The category is 'Memory'
Memory (6000)
- All Manufacturers
- Packaging
- Part Status
- RoHS Status
- Memory Format
- Memory Interface
- Memory Size
- Memory Types
- Mounting Type
- Operating Temperature
- Package / Case
- Voltage - Supply
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Memory Types | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Number of Ports | Nominal Supply Current | Operating Mode | Clock Frequency | Supply Current-Max | Access Time | Memory Format | Memory Interface | Data Bus Width | Common Mode Rejection Ratio | Organization | Output Characteristics | Seated Height-Max | Memory Width | Gain Bandwidth Product | Write Cycle Time - Word, Page | Address Bus Width | Voltage Gain | Density | Standby Current-Max | Memory Density | Max Frequency | Access Time (Max) | Parallel/Serial | I/O Type | Sync/Async | Word Size | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Standby Voltage-Min | Alternate Memory Width | Page Size | Ambient Temperature Range High | I2C Control Byte | Height | Height Seated (Max) | Length | Width | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
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 | Mfr Part No M95040-RMC6TG | STMicroelectronics | Datasheet | 80000 |
| Min: 1 Mult: 1 | 12 Weeks | ACTIVE (Last Updated: 7 months ago) | Surface Mount | Surface Mount | 8-UFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | Active | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 1 | 0.5mm | M95040 | 8 | 5.5V | 2/5V | SPI, Serial | 4Kb 512 x 8 | 5mA | 5MHz | 80 ns | EEPROM | SPI | 62 dB | 4KX1 | 1 | 20MHz | 5ms | 91dB | 4 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE/SOFTWARE | 0.6mm | 3mm | No | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W25Q256FVEIG | Winbond Electronics | Datasheet | 3498 |
| Min: 1 Mult: 1 | 14 Weeks | Surface Mount | Surface Mount | 8-WDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2016 | SpiFlash® | Discontinued | 3 (168 Hours) | 8 | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | Not Qualified | 3.3V | 3.6V | 2.7V | SPI | 256Mb 32M x 8 | 20mA | 104MHz | 7 ns | FLASH | SPI - Quad I/O, QPI | 256MX1 | 1 | 50μs, 3ms | 1b | 256 Mb | 0.000025A | SERIAL | Synchronous | 8b | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 85°C | 800μm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 11LC040-I/P | Microchip Technology | Datasheet | 1195 | - | Min: 1 Mult: 1 | 10 Weeks | Tin | Through Hole | Through Hole | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e3 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 1 | 5V | 2.54mm | 11LC040 | 8 | 5V | Serial | 4Kb 512 x 8 | 5mA | 100kHz | 5 ms | EEPROM | Single Wire | 4 kb | 0.000005A | 1-WIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 3.3mm | 9.46mm | 6.35mm | No | No SVHC | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No BR24G64FJ-3AGTE2 | ROHM Semiconductor | Datasheet | 1896 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | Active | 1 (Unlimited) | 8 | SEATED HT-CALCULATED, ALSO GIVEN 1.6V-5.5V OPERATES WITH 0.4MHZ | 1.7V~5.5V | DUAL | NOT SPECIFIED | 1 | 1.27mm | NOT SPECIFIED | BR24G64 | 5.5V | 1.7V | 2-Wire, I2C, Serial | 64Kb 8K x 8 | SYNCHRONOUS | 1MHz | EEPROM | I2C | 8 | 5ms | 65536 bit | I2C | 5ms | 1.65mm | 4.9mm | 3.9mm | Unknown | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 24LCS52T-I/MC | Microchip Technology | Datasheet | 21 | - | Min: 1 Mult: 1 | 6 Weeks | Tin | Surface Mount | Surface Mount | 8-VFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2003 | e3 | yes | Active | 3 (168 Hours) | 8 | EAR99 | 2.2V~5.5V | DUAL | 260 | 1 | 5V | 0.5mm | 40 | 24LCS52 | 8 | 5.5V | 2.5/5V | 2.2V | 2-Wire, I2C, Serial | 2Kb 256 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1010DDDR | 950μm | 2mm | 3mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BR24T01FJ-WE2 | ROHM Semiconductor | Datasheet | 36 | - | Min: 1 Mult: 1 | 10 Weeks | Copper, Tin | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | e3 | yes | Active | 1 (Unlimited) | 8 | Matte Tin (Sn) | 1.6V~5.5V | DUAL | 225 | 1 | 2.5V | 1.27mm | NOT SPECIFIED | BR24T01 | Not Qualified | 5.5V | 1.6V | 2-Wire, I2C, Serial | 1Kb 128 x 8 | SYNCHRONOUS | 400kHz | 900 ns | EEPROM | I2C | 8 | 5ms | 1 kb | 0.000002A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DDDR | 1.65mm | 4.9mm | 3.9mm | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W25Q64FWZPIG | Winbond Electronics | Datasheet | 24 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 8-WDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2014 | SpiFlash® | e3 | Active | 3 (168 Hours) | 8 | Tin (Sn) | 1.65V~1.95V | DUAL | 1 | 1.8V | 1.27mm | 8 | 1.8V | 1.95V | 1.65V | SPI, Serial | 64Mb 8M x 8 | 20mA | 104MHz | 6 ns | FLASH | SPI | 64MX1 | 1 | 5ms | 24b | 64 Mb | 0.00002A | Synchronous | 8b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 6mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No IS62WV12816EBLL-45TLI | ISSI, Integrated Silicon Solution Inc | Datasheet | 160 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 44-TSOP (0.400, 10.16mm Width) | YES | 44 | Volatile | -40°C~85°C TA | Tray | Active | 3 (168 Hours) | 44 | 8542.32.00.41 | 2.2V~3.6V | DUAL | NOT SPECIFIED | 1 | 3V | 0.8mm | NOT SPECIFIED | 3.6V | 2.2V | 2Mb 128K x 16 | SRAM | Parallel | 128KX16 | 16 | 45ns | 2097152 bit | 45 ns | 1.2mm | 18.41mm | 10.16mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No S25FL064P0XMFB003 | Cypress Semiconductor Corp | Datasheet | 1160 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 16-SOIC (0.295, 7.50mm Width) | YES | Non-Volatile | -40°C~105°C TA | Tape & Reel (TR) | Automotive, AEC-Q100, FL-P | Active | 3 (168 Hours) | 16 | 8542.32.00.51 | 2.7V~3.6V | DUAL | NOT SPECIFIED | 1 | 3V | 1.27mm | NOT SPECIFIED | R-PDSO-G16 | 3.6V | 2.7V | 64Mb 8M x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI - Quad I/O | 64MX1 | 1 | 5μs, 3ms | 67108864 bit | SERIAL | 3V | 2.65mm | 10.3mm | 7.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 93AA46CXT-I/SN | Microchip Technology | Datasheet | 8000 |
| Min: 1 Mult: 1 | 6 Weeks | Tin | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 93AA46C | 8 | 5.5V | 2/5V | Serial | 1Kb 128 x 8 64 x 16 | 2mA | 3MHz | 200 ns | EEPROM | SPI | 64X16 | 16 | 6ms | 1 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 8 | 1.75mm | 4.9mm | 3.9mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IS61WV25616BLL-10TL | ISSI, Integrated Silicon Solution Inc | Datasheet | 6 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 44-TSOP (0.400, 10.16mm Width) | YES | 44 | Volatile | 0°C~70°C TA | Tray | e3 | yes | Active | 3 (168 Hours) | 44 | Matte Tin (Sn) - annealed | 2.4V~3.6V | DUAL | 260 | 1 | 3.3V | 0.8mm | 40 | 44 | 3.6V | 2.5/3.3V | 2.4V | 4Mb 256K x 16 | 1 | 40mA | SRAM | Parallel | 3-STATE | 16 | 10ns | 18b | 4 Mb | 0.008A | 100MHz | COMMON | Asynchronous | 16b | 2V | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No FM18W08-SG | Cypress Semiconductor Corp | Datasheet | 1 |
