The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
- Package / Case
- Mounting Type
- Packaging
- Factory Lead Time
- Number of Circuits
- Function
- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Data Rate | Seated Height-Max | Screening Level | Telecom IC Type | Number of Transceivers | Output Low Current-Max | Standard | ISDN Access Rate | Reference Point | Output High Voltage-Min | Output Low Voltage-Max | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No FX-500-LAF-GNJ-A3-B3 | Vectron International | Datasheet | - | - | Min: 1 Mult: 1 | YES | 6 | VECTRON INTERNATIONAL | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | SOJ | PACKAGE-6 | RECTANGULAR | SMALL OUTLINE | Transferred | Yes | 3.3 V | e4 | Yes | NICKEL GOLD | 8542.39.00.01 | DUAL | J BEND | 260 | 1 | 2.54 mm | compliant | 30 | R-PDSO-J6 | INDUSTRIAL | 4.69 mm | ATM/SONET/SDH SUPPORT CIRCUIT | 13.97 mm | 8.89 mm | |||||||||||||||||
![]() | Mfr Part No RFFM6401 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | RF MICRO DEVICES INC | 3 | 85 °C | -40 °C | UNSPECIFIED | HLGA | HLGA, | RECTANGULAR | GRID ARRAY, HEAT SINK/SLUG | Transferred | Yes | 3.6 V | 8542.39.00.01 | BOTTOM | BUTT | 1 | unknown | R-XBGA-B28 | INDUSTRIAL | 1.25 mm | TELECOM CIRCUIT | 5.5 mm | 5 mm | |||||||||||||||||||||||
![]() | Mfr Part No STM32WB55RG | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | STMICROELECTRONICS | Active | 5A992.C | 8542.39.00.01 | compliant | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 204735-5010 | Molex | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC145425DW | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NXP SEMICONDUCTORS | , | Obsolete | unknown | ISDN CONTROLLER | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No P0641CA2 | Teccor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 3 | TECCOR ELECTRONICS INC | 85 °C | -40 °C | PLASTIC/EPOXY | SOC | SOC, | RECTANGULAR | SMALL OUTLINE | Transferred | DO-214AA | 8542.39.00.01 | DUAL | C BEND | 1 | 1.4 mm | unknown | 2 | R-PDSO-C3 | Not Qualified | INDUSTRIAL | 2.18 mm | SURGE PROTECTION CIRCUIT | 4.395 mm | 3.75 mm | ||||||||||||||||||||||
![]() | Mfr Part No RFDA2125SQ | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | RF MICRO DEVICES INC | 85 °C | -40 °C | UNSPECIFIED | HBCC | HBCC, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Transferred | 5 V | 5B991 | 9030.82.00.00 | BOTTOM | BUTT | 1 | 0.5 mm | unknown | S-XBCC-B32 | INDUSTRIAL | 1.25 mm | RF AND BASEBAND CIRCUIT | 5.2 mm | 5.2 mm | |||||||||||||||||||||||
![]() | Mfr Part No SC11066CV/ABE | Sierra Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PMB2200SV2.1 | Siemens | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No UPD98412N7-H6 | NEC Electronics Group | Datasheet | - | - | Min: 1 Mult: 1 | YES | 576 | NEC ELECTRONICS CORP | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | BGA | No | 3.3 V | e0 | TIN LEAD | 8542.39.00.01 | BOTTOM | BALL | 1 | 1.27 mm | compliant | 576 | S-PBGA-B576 | Not Qualified | INDUSTRIAL | 1.7 mm | ATM/SONET/SDH SWITCHING CIRCUIT | 40 mm | 40 mm | ||||||||||||||||||
![]() | Mfr Part No UPD98412N7-H6 | Renesas Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 576 | RENESAS ELECTRONICS CORP | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA576,30X30,50 | BGA576,30X30,50 | SQUARE | GRID ARRAY | Obsolete | No | 3.3 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 1.27 mm | unknown | S-PBGA-B576 | Not Qualified | INDUSTRIAL | 1300 mA | |||||||||||||||||||||||
![]() | Mfr Part No ATA5702F1000M-WDQW-V04 | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No RF6519 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | RF MICRO DEVICES INC | UNSPECIFIED | QCCN | QCCN, LCC28,.2X.24,25 | LCC28,.2X.24,25 | SQUARE | CHIP CARRIER | Transferred | Yes | 4.2 V | 5A991.G | 8517.70.00.00 | QUAD | NO LEAD | 1 | 0.635 mm | unknown | S-XQCC-N20 | Not Qualified | TELECOM CIRCUIT | ||||||||||||||||||||||||||
