Interface - Telecom (6000)

2280
In Stock

-

Min: 1

Mult: 1

YES

20

KGM

1210

3225

0.01 g

NXP SEMICONDUCTORS

MLCC

SMD

85 °C

-40 °C

PLASTIC/EPOXY

LSSOP

4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Obsolete

SSOP

Yes

3 V

ceramic

-55...125°C

±5%

8542.39.00.01

4.7nF

DUAL

GULL WING

260

1

0.65 mm

compliant

40

20

R-PDSO-G20

Not Qualified

C0G (NP0)

INDUSTRIAL

1.5 mm

TELECOM CIRCUIT

50V

6.5 mm

4.4 mm

-

-

Min: 1

Mult: 1

YES

289

MICREL INC

70 °C

PLASTIC/EPOXY

BGA

19 X 19 MM, LEAD FREE, PLASTIC, MO-151, BGA-289

SQUARE

GRID ARRAY

Transferred

Yes

1.8 V

e1

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

BALL

250

1

1 mm

compliant

40

S-PBGA-B289

Not Qualified

COMMERCIAL

2.26 mm

TELECOM CIRCUIT

3

19 mm

19 mm

800
In Stock

-

Min: 1

Mult: 1

YES

28

AVAGO TECHNOLOGIES INC

UNSPECIFIED

HVBCC

HVBCC,

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Obsolete

5 V

8542.39.00.01

BOTTOM

BUTT

1

0.5 mm

unknown

S-XBCC-B28

0.91 mm

TELECOM CIRCUIT

5 mm

5 mm

-

-

Min: 1

Mult: 1

YES

Galvanized steel

42

0.42

INFINEON TECHNOLOGIES AG

d1 = 4.20 mm

t = 0.98 mm

1.0 mm

4.22 +0.08 mm

85 °C

-30 °C

PLASTIC/EPOXY

VFBGA

WLBGA-42

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Active

1.22 V

M3

0.5

28.5*21*19/2000

BOTTOM

BALL

1

0.4 mm

compliant

R-PBGA-B42

OTHER

0.6 mm

TELECOM CIRCUIT

d = 6.35 ±0.25 mm

L = 1.5 ±0.25 mm

3.019 mm

2.509 mm

1
In Stock

• 1: $3.743030
• 10: $3.531160
• 100: $3.331283
• 500: $3.142720
View all price

Min: 1

Mult: 1

YES

housing - stainless steel; gasket - silicone rubber

38

at least 1 L/min at 70 mbar pressure

electric, lighting, photoelectric, security, automotive and other equipment

KGM

0805

2012

2.80

ESPRESSIF SYSTEMS (SHANGHAI) PTE LTD

MLCC

SMD

Ф5.2 mm

85 °C

-40 °C

UNSPECIFIED

DMA

PACKAGE-38

RECTANGULAR

MICROELECTRONIC ASSEMBLY

Contact Manufacturer

IP67

for pressure equalization in sealed enclosures and protection against condensation formation

Yes

3.3 V

35*30*21/150

ceramic

-55...125°C

±1%

5A992.C

M5X0.8 pressure equalization valve, metal

to hydrostatic pressure - at least 100 mbar for 30 min

8542.39.00.01

2.2nF

DUAL

NO LEAD

250

1

1.27 mm

compliant

R-XDMA-N38

C0G (NP0)

INDUSTRIAL

150000 Mbps

3.45 mm

-40…+125 °C

TELECOM CIRCUIT

3

50V

31.4 mm

18 mm

-

-

Min: 1

Mult: 1

YES

28

MICROSEMI CORP

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

PLASTIC, MS-018AB, LCC-28

SQUARE

CHIP CARRIER

Obsolete

LCC

No

5 V

e0

No

TIN LEAD

8542.39.00.01

QUAD

J BEND

1

1.27 mm

unknown

28

S-PQCC-J28

Not Qualified

INDUSTRIAL

4.57 mm

TELECOM CIRCUIT

11.505 mm

11.505 mm

-

-

Min: 1

Mult: 1

YES

24

MX COM INC

PLASTIC/EPOXY

,

RECTANGULAR

SMALL OUTLINE

Obsolete

SOIC

8542.39.00.01

DUAL

GULL WING

unknown

24

R-PDSO-G24

Not Qualified

MODEM

4000
In Stock

-

Min: 1

Mult: 1

YES

24

14.28

CML MICROCIRCUITS LTD

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP, SOP24,.4

SOP24,.4

RECTANGULAR

SMALL OUTLINE

Obsolete

SOIC

Yes

3 V

62*27.5*28/500

e3

Yes

Matte Tin (Sn)

8542.39.00.01

DUAL

GULL WING

260

1

1.27 mm

compliant

40

24

R-PDSO-G24

Not Qualified

INDUSTRIAL

0.011 mA

1 Mbps

2.67 mm

MODEM

15.365 mm

7.425 mm

32
In Stock

-

Min: 1

Mult: 1

YES

Plastic / metal

32

5.50

MICREL INC

70 °C

UNSPECIFIED

HVQCCN

QFN-32

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Transferred

Yes

3.3 V

46.5*28.8*27.6/500

e4

NICKEL PALLADIUM GOLD

Orange

QUAD

NO LEAD

260

1

0.5 mm

compliant

40

S-XQCC-N32

Not Qualified

COMMERCIAL

100000 Mbps

1 mm

ETHERNET TRANSCEIVER

1

2

19.7 mm

5 mm

5 mm

11163
In Stock

-

Min: 1

Mult: 1

YES

16

±0.1pF

KGM

0201

0603

0.01 g

RF MICRO DEVICES INC

MLCC

SMD

105 °C

-40 °C

UNSPECIFIED

HVQCCN

HVQCCN,

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Transferred

5 V

ceramic

-55...125°C

8542.39.00.01

4.7pF

QUAD

NO LEAD

1

0.5 mm

unknown

S-XQCC-N16

C0G (NP0)

