The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
- Package / Case
- Mounting Type
- Packaging
- Factory Lead Time
- Number of Circuits
- Function
- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Data Rate | Seated Height-Max | Screening Level | Telecom IC Type | Number of Transceivers | Neg Supply Voltage-Nom | Crystal Frequency | Repertory | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No HMC737LP4 | Analog Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | ANALOG DEVICES INC | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | QFN-24 | SQUARE | CHIP CARRIER | Active | No | 4.2 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | compliant | S-PQCC-N24 | Not Qualified | INDUSTRIAL | 1 mm | TELECOM CIRCUIT | 4 mm | 4 mm | ||||||||||||||
| Mfr Part No SI3230M-GT | Silicon Laboratories Inc | Datasheet | - | - | Min: 1 Mult: 1 | SILICON LABORATORIES INC | , | Obsolete | unknown | SLIC | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No TA31076F (TP1) | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CM8870C | California Micro Devices | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | CALIFORNIA MICRO DEVICES CORP | 70 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, DIP18,.3 | DIP18,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | TIN LEAD | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 18 | R-CDIP-T18 | Not Qualified | COMMERCIAL | 7 mA | DTMF SIGNALING CIRCUIT | ||||||||||||||||
| Mfr Part No R6653-20 | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | CONEXANT SYSTEMS | 70 °C | PLASTIC/EPOXY | QFP | QFP, | RECTANGULAR | FLATPACK | Obsolete | QFP | 5 V | HALF DUPLEX; FULL DUPLEX | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.65 mm | unknown | 100 | R-PQFP-G100 | Not Qualified | COMMERCIAL | 2 Mbps | 3.4 mm | MODEM-SUPPORT CIRCUIT | 20 mm | 14 mm | ||||||||||||||||
| Mfr Part No J-F2-B3A3-DY | Telit | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | TELIT COMMUNICATIONS PLC | 85 °C | -40 °C | PLASTIC/EPOXY | LGA | LGA, | SQUARE | GRID ARRAY | Obsolete | Yes | 1.8 V | 8542.39.00.01 | BOTTOM | BUTT | NOT SPECIFIED | 1 | 1 mm | unknown | NOT SPECIFIED | S-PBGA-B32 | INDUSTRIAL | 2.8 mm | TELECOM CIRCUIT | 11 mm | 11 mm | |||||||||||||||||
| Mfr Part No TCM1506AP | Texas Instruments | Datasheet | 14800 | - | Min: 1 Mult: 1 | NO | 8 | TEXAS INSTRUMENTS INC | 70 °C | -20 °C | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | not_compliant | R-PDIP-T8 | Not Qualified | COMMERCIAL | 1.3 mA | ||||||||||||||||||||||
 | Mfr Part No ATA2526S756C-DDW | Atmel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 12 | ATMEL CORP | 85 °C | -25 °C | UNSPECIFIED | DIE | DIE, | RECTANGULAR | UNCASED CHIP | Transferred | WAFER | 3 V | 8542.39.00.01 | UPPER | NO LEAD | 1 | compliant | 12 | R-XUUC-N12 | Not Qualified | OTHER | TELECOM CIRCUIT | |||||||||||||||||||||
| Mfr Part No ATA2526S756C-DDW | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 12 | MICROCHIP TECHNOLOGY INC | 85 °C | -25 °C | UNSPECIFIED | DIE | WAFER-12 | RECTANGULAR | UNCASED CHIP | Active | 3 V | 8542.39.00.01 | UPPER | NO LEAD | 1 | compliant | R-XUUC-N12 | Not Qualified | OTHER | TELECOM CIRCUIT | |||||||||||||||||||||||
| Mfr Part No GF42R600MRM | Thinking Electronic Industrial Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 2 | THINKING ELECTRONIC INDUSTRIAL CO LTD | 85 °C | -40 °C | UNSPECIFIED | , | ROUND | SPECIAL SHAPE | Active | Yes | NOT APPLICABLE | 8542.39.00.01 | DUAL | NO LEAD | NOT SPECIFIED | 1 | unknown | NOT SPECIFIED | O-XDSS-N2 | INDUSTRIAL | GAS DISCHARGE TUBE SUPPRESSOR | ||||||||||||||||||||||
| Mfr Part No 73K222BL-IHR | Teridian Semiconductor Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | TERIDIAN SEMICONDUCTOR CORP | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-32 | RECTANGULAR | CHIP CARRIER | Obsolete | 5 V | FULL DUPLEX | QUAD | J BEND | 1 | 1.27 mm | unknown | R-PQCC-J32 | Not Qualified | INDUSTRIAL | 1 Mbps | 3.56 mm | MODEM | 13.995 mm | 11.455 mm | ||||||||||||||||||
