 0.45 | 667 | 1.9 | 95 | 1.7 | 0 | DRAM Module | 1Gbyte | Double | Socket | 8 | 8 | Dual | 428 | 30 | 67.6 | 3.8(Max) | 200 | Yes | DIM | USODIMM | Commercial | 1.8 | Obsolete | 200 | 128Mx64 | No | Yes | 200SODIMM | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No SFCF1024H1BK1TO-I-MS-553 | Swissbit | Datasheet | - | - | Min: 1 Mult: 1 | CompactFlash | 1G | EAR99 | 8523.59.00.00 | PATA | 3.63|5.5 | 85 | 4.5|2.97 | -40 | Socket | 3.93 | 42.8 | 36.4 | 50 | Yes | Industrial | 3.3|5 | LTB | 50 | Yes with exemptions |
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XKTF-001C
XKB CONNECTIVITY
Package:Memory Cards
0.216581
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XKSIM-304
XKB CONNECTIVITY
Package:Memory Cards
0.148450
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XKSIM-2652-P6
XKB CONNECTIVITY
Package:Memory Cards
Price: please inquire
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XKSD-1150-G
XKB CONNECTIVITY
Package:Memory Cards
Price: please inquire
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XKSIM-2653-P6
XKB CONNECTIVITY
Package:Memory Cards
Price: please inquire
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XKSIM-115
XKB CONNECTIVITY
Package:Memory Cards
Price: please inquire
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XKSIM-036-A
XKB CONNECTIVITY
Package:Memory Cards
Price: please inquire
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XKSIM-003-P7
XKB CONNECTIVITY
Package:Memory Cards
0.234395
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XKSIM-816-P8
XKB CONNECTIVITY
Package:Memory Cards
Price: please inquire
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KVR16N11H/8
Kingston Technology
Package:Memory Cards
Price: please inquire
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KVR16R11S8/4
Kingston Technology
Package:Memory Cards
Price: please inquire
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M386A8K40CM2-CRC
Samsung Electronics
Package:Memory Cards
Price: please inquire
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M393A2K43BB1-CTD7Q
Samsung Electronics
Package:Memory Cards
Price: please inquire
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WF128K32N-70H1M5
Microsemi
Package:Memory Cards
Price: please inquire
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KVR24N17S6L/4
Kingston Technology
Package:Memory Cards
Price: please inquire
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W3H128M72E-400SBI
Microsemi
Package:Memory Cards
Price: please inquire
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W3H128M72E-667NBM
Microsemi
Package:Memory Cards
Price: please inquire
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TS8FCFSAR00ISI
Transcend Information
Package:Memory Cards
Price: please inquire
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M470T2864EH3-CE600
Samsung Electronics
Package:Memory Cards
Price: please inquire
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SFCF1024H1BK1TO-I-MS-553
Swissbit
Package:Memory Cards
Price: please inquire