The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
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- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Carrier Type (2) | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Applications | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Power Supplies | Temperature Grade | Supply Current-Max | Data Rate | Seated Height-Max | Screening Level | Telecom IC Type | Number of Transceivers | Output Low Current-Max | Standard | Carrier Type | ISDN Access Rate | Reference Point | Output High Voltage-Min | Output Low Voltage-Max | Make-break Ratio | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No TJA1021TK/20 | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | NXP SEMICONDUCTORS | 150 °C | -40 °C | PLASTIC/EPOXY | HVSON | HVSON, | SOLCC8,.12,25 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | SON | Yes | 12 V | 8542.39.00.01 | DUAL | NO LEAD | 1 | 0.65 mm | compliant | 8 | S-XDSO-N8 | Not Qualified | AUTOMOTIVE | 4 mA | 1 mm | AEC-Q100 | LIN TRANSCEIVER | 1 | 3 mm | 3 mm | ||||||||||||||||||||||
 | Mfr Part No TZA3005H | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | NXP SEMICONDUCTORS | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | 14 X 14 X 2.70 MM, PLASTIC, QFP-64 | QFP64,.66SQ,32 | SQUARE | FLATPACK | Obsolete | QFP | No | 3.3 V | ATM; SDH; SONET | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.8 mm | unknown | 64 | S-PQFP-G64 | Not Qualified | INDUSTRIAL | 0.42 mA | 3 mm | ATM/SONET/SDH TRANSCEIVER | 14 mm | 14 mm | ||||||||||||||||||||||
| Mfr Part No TP3410J304 | National Semiconductor Corporation | Datasheet | 64 | - | Min: 1 Mult: 1 | NO | 28 | NATIONAL SEMICONDUCTOR CORP | 1 | CERAMIC, GLASS-SEALED | DIP | DIP-28 | DIP28,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | TIN LEAD | DUAL | THROUGH-HOLE | 260 | 1 | 2.54 mm | not_compliant | R-GDIP-T28 | Not Qualified | 160 Mbps | DIGITAL SLIC | 0.0032 A | ANSI T1.601 | BASIC | U | 2.4 V | 0.4 V | |||||||||||||||||||||||
| Mfr Part No UM91315C | United Microelectronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | UNITED MICROELECTRONICS CORP | 70 °C | -20 °C | PLASTIC/EPOXY | , | RECTANGULAR | IN-LINE | Obsolete | 2.5 V | SELECTABLE MAKE/BREAK RATIO 1:2 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | unknown | R-PDIP-T18 | Not Qualified | COMMERCIAL | 2 mA | TELEPHONE DIALER CIRCUIT | 1:1.5 | |||||||||||||||||||||||||||||||
| Mfr Part No HCPL-810J-000E | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | BROADCOM LTD | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Active | Yes | 5 V | e3 | TIN | 8542.39.00.01 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | R-PDSO-G16 | Not Qualified | INDUSTRIAL | 3.632 mm | TELECOM CIRCUIT | 10.312 mm | 7.493 mm | ||||||||||||||||||||||||
| Mfr Part No DS21Q42 | Dallas Semiconductor | Datasheet | 57 | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IDT82V3380PF | Integrated Device Technology Inc | Datasheet | 138 | - | Min: 1 Mult: 1 | YES | 100 | INTEGRATED DEVICE TECHNOLOGY INC | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | No | 3.3 V | e0 | No | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | NOT SPECIFIED | 1 | 0.5 mm | compliant | NOT SPECIFIED | 100 | S-PQFP-G100 | Not Qualified | INDUSTRIAL | 1.4 mm | TELECOM CIRCUIT | 14 mm | 14 mm | ||||||||||||||||||||
| Mfr Part No AHA4540B-086PQC | Comtech AHA Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | COMTECH AHA CORP | 3 | 70 °C | PLASTIC/EPOXY | QFP | QFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK | Contact Manufacturer | No | 8542.39.00.01 | QUAD | GULL WING | 220 | 0.5 mm | unknown | S-PQFP-G208 | Not Qualified | COMMERCIAL | 20 mA | TELECOM CIRCUIT | ||||||||||||||||||||||||||||||
