The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
- Package / Case
- Mounting Type
- Packaging
- Factory Lead Time
- Number of Circuits
- Function
- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Operating Mode | Supply Current-Max | Data Rate | Seated Height-Max | Telecom IC Type | Filter | Companding Law | Neg Supply Voltage-Nom | Gain Tolerance-Max | Linear Coding | Length | Width |
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![]() | Mfr Part No RFFM6204SB | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | RF MICRO DEVICES INC | 125 °C | -40 °C | UNSPECIFIED | HVQCCN | 2.50 X 2.50 MM, 0.50 MM HEIGHT, GREEN, QFN-16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | 5A991.G | 8517.62.00.50 | QUAD | NO LEAD | 1 | 0.5 mm | compliant | S-XQCC-N16 | AUTOMOTIVE | 0.5 mm | TELECOM CIRCUIT | 2.5 mm | 2.5 mm | ||||||||||||||||||||||
![]() | Mfr Part No STC9492MID | Epson Electronics America Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | SEIKO EPSON CORP | 70 °C | -10 °C | PLASTIC/EPOXY | SOP | SOP, SOP28,.5 | SOP28,.5 | RECTANGULAR | SMALL OUTLINE | Active | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | GULL WING | 1.27 mm | compliant | R-PDSO-G28 | Not Qualified | COMMERCIAL | 35 mA | MODEM | ||||||||||||||||||||
![]() | Mfr Part No STA8088EX | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 169 | STMICROELECTRONICS | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | 9 X 9 MM, 1.20 MM HEIGHT, 0.65 MM PITCH, ROHS COMPLIANT, TFBGA-169 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | BGA | Yes | 1.2 V | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1 | 0.65 mm | compliant | NOT SPECIFIED | 169 | S-PBGA-B169 | INDUSTRIAL | 1.2 mm | RF FRONT END CIRCUIT | 9 mm | 9 mm | |||||||||||||||||
![]() | Mfr Part No TP3067ADWR | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | TEXAS INSTRUMENTS INC | 70 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | 5 V | FULL DUPLEX | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | R-PDSO-G20 | Not Qualified | COMMERCIAL | SYNCHRONOUS/ASYNCHRONOUS | 10 mA | 2.65 mm | PCM CODEC | YES | A-LAW | -5 V | 12.8 mm | 7.5 mm | ||||||||||||||||
![]() | Mfr Part No PM5351-BI-P | Microsemi Storage OTN and Networking Solutions | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC33218ADW | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | FREESCALE SEMICONDUCTOR INC | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | PLASTIC, SOIC-24 | RECTANGULAR | SMALL OUTLINE | Transferred | SOIC | 5 V | EAR99 | 8542.31.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 24 | R-PDSO-G24 | Not Qualified | INDUSTRIAL | 2.65 mm | SPEAKER PHONE CIRCUIT | 15.395 mm | 7.5 mm | ||||||||||||||||||
![]() | Mfr Part No TODX295 | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | NO | 10 | TOSHIBA CORP | 85 °C | -40 °C | UNSPECIFIED | , | RECTANGULAR | FIBER OPTIC | Obsolete | No | 5 V | 8542.39.00.01 | UNSPECIFIED | UNSPECIFIED | NOT SPECIFIED | 1 | unknown | NOT SPECIFIED | R-XXFO-X10 | Not Qualified | INDUSTRIAL | TELECOM CIRCUIT | |||||||||||||||||||||||
![]() | Mfr Part No TA31001P | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | TOSHIBA CORP | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, PLASTIC, DIP-8 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | DUAL | THROUGH-HOLE | 240 | 1 | 2.54 mm | unknown | NOT SPECIFIED | 8 | R-PDIP-T8 | Not Qualified | INDUSTRIAL | 4.25 mm | TELEPHONE RINGER CKT | 9.6 mm | 7.62 mm | ||||||||||||||||||
![]() | Mfr Part No TH7107 | Melexis Microelectronic Integrated Systems | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | THESYS GESELLSCHAFT FUR MIKROELEKTRONIK MBH | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | 3 V | 8542.39.00.01 | DUAL | GULL WING | 1 | unknown | 16 | R-PDSO-G16 | Not Qualified | INDUSTRIAL | 1.75 mm | TELECOM CIRCUIT | 4.9 mm | 3.9 mm | ||||||||||||||||||||
![]() | Mfr Part No IDT82V3288BC | Integrated Device Technology Inc | Datasheet | 62 | - | Min: 1 Mult: 1 | YES | 208 | INTEGRATED DEVICE TECHNOLOGY INC | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | PLASTIC, CABGA-208 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | BGA | No | 3.3 V | e0 | No | EAR99 | TIN LEAD | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 | 1 mm | not_compliant | 30 | 208 | S-PBGA-B208 | Not Qualified | INDUSTRIAL | 1.54 mm | TELECOM CIRCUIT | 17 mm | 17 mm | |||||||||||