![]() | Mfr Part No PEB4266 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | INTEL CORP | 70 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Contact Manufacturer | No | 3.3 V | e0 | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | compliant | R-PDSO-G20 | Not Qualified | COMMERCIAL | 3.7 mm | SLIC | 15.9 mm | 11 mm | |||||||||||||||||||||
![]() | Mfr Part No SK70742QE | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | INTEL CORP | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, QFP64,.66SQ,32 | QFP64,.66SQ,32 | SQUARE | FLATPACK | Obsolete | QFP | No | 3.3 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.8 mm | compliant | 64 | S-PQFP-G64 | Not Qualified | INDUSTRIAL | 65 mA | 3 mm | FRAMER | 14 mm | 14 mm | ||||||||||||||||
![]() | Mfr Part No TCM1512AP | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | TEXAS INSTRUMENTS INC | 70 °C | -20 °C | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | not_compliant | R-PDIP-T8 | Not Qualified | COMMERCIAL | |||||||||||||||||||||||||||
![]() | Mfr Part No PEB2085P | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | INFINEON TECHNOLOGIES AG | 70 °C | PLASTIC/EPOXY | DIP | PLASTIC, DIP-40 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | TIN LEAD | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 40 | R-PDIP-T40 | Not Qualified | COMMERCIAL | 144 Mbps | 5.1 mm | ISDN CONTROLLER | 0.007 A | CCITT I.430 | BASIC | S/T | 2.4 V | 0.45 V | 50.9 mm | 15.24 mm | |||||||||||
![]() | Mfr Part No RF5611 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 12 | RF MICRO DEVICES INC | 75 °C | -10 °C | PLASTIC/EPOXY | VQCCN | VQCCN, | SQUARE | CHIP CARRIER, VERY THIN PROFILE | Transferred | QFN | Yes | 3.3 V | 5A991.G | 8517.70.00.00 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | 12 | S-PQCC-N12 | Not Qualified | COMMERCIAL EXTENDED | 0.5 mm | RF AND BASEBAND CIRCUIT | 2 mm | 2 mm | |||||||||||||||||||
![]() | Mfr Part No TPS657202YFFR | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 25 | 2016-05-20 | TEXAS INSTRUMENTS INC | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Preview | Yes | 3.6 V | e1 | Yes | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 | 0.4 mm | compliant | 30 | S-PBGA-B25 | INDUSTRIAL | 0.625 mm | TELECOM CIRCUIT | 2.086 mm | 2.086 mm | |||||||||||||||
![]() | Mfr Part No MCP2551T-I/SNG | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | MICROCHIP TECHNOLOGY INC | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOIC-8 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Not Recommended | SOIC | Yes | 5 V | e3 | Yes | MATTE TIN | 8542.39.00.01 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | INDUSTRIAL | 75 mA | 1000 Mbps | 1.75 mm | TS 16949 | CAN TRANSCEIVER | 1 | 4.9 mm | 3.9 mm |
FX-500-LAF-GNJ-A3-B3
Vectron International
Package:Interface - Telecom
Price: please inquire
RFFM6401
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
STM32WB55RG
STMicroelectronics
Package:Interface - Telecom
Price: please inquire
204735-5010
Molex
Package:Interface - Telecom
Price: please inquire
MC145425DW
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
P0641CA2
Teccor
Package:Interface - Telecom
Price: please inquire
RFDA2125SQ
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
SC11066CV/ABE
Sierra Semiconductor
Package:Interface - Telecom
Price: please inquire
PMB2200SV2.1
Siemens
Package:Interface - Telecom
Price: please inquire
UPD98412N7-H6
NEC Electronics Group
Package:Interface - Telecom
Price: please inquire
UPD98412N7-H6
Renesas Electronics Corporation
Package:Interface - Telecom
Price: please inquire
ATA5702F1000M-WDQW-V04
Microchip Technology Inc
Package:Interface - Telecom
Price: please inquire
RF6519
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
PEB4266
Intel Corporation
Package:Interface - Telecom
Price: please inquire
SK70742QE
Intel Corporation
Package:Interface - Telecom
Price: please inquire
TCM1512AP
Texas Instruments
Package:Interface - Telecom
Price: please inquire
PEB2085P
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
RF5611
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
TPS657202YFFR
Texas Instruments
Package:Interface - Telecom
Price: please inquire
MCP2551T-I/SNG
Microchip Technology Inc
Package:Interface - Telecom
Price: please inquire
