The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
- Package / Case
- Mounting Type
- Packaging
- Factory Lead Time
- Number of Circuits
- Function
- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Data Rate | Seated Height-Max | Telecom IC Type | Neg Supply Voltage-Nom | Battery Feed | PSRR-Min | Hybrid | Battery Supply | Noise-Max | Length | Width |
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 | Mfr Part No TN8020-A3-FCLB | Avago Technologies | Datasheet | - | - | Min: 1 Mult: 1 | AVAGO TECHNOLOGIES INC | , | Active | 8542.39.00.01 | compliant | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No RF5506 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | RF MICRO DEVICES INC | 70 °C | -10 °C | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | 3.3 V | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | S-XQCC-N16 | COMMERCIAL | 0.58 mm | TELECOM CIRCUIT | 3 mm | 3 mm | |||||||||||||||||||||
 | Mfr Part No BCM5482 | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | YES | 121 | BROADCOM CORP | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | BGA | No | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | 121 | S-PBGA-B121 | Not Qualified | ETHERNET TRANSCEIVER | |||||||||||||||||||||||||
| Mfr Part No SY8809EDFC | Silergy Corporation | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No STC9492C1D | Seiko Epson Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | SEIKO EPSON CORP | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | 5 V | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T28 | Not Qualified | 1 Mbps | 4.7 mm | MODEM | 36.7 mm | 15.24 mm | ||||||||||||||||||||||
| Mfr Part No MT8981AD | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | MICROSEMI CORP | 70 °C | CERAMIC | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | Transferred | No | 5 V | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T40 | Not Qualified | COMMERCIAL | |||||||||||||||||||||||||
| Mfr Part No BCM84881B0KFEBG | Broadcom Limited | Datasheet | 6080 | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No STAC9202X3TAEA1XR | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | INTEGRATED DEVICE TECHNOLOGY INC | 3 | Obsolete | Yes | e3 | MATTE TIN | 8542.39.00.01 | 260 | unknown | 30 | PCM CODEC | ||||||||||||||||||||||||||||||||||
| Mfr Part No QT2022 | MACOM | Datasheet | - | - | Min: 1 Mult: 1 | M/A-COM TECHNOLOGY SOLUTIONS INC | , | Obsolete | compliant | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No QT2022 | Applied Micro Circuits Corporation | Datasheet | - | - | Min: 1 Mult: 1 | APPLIED MICRO CIRCUITS CORP | , | Transferred | compliant | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PMB27201 | Siemens | Datasheet | - | - | Min: 1 Mult: 1 | YES | 128 | SIEMENS A G | 85 °C | -30 °C | PLASTIC/EPOXY | , | SQUARE | FLATPACK | Transferred | 5 V | 8542.39.00.01 | QUAD | GULL WING | 1 | unknown | S-PQFP-G128 | Not Qualified | OTHER | TELECOM CIRCUIT | |||||||||||||||||||||||||
| Mfr Part No RC229ATF/1-35 | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | CONEXANT SYSTEMS | 70 °C | PLASTIC/EPOXY | QFP | QFP, QFP100(UNSPEC) | QFP100(UNSPEC) | FLATPACK | Transferred | No | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | compliant | Not Qualified | COMMERCIAL | MODEM | |||||||||||||||||||||||||
| Mfr Part No TDA5664 | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | NO | 14 | INFINEON TECHNOLOGIES AG | 70 °C | PLASTIC/EPOXY | DIP | DIP-14 | DIP14,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T14 | Not Qualified | COMMERCIAL | 29 mA | |||||||||||||||||||||
 | Mfr Part No TA31033F | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | TOSHIBA CORP | 60 °C | -30 °C | PLASTIC/EPOXY | SOP | 0.225 INCH, PLASTIC, SOP-16 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | e0 | TIN LEAD | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | unknown | NOT SPECIFIED | 16 | R-PDSO-G16 | Not Qualified | OTHER | 1.9 mm | TELEPHONE SPEECH CKT | 10 mm | 4.4 mm | |||||||||||||||
 | Mfr Part No TA31028P | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | TOSHIBA CORP | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Active | DIP | No | e0 | No | TIN LEAD | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 8 | R-PDIP-T8 | Not Qualified | INDUSTRIAL | 4.25 mm | TELECOM CIRCUIT | 9.6 mm | 7.62 mm | |||||||||||||||