![]() | Mfr Part No PSB4501 | Siemens | Datasheet | 7080 | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MT8964AC | Zarlink Semiconductor Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | ZARLINK SEMICONDUCTOR INC | 70 °C | CERAMIC, GLASS-SEALED | DIP | DIP, DIP18,.3 | DIP18,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | TIN LEAD | 8542.39.00.01 | DUAL | THROUGH-HOLE | 260 | 1 | 2.54 mm | unknown | R-GDIP-T18 | Not Qualified | COMMERCIAL | SYNCHRONOUS | 5.08 mm | PCM CODEC | YES | MU-LAW | -5 V | 0.25 dB | NOT AVAILABLE | 22.99 mm | 7.62 mm | |||||||||||
![]() | Mfr Part No MT8964AC | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | MICROSEMI CORP | 70 °C | CERAMIC | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 18 | R-XDIP-T18 | Not Qualified | COMMERCIAL | PCM CODEC | YES | MU-LAW | -5 V | 0.25 dB | NOT AVAILABLE | |||||||||||||||||
![]() | Mfr Part No SMC83C694DLJP | SMSC | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No STLC60134S | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | STMICROELECTRONICS | 80 °C | -40 °C | PLASTIC/EPOXY | LFQFP | TQFP-64 | QFP64,.47SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | No | 3.3 V | e0 | TIN LEAD | DATA RATE: 640K BITS/SEC UPSTREAM | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.5 mm | not_compliant | 64 | S-PQFP-G64 | Not Qualified | OTHER | 8 Mbps | 1.6 mm | MODEM-SUPPORT CIRCUIT | 10 mm | 10 mm | |||||||||||||
![]() | Mfr Part No PEB2466H | Infineon Technologies AG | Datasheet | 71110 | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PEB2466H | Siemens | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | SIEMENS A G | 70 °C | PLASTIC/EPOXY | , | SQUARE | FLATPACK | Transferred | 5 V | QUAD | GULL WING | 4 | unknown | S-PQFP-G64 | Not Qualified | COMMERCIAL | SYNCHRONOUS/ASYNCHRONOUS | 40 mA | PCM CODEC | YES | A/MU-LAW | ||||||||||||||||||||||||
![]() | Mfr Part No AW-CM240NF | AzureWave Technologies | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XE1203I063 | Semtech Corporation | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SE2527L | Skyworks Solutions Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | SKYWORKS SOLUTIONS INC | 85 °C | -20 °C | UNSPECIFIED | VQCCN | VQCCN, | SQUARE | CHIP CARRIER, VERY THIN PROFILE | Obsolete | QFN | 3.3 V | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.65 mm | unknown | 16 | S-XQCC-N16 | OTHER | 1 mm | TELECOM CIRCUIT | 4 mm | 4 mm |
RFFM6204SB
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
STC9492MID
Epson Electronics America Inc
Package:Interface - Telecom
Price: please inquire
STA8088EX
STMicroelectronics
Package:Interface - Telecom
Price: please inquire
TP3067ADWR
Texas Instruments
Package:Interface - Telecom
Price: please inquire
PM5351-BI-P
Microsemi Storage OTN and Networking Solutions
Package:Interface - Telecom
Price: please inquire
MC33218ADW
Freescale Semiconductor
Package:Interface - Telecom
Price: please inquire
TODX295
Toshiba America Electronic Components
Package:Interface - Telecom
Price: please inquire
TA31001P
Toshiba America Electronic Components
Package:Interface - Telecom
Price: please inquire
TH7107
Melexis Microelectronic Integrated Systems
Package:Interface - Telecom
Price: please inquire
IDT82V3288BC
Integrated Device Technology Inc
Package:Interface - Telecom
Price: please inquire
PSB4501
Siemens
Package:Interface - Telecom
Price: please inquire
MT8964AC
Zarlink Semiconductor Inc
Package:Interface - Telecom
Price: please inquire
MT8964AC
Microsemi Corporation
Package:Interface - Telecom
Price: please inquire
SMC83C694DLJP
SMSC
Package:Interface - Telecom
Price: please inquire
STLC60134S
STMicroelectronics
Package:Interface - Telecom
Price: please inquire
PEB2466H
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
PEB2466H
Siemens
Package:Interface - Telecom
Price: please inquire
AW-CM240NF
AzureWave Technologies
Package:Interface - Telecom
Price: please inquire
XE1203I063
Semtech Corporation
Package:Interface - Telecom
Price: please inquire
SE2527L
Skyworks Solutions Inc
Package:Interface - Telecom
Price: please inquire