| Mfr Part No PM7346-BI-P | Microsemi Storage OTN and Networking Solutions | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No R8070J | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 68 | T-1(DS1) | CONEXANT SYSTEMS | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC68,1.0SQ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Obsolete | No | 5 V | e0 | TIN LEAD | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | compliant | S-PQCC-J68 | Not Qualified | COMMERCIAL | 0.019 mA | CEPT PCM-30/E-1 | ||||||||||||||||||||||||||||
 | Mfr Part No 88E1111-XX-BAB1C000 | Marvell Technology Group Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 117 | MARVELL SEMICONDUCTOR INC | PLASTIC/EPOXY | LBGA | LBGA, BGA117,9X13,40 | BGA117,9X13,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | Yes | 1 V | Yes | IT ALSO REQUIRES 2.5V DIGITAL SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 1 | 1 mm | compliant | 117 | R-PBGA-B117 | Not Qualified | 1000000 Mbps | 1.54 mm | ETHERNET TRANSCEIVER | 1 | 14 mm | 10 mm | ||||||||||||||||||||||||
 | Mfr Part No TEA1110AL-S14-R | Unisonic Technologies Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 14 | UNISONIC TECHNOLOGIES CO LTD | 75 °C | -25 °C | PLASTIC/EPOXY | SOP | SOP, SOP14,.25 | SOP14,.25 | RECTANGULAR | SMALL OUTLINE | Active | SOIC | Yes | 2.9 V | 8542.39.00.01 | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | compliant | NOT SPECIFIED | 14 | R-PDSO-G14 | Not Qualified | COMMERCIAL EXTENDED | 0.00148 mA | 1.94 mm | TELEPHONE MULTIFUNCTION CIRCUIT | 8.55 mm | 3.95 mm | ||||||||||||||||||||||
| Mfr Part No PI90SD1636AFD | Pericom Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | PERICOM SEMICONDUCTOR CORP | 3 | 70 °C | PLASTIC/EPOXY | LQFP | LQFP, QFP64,.6SQ,32 | QFP64,.6SQ,32 | SQUARE | FLATPACK, LOW PROFILE | Obsolete | QFP | No | 3.3 V | e0 | EAR99 | TIN LEAD | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.8 mm | compliant | 64 | S-PQFP-G64 | Not Qualified | COMMERCIAL | 1250000 Mbps | 1.6 mm | ETHERNET TRANSCEIVER | 1 | 14 mm | 14 mm | ||||||||||||||||||||
| Mfr Part No SKY58095-11 | Skyworks Solutions Inc | Datasheet | 800 | - | Min: 1 Mult: 1 | YES | 62 | 2019-11-01 | SKYWORKS SOLUTIONS INC | 110 °C | -40 °C | VFLGA | RECTANGULAR | GRID ARRAY, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH | Active | Yes | 3.4 V | 8542.39.00.01 | BOTTOM | NO LEAD | NOT SPECIFIED | 1 | 0.44 mm | unknown | NOT SPECIFIED | R-XBGA-N62 | 0.8 mm | RF AND BASEBAND CIRCUIT | 8.6 mm | 6.5 mm | |||||||||||||||||||||||||||||
 | Mfr Part No TH72005 | Melexis Microelectronic Integrated Systems | Datasheet | 1445 | - | Min: 1 Mult: 1 | YES | 10 | MELEXIS N V | 125 °C | -40 °C | UNSPECIFIED | HVSON | HVSON, | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | QFN | 3 V | 8542.39.00.01 | DUAL | NO LEAD | 1 | 0.5 mm | compliant | 10 | S-XDSO-N10 | Not Qualified | AUTOMOTIVE | 1 mm | TELECOM CIRCUIT | 3 mm | 3 mm | |||||||||||||||||||||||||||
| Mfr Part No MC3418LD | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | MOTOROLA SEMICONDUCTOR PRODUCTS | 70 °C | CERAMIC | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T16 | 5/15 V | COMMERCIAL | 10 mA | ||||||||||||||||||||||||||||||||
| Mfr Part No SDC-MSD30AG | Laird, A DuPont Business | Datasheet | - | - | Min: 1 Mult: 1 | LAIRD TECHNOLOGIES INC | , | Obsolete | Yes | NOT SPECIFIED | unknown | NOT SPECIFIED | TELECOM CIRCUIT | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MC145572FU | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | MOTOROLA SEMICONDUCTOR PRODUCTS | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, QFP44,.5SQ,32 | QFP44,.5SQ,32 | SQUARE | FLATPACK | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | 0.8 mm | unknown | S-PQFP-G44 | Not Qualified | INDUSTRIAL | 160 Mbps | 0.005 A | ANSI T1.601 | BASIC | U | 2.4 V | 0.5 V | |||||||||||||||||||||||
