The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
- Package / Case
- Mounting Type
- Packaging
- Factory Lead Time
- Number of Circuits
- Function
- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Operating Mode | Supply Current-Max | Seated Height-Max | Telecom IC Type | Filter | Companding Law | Gain Tolerance-Max | Linear Coding | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No QT2025PBKC | Applied Micro Circuits Corporation | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TTSI2K32T3BAL | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | YES | 217 | BROADCOM INC | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | PLASTIC, BGA-217 | SQUARE | GRID ARRAY | Active | 3.3 V | e0 | TIN LEAD | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 | 1.27 mm | compliant | 30 | S-PBGA-B217 | Not Qualified | INDUSTRIAL | 2.32 mm | TIME SLOT ASSIGNER | 23 mm | 23 mm | |||||||||||||
 | Mfr Part No FX631D5 | CML Microcircuits Plc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | CML MICROCIRCUITS LTD | 85 °C | -40 °C | PLASTIC/EPOXY | SSOP | SSOP-24 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Obsolete | SSOP | Yes | e3 | MATTE TIN | LG-MAX, WD-MAX | 8542.39.00.01 | DUAL | GULL WING | 260 | 1 | compliant | 40 | 24 | R-PDSO-G24 | Not Qualified | INDUSTRIAL | 2.2 mA | TONE DECODER CIRCUIT | |||||||||||||
| Mfr Part No TM156-M | Panduit Corp | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No STLC2416 | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 120 | STMICROELECTRONICS | 85 °C | -40 °C | PLASTIC/EPOXY | LFBGA | 10 X 10 MM, 1.40 MM HEIGHT, LFBGA-120 | BGA120,18X18,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | e0 | TIN LEAD | 8542.39.00.01 | BOTTOM | BALL | 1 | 0.5 mm | compliant | 120 | S-PBGA-B120 | Not Qualified | INDUSTRIAL | 1.4 mm | TELECOM CIRCUIT | 10 mm | 10 mm | |||||||||||
| Mfr Part No K2952C | Silicon Labs Isolation Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | SILICON LABS ISOLATION INC | 70 °C | PLASTIC/EPOXY | SSOP | SSOP, SSOP28,.25 | SSOP28,.25 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Contact Manufacturer | 8542.39.00.01 | DUAL | GULL WING | 0.635 mm | unknown | R-PDSO-G28 | Not Qualified | COMMERCIAL | 5 mA | ||||||||||||||||||||||
 | Mfr Part No TH72002 | Melexis Microelectronic Integrated Systems | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | MELEXIS N V | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | 3 V | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | AUTOMOTIVE | 1.72 mm | TELECOM CIRCUIT | 4.89 mm | 3.9 mm | |||||||||||||||
 | Mfr Part No STAC9744T | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | INTEGRATED DEVICE TECHNOLOGY INC | PLASTIC/EPOXY | , | SQUARE | FLATPACK | Obsolete | QFP | 8542.39.00.01 | QUAD | GULL WING | unknown | 48 | S-PQFP-G48 | Not Qualified | PCM CODEC | |||||||||||||||||||||||||
| Mfr Part No PEB20901C | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No ST5092TQFP | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | STMICROELECTRONICS | 85 °C | -30 °C | PLASTIC/EPOXY | LQFP | 10 X 10 MM, 1.40 MM HEIGHT, TQFP-44 | QFP44,.47SQ,32 | SQUARE | FLATPACK, LOW PROFILE | Obsolete | QFP | No | 3 V | e0 | TIN LEAD | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.8 mm | not_compliant | 44 | S-PQFP-G44 | Not Qualified | OTHER | SYNCHRONOUS | 7 mA | 1.6 mm | LINEAR CODEC | YES | A/MU-LAW | 0.5 dB | 14-BIT | 10 mm | 10 mm | |||||
 | Mfr Part No AD9863 | Analog Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | ANALOG DEVICES INC | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | MO-220-VMMD, LFCSP-64 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | QFN | No | 3.3 V | e0 | TIN LEAD | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | 64 | S-XQCC-N64 | Not Qualified | INDUSTRIAL | 1 mm | TELECOM CIRCUIT | 9 mm | 9 mm | ||||||||||||