| Min: 1 Mult: 1 | 6 Weeks | Surface Mount | Surface Mount | 28-SOIC (0.295, 7.50mm Width) | 28 | Non-Volatile | -40°C~85°C TA | Tube | 2005 | F-RAM™ | e3 | Active | 3 (168 Hours) | 28 | EAR99 | Tin (Sn) | 8542.32.00.71 | 2.7V~5.5V | DUAL | 260 | 1 | 3.3V | 1.27mm | 30 | FM18W08 | 28 | 3.3V | 5.5V | 3/5V | 2.7V | 256Kb 32K x 8 | 12mA | 70 ns | FRAM | Parallel | 8b | 32KX8 | 130ns | 256 kb | 0.00005A | 8b | 85°C | 2.67mm | 18.11mm | 7.62mm | No | No SVHC | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M25P80-VMW6G | Micron Technology Inc. | Datasheet | 2952 | - | Min: 1 Mult: 1 | Surface Mount | 8-SOIC (0.209, 5.30mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2007 | yes | Obsolete | 3 (168 Hours) | 8 | SMD/SMT | EAR99 | LG-MAX | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 30 | M25P80 | 8 | 3.3V | 2.7V | SPI, Serial | 8Mb 1M x 8 | 8mA | 75MHz | 8 ns | FLASH | SPI | 1 | 15ms, 5ms | 1b | 8 Mb | 0.0001A | Synchronous | 8b | SPI | 100000 Write/Erase Cycles | 15ms | 20 | HARDWARE/SOFTWARE | 256B | 2.5mm | 6.05mm | No | No SVHC | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 93LC66CT-ISNG | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 3 MHz | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | 93LC66CT-I/SNG | 1 | 256 words | 256 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Not Recommended | SOIC | 40 | 5.15 | Compliant | Yes | 2.5 V | Tape & Reel (TR) | e3 | Yes | EAR99 | Matte Tin (Sn) | 85 °C | -40 °C | ALSO CONFIGURABLE AS 512 X 8 | 8542.32.00.51 | EEPROMs | CMOS | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 3/5 V | INDUSTRIAL | 1.8 V | 5.5 V | 2.5 V | 512 B | SYNCHRONOUS | 0.002 mA | 256X16 | 1.75 mm | 16 | 0.000001 A | 4096 bit | 2 MHz | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 6 ms | 200 | SOFTWARE | 8 | 4.9 mm | 3.9 mm | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No S29GL256S10TFI010 | Cypress Semiconductor Corp | Datasheet | 728 |
| Min: 1 Mult: 1 | 13 Weeks | Tin | Surface Mount | Surface Mount | 56-TFSOP (0.724, 18.40mm Width) | 56 | 56-TSOP | Non-Volatile | -40°C~85°C TA | Tube | 2011 | GL-S | Active | 3 (168 Hours) | 85°C | -40°C | 2.7V~3.6V | 3.3V | Parallel | 3.6V | 2.7V | 256Mb 16M x 16 | 60mA | 100ns | FLASH | Parallel | 16b | 60ns | 24b | 256 Mb | Asynchronous | 16b | 32B | No | No SVHC | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 25LC128-I/MF | Microchip Technology | Datasheet | 286 | - | Min: 1 Mult: 1 | 6 Weeks | Surface Mount | Surface Mount | 8-VDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2007 | e3 | yes | Active | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 25LC128 | 8 | 5V | SPI, Serial | 128Kb 16K x 8 | 5mA | 10MHz | 50 ns | EEPROM | SPI | 5ms | 128 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 840μm | 5mm | 6mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No W971GG6SB25I | Winbond Electronics | Datasheet | 985 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 84-TFBGA | YES | 84 | Volatile | -40°C~95°C TC | Tray | 2011 | Active | 3 (168 Hours) | 84 | AUTO/SELF REFRESH | 1.7V~1.9V | BOTTOM | NOT SPECIFIED | 1 | 1.8V | 0.8mm | NOT SPECIFIED | 1.8V | 1.9V | 1.7V | 1Gb 64M x 16 | 1 | SYNCHRONOUS | 200MHz | 400ps | DRAM | Parallel | 64MX16 | 16 | 15ns | 13b | 1 Gb | 1.2mm | 12.5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 93C46BT-I/MC | Microchip Technology | Datasheet | 960 | - | Min: 1 Mult: 1 | 6 Weeks | Tin | Surface Mount | Surface Mount | 8-VFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | yes | Active | 1 (Unlimited) | 8 | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.5mm | 40 | 93C46B | 8 | 5V | 5V | Serial | 1Kb 64 x 16 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 64X16 | 16 | 2ms | 1 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 2ms | 200 | SOFTWARE | 1mm | 3mm | 2mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No FM25640B-GATR | Cypress Semiconductor Corp | Datasheet | 2000 |