| Mfr Part No EM91410BP | ELAN Microelectronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | NO | 20 | ELAN MICROELECTRONICS CORP | 50 °C | PLASTIC/EPOXY | DIP | DIP, DIP20,.3 | DIP20,.3 | RECTANGULAR | IN-LINE | Contact Manufacturer | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T20 | Not Qualified | COMMERCIAL | 0.0005 mA | TONE GENERATOR | 3.58 MHz | REPERTORY | |||||||||||||||||||||
| Mfr Part No RF6569 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | RF MICRO DEVICES INC | UNSPECIFIED | QCCN | QCCN, | SQUARE | CHIP CARRIER | Transferred | 3.6 V | 5A991.G | 8517.70.00.00 | QUAD | NO LEAD | 1 | unknown | S-XQCC-N20 | TELECOM CIRCUIT | ||||||||||||||||||||||||||
| Mfr Part No TDA8010AM/C1 | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SDG1202N1-XC-YN | SUMITOMO ELECTRIC Industries Ltd | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MCP2021T-330E/SNV04 | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | MICROCHIP TECHNOLOGY INC | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SOIC-8 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Active | 12 V | DUAL | GULL WING | 1 | 1.27 mm | compliant | R-PDSO-G8 | 1.75 mm | TS 16949 | LIN TRANSCEIVER | 1 | 4.9 mm | 3.9 mm | |||||||||||||||||||
| Mfr Part No PMB6270 | Infineon Technologies AG | Datasheet | 7999 | - | Min: 1 Mult: 1 | INFINEON TECHNOLOGIES AG | , | Obsolete | unknown | ||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No TXC-04011-BIPQ | Transwitch Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 120 | TRANSWITCH CORP | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, | SQUARE | FLATPACK | Obsolete | QFP | 5 V | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.8 mm | unknown | 120 | S-PQFP-G120 | Not Qualified | INDUSTRIAL | 175 mA | 4.1 mm | TELECOM CIRCUIT | 28 mm | 28 mm | ||||||||||||||||
 | Mfr Part No OQ2541HPB-S | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | NXP SEMICONDUCTORS | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.5 mm | unknown | 48 | S-PQFP-G48 | Not Qualified | INDUSTRIAL | 1.6 mm | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | -3.3 V | 7 mm | 7 mm | |||||||||||||||||
 | Mfr Part No SE5008L | Skyworks Solutions Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | SKYWORKS SOLUTIONS INC | 1 | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | QFN | Yes | 3.3 V | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | 16 | S-XQCC-N16 | INDUSTRIAL | 0.9 mm | TELECOM CIRCUIT | 3 mm | 3 mm |
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HMC737LP4
Analog Devices Inc
Package:Interface - Telecom
Price: please inquire
-
SI3230M-GT
Silicon Laboratories Inc
Package:Interface - Telecom
Price: please inquire
-
TA31076F (TP1)
Toshiba America Electronic Components
Package:Interface - Telecom
Price: please inquire
-
CM8870C
California Micro Devices
Package:Interface - Telecom
Price: please inquire
-
R6653-20
Conexant Systems Inc
Package:Interface - Telecom
Price: please inquire
-
J-F2-B3A3-DY
Telit
Package:Interface - Telecom
Price: please inquire
-
TCM1506AP
Texas Instruments
Package:Interface - Telecom
Price: please inquire
-
ATA2526S756C-DDW
Atmel Corporation
Package:Interface - Telecom
Price: please inquire
-
ATA2526S756C-DDW
Microchip Technology Inc
Package:Interface - Telecom
Price: please inquire
-
GF42R600MRM
Thinking Electronic Industrial Co Ltd
Package:Interface - Telecom
Price: please inquire
-
73K222BL-IHR
Teridian Semiconductor Corp
Package:Interface - Telecom
Price: please inquire
-
EM91410BP
ELAN Microelectronics Corp
Package:Interface - Telecom
Price: please inquire
-
RF6569
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
-
TDA8010AM/C1
Philips Semiconductors
Package:Interface - Telecom
Price: please inquire
-
SDG1202N1-XC-YN
SUMITOMO ELECTRIC Industries Ltd
Package:Interface - Telecom
Price: please inquire
-
MCP2021T-330E/SNV04
Microchip Technology Inc
Package:Interface - Telecom
Price: please inquire
-
PMB6270
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
-
TXC-04011-BIPQ
Transwitch Corporation
Package:Interface - Telecom
Price: please inquire
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OQ2541HPB-S
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
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SE5008L
Skyworks Solutions Inc
Package:Interface - Telecom
Price: please inquire