| Mfr Part No TOTX170A | Toshiba America Electronic Components | Datasheet | 1 | - | Min: 1 Mult: 1 | NO | 6 | TOSHIBA CORP | 70 °C | -40 °C | UNSPECIFIED | , | RECTANGULAR | FIBER OPTIC | Obsolete | No | 5 V | No | 8542.39.00.01 | UNSPECIFIED | UNSPECIFIED | NOT SPECIFIED | 1 | unknown | NOT SPECIFIED | R-XXFO-X6 | Not Qualified | OTHER | TELECOM CIRCUIT | ||||||||||||||||||
| Mfr Part No PEB8191FDV1.1 | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PEB2050N | Siemens | Datasheet | 1536 | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No RC288DPI/VFC | Rockwell Automation | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No RD221 | Fairchild Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | FAIRCHILD SEMICONDUCTOR CORP | , | Obsolete | unknown | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No MX355P | CML Innovative Technologies | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MX355P | CML Microcircuits Plc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 22 | CML MICROCIRCUITS LTD | 70 °C | -30 °C | PLASTIC/EPOXY | DIP | PLASTIC, DIP-22 | DIP22,.4 | RECTANGULAR | IN-LINE | Obsolete | DIP | 5 V | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 22 | R-PDIP-T22 | Not Qualified | OTHER | 4.95 mm | TELECOM CIRCUIT | 27.685 mm | 10.16 mm | ||||||||||||||
| Mfr Part No RFDA0047 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | RF MICRO DEVICES INC | UNSPECIFIED | QCCN | QCCN, | SQUARE | CHIP CARRIER | Transferred | MCM | Yes | 5 V | Yes | 8542.39.00.01 | QUAD | NO LEAD | NOT SPECIFIED | 1 | compliant | NOT SPECIFIED | 32 | S-XQCC-N32 | RF AND BASEBAND CIRCUIT | |||||||||||||||||||
| Mfr Part No MC3418LD | Motorola Semiconductor Products | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | MOTOROLA INC | 70 °C | CERAMIC | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T16 | COMMERCIAL | 10 mA |
-
QT2025PBKC
Applied Micro Circuits Corporation
Package:Interface - Telecom
Price: please inquire
-
TTSI2K32T3BAL
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
-
FX631D5
CML Microcircuits Plc
Package:Interface - Telecom
Price: please inquire
-
TM156-M
Panduit Corp
Package:Interface - Telecom
Price: please inquire
-
STLC2416
STMicroelectronics
Package:Interface - Telecom
Price: please inquire
-
K2952C
Silicon Labs Isolation Inc
Package:Interface - Telecom
Price: please inquire
-
TH72002
Melexis Microelectronic Integrated Systems
Package:Interface - Telecom
Price: please inquire
-
STAC9744T
Integrated Device Technology Inc
Package:Interface - Telecom
Price: please inquire
-
PEB20901C
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
-
ST5092TQFP
STMicroelectronics
Package:Interface - Telecom
Price: please inquire
-
AD9863
Analog Devices Inc
Package:Interface - Telecom
Price: please inquire
-
TOTX170A
Toshiba America Electronic Components
Package:Interface - Telecom
Price: please inquire
-
PEB8191FDV1.1
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
-
PEB2050N
Siemens
Package:Interface - Telecom
Price: please inquire
-
RC288DPI/VFC
Rockwell Automation
Package:Interface - Telecom
Price: please inquire
-
RD221
Fairchild Semiconductor Corporation
Package:Interface - Telecom
Price: please inquire
-
MX355P
CML Innovative Technologies
Package:Interface - Telecom
Price: please inquire
-
MX355P
CML Microcircuits Plc
Package:Interface - Telecom
Price: please inquire
-
RFDA0047
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
-
MC3418LD
Motorola Semiconductor Products
Package:Interface - Telecom
Price: please inquire