The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Number of Terminals | Clock Frequency-Max | Core | Factory Pack Quantity | Family Name | I/O Voltage-Max | Ihs Manufacturer | Interface Type | L1 Cache Data Memory | L1 Cache Instruction Memory | Maximum Clock Frequency | Memory Types | Moisture Sensitivity Levels | Mounting Method | Mounting Styles | No of I/O Lines | No of Terminals | Operating Temp Range | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Watchdog Timers | Packaging | JESD-609 Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Temperature Grade | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Program Memory Type | Supply Current-Max | Bit Size | Data Bus Width | Seated Height-Max | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Number of External Interrupts | Total Dose | Length | Width |
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![]() | Mfr Part No S3C2410A-26 | Samsung Semiconductor | Datasheet | 823 | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No RH80536GC0252MSL7EG | Intel Corporation | Datasheet | 5 | - | Min: 1 Mult: 1 | NO | 478 | INTEL CORP | CERAMIC | SPGA | PGA478,26X26,50 | SQUARE | GRID ARRAY, SHRINK PITCH | Obsolete | Yes | 1.3 V | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 1.27 mm | unknown | S-XPGA-P478 | Not Qualified | 1600 MHz | MICROPROCESSOR, RISC | 21000 mA | 64 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TMP1941AF | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 40 MHz | TOSHIBA CORP | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, QFP100,.63SQ,20 | QFP100,.63SQ,20 | SQUARE | FLATPACK | Obsolete | QFP | No | 3.6 V | 2.7 V | 3 V | 3A991.A.2 | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 0.5 mm | unknown | NOT SPECIFIED | 100 | S-PQFP-G100 | Not Qualified | INDUSTRIAL | 20 MHz | MICROPROCESSOR, RISC | 85 mA | 32 | 24 | NO | YES | 16 | FIXED POINT | NO | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TSC695F-25MA-E | Microchip Technology Inc | Datasheet | 400 | - | Min: 1 Mult: 1 | YES | 256 | 50 MHz | MICROCHIP TECHNOLOGY INC | 125 °C | -55 °C | UNSPECIFIED | QFF | MQFP-256 | QFL256,1.5SQ,20 | SQUARE | FLATPACK | Not Recommended | No | 5.5 V | 4.5 V | 5 V | e0 | 3A991.A.2 | TIN LEAD | 8542.31.00.01 | QUAD | FLAT | 0.508 mm | unknown | S-XQFP-F256 | Not Qualified | MILITARY | 25 MHz | MICROPROCESSOR, RISC | 230 mA | 32 | 3.18 mm | 32 | YES | YES | 32 | FLOATING POINT | NO | 300k Rad(Si) V | 37.085 mm | 37.085 mm | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No R2020-C-QF | RDC Semiconductor Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 160 | RDC SEMICONDUCTOR CO LTD | PLASTIC/EPOXY | QFP | QFP, QFP160,1.2SQ | QFP160,1.2SQ | SQUARE | FLATPACK | Contact Manufacturer | 8542.31.00.01 | QUAD | GULL WING | 0.635 mm | unknown | S-PQFP-G160 | Not Qualified | 100 MHz | MICROPROCESSOR, RISC | 16 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PPC405EXR-NPD400T | Applied Micro Circuits Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 388 | 666.66 MHz | APPLIED MICRO CIRCUITS CORP | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | BGA | 1.3 V | 1.2 V | 1.25 V | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1 mm | unknown | 388 | S-PBGA-B388 | Not Qualified | INDUSTRIAL | 400 MHz | MICROPROCESSOR, RISC | 32 | 2.65 mm | YES | YES | FIXED POINT | YES | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TMPZ84C00AP | Toshiba America Electronic Components | Datasheet | 280 | - | Min: 1 Mult: 1 | NO | 40 | TOSHIBA CORP | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T40 | Not Qualified | INDUSTRIAL | 4 MHz | MICROPROCESSOR, RISC | 8 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PIC64GX1000-C/FCS | Microchip Technology | Datasheet | 72 |
| Min: 1 Mult: 1 | FCSG-325 | RISC-V | 1 | CAN, I2C, SPI, UART | 32 kB | 32 kB | 400 kHz | DDR4 | SMD/SMT | RoHS Compliant | Watchdog Timer | Tray | 970 mV to 1.08 V | 16 bit | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TSPC603RMGU8LC | Teledyne e2v | Datasheet | 3 | - | Min: 1 Mult: 1 | YES | 255 | 200 MHz | TELEDYNE E2V (UK) LTD | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | BGA | 2.625 V | 2.375 V | 2.5 V | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 255 | S-CBGA-B255 | Not Qualified | MILITARY | 200 MHz | MICROPROCESSOR, RISC | 32 | 3 mm | 32 | YES | YES | 64 | FLOATING POINT | YES | 21 mm | 21 mm | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TSPC603RMGU8LC | Atmel Corporation | Datasheet | 640 | - | Min: 1 Mult: 1 | YES | 255 | 66.7 MHz | ATMEL CORP | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, BGA255,16X16,50 | BGA255,16X16,50 | SQUARE | GRID ARRAY | Transferred | BGA | No | 2.625 V | 2.375 V | 2.5 V | e0 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 255 | S-CBGA-B255 | Not Qualified | MILITARY | 200 MHz | MICROPROCESSOR, RISC | 32 | 3 mm | 32 | YES | YES | 64 | FLOATING POINT | YES | 21 mm | 21 mm | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No CM8071504650608S RL5Y | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC9328MX21CVG | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 289 | 32 MHz | FREESCALE SEMICONDUCTOR INC | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | LFBGA | 14 X 14 MM, 1.41 MM HEIGHT, 0.65 MM PITCH, MAPBGA-289 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Obsolete | BGA | No | 1.65 V | 1.45 V | e0 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 0.65 mm | not_compliant | 30 | 289 | S-PBGA-B289 | Not Qualified | INDUSTRIAL | 266 MHz | MICROPROCESSOR | 1.49 mm | 26 | YES | YES | 32 | FIXED POINT | YES | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No PPC405GP-3DE133C | Applied Micro Circuits Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 456 | 66.66 MHz | APPLIED MICRO CIRCUITS CORP | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA456,26X26,40 | BGA456,26X26,40 | SQUARE | GRID ARRAY | Obsolete | BGA | No | 2.7 V | 2.3 V | 2.5 V | e0 | 3A991.A.2 | TIN LEAD | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | 456 | S-PBGA-B456 | Not Qualified | INDUSTRIAL | 133 MHz | MICROPROCESSOR, RISC | 32 | 2.65 mm | 32 | YES | YES | 32 | FIXED POINT | YES | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No IDT79RV4600-100MS | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | 50 MHz | INTEGRATED DEVICE TECHNOLOGY INC | 85 °C | PLASTIC/EPOXY | FQFP | CAVITY DOWN, MQUAD-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | No | 3.465 V | 3.135 V | 3.3 V | e0 | 3A991.A.2 | TIN LEAD | 8542.31.00.01 | QUAD | GULL WING | 0.5 mm | not_compliant | 208 | S-PQFP-G208 | Not Qualified | OTHER | 100 MHz | MICROPROCESSOR, RISC | 1275 mA | 64 | 3.86 mm | 64 | NO | YES | 64 | FLOATING POINT | NO | 0 | 7 | 27.69 mm | 27.69 mm | |||||||||||||||||||||||||||||||
![]() | Mfr Part No CN8063801307903 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IMST805-F20S | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | STMICROELECTRONICS | 70 °C | CERAMIC | QFP | QFP100(UNSPEC) | FLATPACK | Obsolete | No | 5 V | e0 | TIN LEAD | 8542.31.00.01 | QUAD | GULL WING | not_compliant | Not Qualified | COMMERCIAL | 20 MHz | MICROPROCESSOR, RISC | 230 mA | 32 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No R9A09G057H41GBG#BC0 | Renesas | Datasheet | 9 |
| Min: 1 Mult: 1 | 1800MHz | RZ/V2H | 3.3V | 3 | Surface Mount | 86 | 1368 | -40°C to +85°C | 3V to 3.6V | 6MB | Cortex-A55 x 4 | RAM | 32b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No R9A09G057H44GBG#BC0 | Renesas | Datasheet | 16 |
| Min: 1 Mult: 1 | 1800MHz | RZ/V2H | 3.3V | 3 | Surface Mount | 86 | 1368 | -40°C to +85°C | 3V to 3.6V | 64B | Cortex-A55 x 4 | RAM | 32b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No R9A09G057H48GBG#BC0 | Renesas | Datasheet | 9 |
| Min: 1 Mult: 1 | 1800MHz | RZ/V2H | 3.3V | 3 | Surface Mount | 86 | 1368 | -40°C to +85°C | 3V to 3.6V | 6MB | Cortex-A55 x 4 | RAM | 32b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No R9A08G045S15GBG#BC0 | Renesas | Datasheet | - | - | Min: 1 Mult: 1 | 100MHz | RZ/G3S | 3.3V | 3 | Surface Mount | 82 | -40°C to +85°C | 3V to 3.6V | 1024kB | ARM® Cortex®-A55 | RAM |
S3C2410A-26
Samsung Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
RH80536GC0252MSL7EG
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
TMP1941AF
Toshiba America Electronic Components
Package:Embedded - Microprocessors
Price: please inquire
TSC695F-25MA-E
Microchip Technology Inc
Package:Embedded - Microprocessors
Price: please inquire
R2020-C-QF
RDC Semiconductor Co Ltd
Package:Embedded - Microprocessors
Price: please inquire
PPC405EXR-NPD400T
Applied Micro Circuits Corporation
Package:Embedded - Microprocessors
Price: please inquire
TMPZ84C00AP
Toshiba America Electronic Components
Package:Embedded - Microprocessors
Price: please inquire
PIC64GX1000-C/FCS
Microchip Technology
Package:Embedded - Microprocessors
28.613965
TSPC603RMGU8LC
Teledyne e2v
Package:Embedded - Microprocessors
Price: please inquire
TSPC603RMGU8LC
Atmel Corporation
Package:Embedded - Microprocessors
Price: please inquire
CM8071504650608S RL5Y
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
MC9328MX21CVG
Freescale Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
PPC405GP-3DE133C
Applied Micro Circuits Corporation
Package:Embedded - Microprocessors
Price: please inquire
IDT79RV4600-100MS
Integrated Device Technology Inc
Package:Embedded - Microprocessors
Price: please inquire
CN8063801307903
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
IMST805-F20S
STMicroelectronics
Package:Embedded - Microprocessors
Price: please inquire
R9A09G057H41GBG#BC0
Renesas
Package:Embedded - Microprocessors
93.579080
R9A09G057H44GBG#BC0
Renesas
Package:Embedded - Microprocessors
113.087368
R9A09G057H48GBG#BC0
Renesas
Package:Embedded - Microprocessors
115.307031
R9A08G045S15GBG#BC0
Renesas
Package:Embedded - Microprocessors
Price: please inquire