 | Mfr Part No PBL3764/2J | Ericsson | Datasheet | - | - | Min: 1 Mult: 1 | NO | 22 | ERICSSON POWER MODULES AB | 85 °C | -40 °C | CERAMIC, GLASS-SEALED | DIP | DIP, DIP22,.4 | DIP22,.4 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | TIN LEAD | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 22 | R-GDIP-T22 | Not Qualified | INDUSTRIAL | 5.5 mA | 5.08 mm | SLIC | -5 V | CONSTANT CURRENT | 48 dB | 2-4 CONVERSION | -24 TO -58 V | 8.9 dBrnC | 27.84 mm | 10.16 mm | |||||||
 | Mfr Part No TK14588VTL-G | Asahi Kasei Power Devices Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | ASAHI KASEI POWER DEVICES CORP | 85 °C | -30 °C | PLASTIC/EPOXY | TSSOP | TSSOP, | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Contact Manufacturer | TSSOP | Yes | 3 V | Yes | 8542.39.00.01 | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.65 mm | unknown | NOT SPECIFIED | 16 | R-PDSO-G16 | Not Qualified | OTHER | 1.2 mm | TELECOM CIRCUIT | 5 mm | 4.4 mm | ||||||||||||||
| Mfr Part No SKY53735-21 | Skyworks Solutions Inc | Datasheet | 5200 | - | Min: 1 Mult: 1 | YES | 47 | 2019-10-31 | SKYWORKS SOLUTIONS INC | 3 | 85 °C | -30 °C | HVQCCN | LCC47,.16X.24,16 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Yes | 1.8 V | 8542.39.00.01 | QUAD | NO LEAD | 260 | 1 | 0.4 mm | unknown | R-XQCC-N47 | 0.7 mm | RF AND BASEBAND CIRCUIT | 6.2 mm | 4.2 mm | |||||||||||||||||||
| Mfr Part No SM9103M | Seiko NPC Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 36 | SEIKO NPC CORP | 70 °C | PLASTIC/EPOXY | SSOP | SSOP, SOP36,.4,32 | SOP36,.4,32 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Contact Manufacturer | No | 5 V | 8542.39.00.01 | DUAL | GULL WING | 1 | 0.8 mm | unknown | R-PDSO-G36 | Not Qualified | COMMERCIAL | 30 mA | ||||||||||||||||||||||
 | Mfr Part No TISP61089SDR | JW Miller | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | POWER INNOVATIONS LTD | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Transferred | SOIC | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 8 | R-PDSO-G8 | Not Qualified | INDUSTRIAL | 1.75 mm | SURGE PROTECTION CIRCUIT | 4.9 mm | 3.905 mm |
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TN8020-A3-FCLB
Avago Technologies
Package:Interface - Telecom
Price: please inquire
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RF5506
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
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BCM5482
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
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SY8809EDFC
Silergy Corporation
Package:Interface - Telecom
Price: please inquire
-
STC9492C1D
Seiko Epson Corporation
Package:Interface - Telecom
Price: please inquire
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MT8981AD
Microsemi Corporation
Package:Interface - Telecom
Price: please inquire
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BCM84881B0KFEBG
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
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STAC9202X3TAEA1XR
Integrated Device Technology Inc
Package:Interface - Telecom
Price: please inquire
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QT2022
MACOM
Package:Interface - Telecom
Price: please inquire
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QT2022
Applied Micro Circuits Corporation
Package:Interface - Telecom
Price: please inquire
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PMB27201
Siemens
Package:Interface - Telecom
Price: please inquire
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RC229ATF/1-35
Conexant Systems Inc
Package:Interface - Telecom
Price: please inquire
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TDA5664
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
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TA31033F
Toshiba America Electronic Components
Package:Interface - Telecom
Price: please inquire
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TA31028P
Toshiba America Electronic Components
Package:Interface - Telecom
Price: please inquire
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PBL3764/2J
Ericsson
Package:Interface - Telecom
Price: please inquire
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TK14588VTL-G
Asahi Kasei Power Devices Corporation
Package:Interface - Telecom
Price: please inquire
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SKY53735-21
Skyworks Solutions Inc
Package:Interface - Telecom
Price: please inquire
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SM9103M
Seiko NPC Corporation
Package:Interface - Telecom
Price: please inquire
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TISP61089SDR
JW Miller
Package:Interface - Telecom
Price: please inquire