| Min: 1 Mult: 1 | 6 Weeks | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2013 | Automotive, AEC-Q100, F-RAM™ | e4 | yes | Obsolete | 3 (168 Hours) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 30 | FM25640 | 8 | Not Qualified | 5V | SPI, Serial | 64Kb 8K x 8 | 1.2mA | SYNCHRONOUS | 4MHz | 75 ns | FRAM | SPI | 8b | 8 | 64 kb | 8b | 1.75mm | 4.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY62157EV30LL-45ZSXAT | Cypress Semiconductor Corp | Datasheet | 444 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2007 | MoBL® | e4 | yes | Active | 3 (168 Hours) | 44 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.2V~3.6V | DUAL | 260 | 1 | 3V | 0.8mm | 30 | CY62157 | 3V | 3.6V | 2.2V | 8Mb 512K x 16 | 1 | 25mA | SRAM | Parallel | 3-STATE | 16 | 45ns | 19b | 8 Mb | 0.000005A | 45 ns | COMMON | Asynchronous | 16b | No | ROHS3 Compliant | Contains Lead |
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M95040-RMC6TG
STMicroelectronics
Package:Memory
0.108900
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W25Q256FVEIG
Winbond Electronics
Package:Memory
2.242658
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11LC040-I/P
Microchip Technology
Package:Memory
Price: please inquire
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BR24G64FJ-3AGTE2
ROHM Semiconductor
Package:Memory
Price: please inquire
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24LCS52T-I/MC
Microchip Technology
Package:Memory
Price: please inquire
-
BR24T01FJ-WE2
ROHM Semiconductor
Package:Memory
Price: please inquire
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W25Q64FWZPIG
Winbond Electronics
Package:Memory
Price: please inquire
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IS62WV12816EBLL-45TLI
ISSI, Integrated Silicon Solution Inc
Package:Memory
4.097665
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S25FL064P0XMFB003
Cypress Semiconductor Corp
Package:Memory
0.350669
-
93AA46CXT-I/SN
Microchip Technology
Package:Memory
0.354877
-
IS61WV25616BLL-10TL
ISSI, Integrated Silicon Solution Inc
Package:Memory
3.338174
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FM18W08-SG
Cypress Semiconductor Corp
Package:Memory
11.754406
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M25P80-VMW6G
Micron Technology Inc.
Package:Memory
Price: please inquire
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93LC66CT-ISNG
Microchip
Package:Memory
Price: please inquire
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S29GL256S10TFI010
Cypress Semiconductor Corp
Package:Memory
20.701454
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25LC128-I/MF
Microchip Technology
Package:Memory
Price: please inquire
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W971GG6SB25I
Winbond Electronics
Package:Memory
Price: please inquire
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93C46BT-I/MC
Microchip Technology
Package:Memory
Price: please inquire
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FM25640B-GATR
Cypress Semiconductor Corp
Package:Memory
1.830828
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CY62157EV30LL-45ZSXAT
Cypress Semiconductor Corp
Package:Memory
1.099238