INDUSTRIAL

0.9 mm

TELECOM CIRCUIT

25V

3 mm

3 mm

82032
In Stock

-

Min: 1

Mult: 1

YES

8

MICROCHIP TECHNOLOGY INC

125 °C

-40 °C

PLASTIC/EPOXY

HVSON

HVSON,

SOLCC8,.12,25

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Active

5 V

e3

EAR99

MATTE TIN

8542.32.00.51

DUAL

NO LEAD

1

0.65 mm

compliant

S-PDSO-N8

AUTOMOTIVE

140 mA

8000 Mbps

1 mm

AEC-Q100

CAN FD TRANSCEIVER

1

3 mm

3 mm

160
In Stock

-

Min: 1

Mult: 1

NXP SEMICONDUCTORS

Active

8542.39.00.01

unknown

INTERFACE CIRCUIT

-

-

Min: 1

Mult: 1

YES

10

TRIQUINT SEMICONDUCTOR INC

PLASTIC/EPOXY

DFP

DFP,

RECTANGULAR

FLATPACK

Transferred

Yes

Yes

DUAL

FLAT

NOT SPECIFIED

1

compliant

NOT SPECIFIED

R-PDFP-F10

4.2418 mm

RF AND BASEBAND CIRCUIT

24.003 mm

15.78 mm

13455
In Stock

-

Min: 1

Mult: 1

YES

56

2020-07-27

SKYWORKS SOLUTIONS INC

110 °C

-40 °C

PLASTIC/EPOXY

HVQCCN

LCC56,.23X.3,17

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Active

3.4 V

8542.39.00.01

QUAD

NO LEAD

1

0.44 mm

unknown

R-PQCC-N56

3200 mA

0.7 mm

RF AND BASEBAND CIRCUIT

7.6 mm

6 mm

4360
In Stock

-

Min: 1

Mult: 1

YES

8

NXP SEMICONDUCTORS

150 °C

-40 °C

PLASTIC/EPOXY

HVSON

HVSON, SOLCC8,.12,25

SOLCC8,.12,25

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Active

SON

Yes

5 V

e4

Yes

NICKEL PALLADIUM GOLD SILVER

8542.39.00.01

DUAL

NO LEAD

260

1

0.65 mm

compliant

30

8

S-PDSO-N8

Not Qualified

AUTOMOTIVE

70 mA

5000000 Mbps

1 mm

AEC-Q100

CAN FD TRANSCEIVER

1

1

3 mm

3 mm

7268
In Stock

-

Min: 1

Mult: 1

YES

14

NXP SEMICONDUCTORS

PLASTIC/EPOXY

HVSON

VSON-14

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Not Recommended

SON

Yes

5 V

8542.39.00.01

DUAL

NO LEAD

260

1

0.65 mm

compliant

30

14

R-PDSO-N14

Not Qualified

1 mm

INTERFACE CIRCUIT

1

4.5 mm

3 mm

800
In Stock

-

Min: 1

Mult: 1

YES

8

NXP SEMICONDUCTORS

PLASTIC/EPOXY

HVSON

HVSON,

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Active

SON

3.3 V

8542.39.00.01

DUAL

NO LEAD

1

0.65 mm

unknown

8

S-PDSO-N8

1 mm

MIL-STD-1553 DATA BUS TRANSCEIVER

3 mm

3 mm

12000
In Stock

-

Min: 1

Mult: 1

YES

8

NXP SEMICONDUCTORS

PLASTIC/EPOXY

HVSON

HVSON,

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Active

SON

5 V

8542.39.00.01

DUAL

NO LEAD

260

1

0.65 mm

unknown

30

8

S-PDSO-N8

1 mm

MIL-STD-1553 DATA BUS TRANSCEIVER

1

3 mm

3 mm

800
In Stock

-

Min: 1

Mult: 1

YES

aluminium

16

black

700 g

grilled

NXP SEMICONDUCTORS

anodized

for back plate

125 °C

-40 °C

PLASTIC/EPOXY

SOP

7.50 MM, PLASTIC, SOT162-1, MS-013, SOP-16

SOP16,.4

RECTANGULAR

SMALL OUTLINE

Transferred

1.8mm

5 V

extruded

8542.39.00.01

DUAL

GULL WING

1

1.27 mm

compliant

R-PDSO-G16

Not Qualified

AUTOMOTIVE

0.07 mA

1000 Mbps

2.65 mm

AEC-Q100

INTERFACE CIRCUIT

1

universal

14mm

10.3 mm

7.5 mm

345
In Stock

-

Min: 1

Mult: 1

NO

20

NATIONAL SEMICONDUCTOR CORP

70 °C

PLASTIC/EPOXY

DIP

PLASTIC, DIP-20

DIP20,.3

RECTANGULAR

IN-LINE

Transferred

No

5 V

e0

EAR99

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

260

1

2.54 mm

not_compliant

40

R-PDIP-T20

Not Qualified

COMMERCIAL

SYNCHRONOUS/ASYNCHRONOUS

10 mA

5.08 mm

PCM CODEC

YES

A-LAW

1

-5 V

0.15 dB

NOT AVAILABLE

26.075 mm

7.62 mm