| Mfr Part No MC145572FU | Motorola Semiconductor Products | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | MOTOROLA INC | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, QFP44,.5SQ,32 | QFP44,.5SQ,32 | SQUARE | FLATPACK | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | 0.8 mm | unknown | S-PQFP-G44 | Not Qualified | INDUSTRIAL | 160 Mbps | 0.005 A | ANSI T1.601 | BASIC | U | 2.4 V | 0.5 V | |||||||||||||||||||||||
| Mfr Part No AN6164S | Panasonic Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | PANASONIC CORP | 75 °C | -20 °C | PLASTIC/EPOXY | SOP | SOP, SOP28,.4 | SOP28,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | unknown | NOT SPECIFIED | 28 | R-PDSO-G28 | Not Qualified | COMMERCIAL EXTENDED | 0.017 mA | 2.4 mm | TELEPHONE SPEECH CIRCUIT | 17.81 mm | 7.2 mm |
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TJA1021TK/20
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
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TZA3005H
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
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TP3410J304
National Semiconductor Corporation
Package:Interface - Telecom
Price: please inquire
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UM91315C
United Microelectronics Corporation
Package:Interface - Telecom
Price: please inquire
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HCPL-810J-000E
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
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DS21Q42
Dallas Semiconductor
Package:Interface - Telecom
Price: please inquire
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IDT82V3380PF
Integrated Device Technology Inc
Package:Interface - Telecom
Price: please inquire
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AHA4540B-086PQC
Comtech AHA Corp
Package:Interface - Telecom
Price: please inquire
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PM7346-BI-P
Microsemi Storage OTN and Networking Solutions
Package:Interface - Telecom
Price: please inquire
-
R8070J
Conexant Systems Inc
Package:Interface - Telecom
Price: please inquire
-
88E1111-XX-BAB1C000
Marvell Technology Group Ltd
Package:Interface - Telecom
Price: please inquire
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TEA1110AL-S14-R
Unisonic Technologies Co Ltd
Package:Interface - Telecom
Price: please inquire
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PI90SD1636AFD
Pericom Semiconductor Corporation
Package:Interface - Telecom
Price: please inquire
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SKY58095-11
Skyworks Solutions Inc
Package:Interface - Telecom
Price: please inquire
-
TH72005
Melexis Microelectronic Integrated Systems
Package:Interface - Telecom
Price: please inquire
-
MC3418LD
Freescale Semiconductor
Package:Interface - Telecom
Price: please inquire
-
SDC-MSD30AG
Laird, A DuPont Business
Package:Interface - Telecom
Price: please inquire
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MC145572FU
Freescale Semiconductor
Package:Interface - Telecom
Price: please inquire
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MC145572FU
Motorola Semiconductor Products
Package:Interface - Telecom
Price: please inquire
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AN6164S
Panasonic Electronic Components
Package:Interface - Telecom
Price: please inquire