The category is 'RF Transceiver ICs'

  • All Manufacturers
  • Features
  • Height Seated (Max)
  • Mfr
  • Operating Temperature
  • Package
  • Package / Case
  • Product Status
  • Series
  • Size / Dimension
  • Supplier Device Package
  • Tolerance
  • Composition
  • Package / Case:

    Axial

Image

Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Mount

Mounting Type

Package / Case

Number of Pins

Supplier Device Package

Dielectric Material

Base Product Number

Brand

Data RAM Size

Data RAM Type

Factory Pack QuantityFactory Pack Quantity

Interface Type

Lead Free Status / RoHS Status

Manufacturer

Maximum Clock Frequency

Maximum Data Rate

Maximum Operating Temperature

Mfr

Minimum Operating Temperature

Moisture Sensitive

Mounting

Mounting Styles

MSL

Number of I/Os

Operating Supply Voltage (Max)

Operating Supply Voltage (Min)

Operating Supply Voltage (Typ)

Operating Temperature (Max.)

Operating Temperature (Min.)

Package

Package Type

Product Status

Qualification

Rad Hardened

RoHS

Supply Current Receiving

Supply Current Transmitting

Supply Voltage-Max

Supply Voltage-Min

Unit Weight

Voltage Rating AC

Voltage Rating DC

Operating Temperature

Packaging

Series

Size / Dimension

Tolerance

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

Termination

Temperature Coefficient

Type

Resistance

Max Operating Temperature

Min Operating Temperature

Composition

Applications

Power (Watts)

Capacitance

Subcategory

Technology

Voltage - Supply

Frequency

Pin Count

Operating Frequency

Operating Supply Voltage

Failure Rate

Lead Spacing

Interface

Memory Size

RAM Size

Max Supply Current

Program Memory Type

Program Memory Size

Output Power

Data Rate

Data Bus Width

Product Type

Protocol

Power - Output

RF Family/Standard

Sensitivity

Data Rate (Max)

Number of ADC Channels

Serial Interfaces

Current - Receiving

Current - Transmitting

Number of Timers

Modulation

Sensitivity (dBm)

Number of GPIO

GPIO

Features

Product Category

Device Core

Height

Height Seated (Max)

Length

Width

Lead Free

Ratings

SAF3560EL/V1100K

Mfr Part No

SAF3560EL/V1100K

NXP Datasheet

-

-

Min: 1

Mult: 1

Axial

Axial

NXP USA Inc.

Tray

Obsolete

-65°C ~ 175°C

Bulk

Military, MIL-R-10509/2, RN65

0.180 Dia x 0.562 L (4.57mm x 14.27mm)

±0.1%

Active

2

±50ppm/°C

169 Ohms

Metal Film

0.5W, 1/2W

--

Flame Retardant Coating, Military, Moisture Resistant, Safety

--

CYW20737L

Mfr Part No

CYW20737L

Infineon Datasheet

-

-

Min: 1

Mult: 1

Surface Mount

Axial

Axial

CYW20737

Infineon Technologies

60 kB

RAM

1300

I2C, SPI, UART

Infineon

24 MHz

+ 85 C

Infineon Technologies

- 40 C

SMD/SMT

14 I/O

Tray

Active

Details

1.2 V

1.2 V

-65°C ~ 175°C

Tape & Reel (TR)

Military, MIL-PRF-55182/01, RNC55

0.094 Dia x 0.250 L (2.39mm x 6.35mm)

±0.1%

Active

2

±25ppm/°C

TxRx + MCU

17.8 kOhms

Metal Film

0.125W, 1/8W

Wireless & RF Integrated Circuits

Si

3.8V

2.4GHz

2.402 GHz to 2.48 GHz

1.2 V

P (0.1%)

320kB ROM, 60kB RAM

EEPROM

512 kbit

2 dBm

32 bit

RF Microcontrollers - MCU

Bluetooth v4.0

4dBm

Bluetooth

-94dBm

1Mbps

9 Channel

I²C, SPI, UART

9.8mA

9.1mA

4

GFSK

14

Military, Moisture Resistant, Weldable

RF Microcontrollers - MCU

--

DA14683-00000A92

Mfr Part No

DA14683-00000A92

Renesas Datasheet

-

-

Min: 1

Mult: 1

Surface Mount

Axial

Axial

DA14683

128 kB

RAM

Serial

96 MHz

400 kbps

+ 85 C

Renesas Design Germany GmbH

- 40 C

SMD/SMT

37 I/O

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

Active

3.1 mA

3.4 mA

4.75 V

1.7 V

-65°C ~ 175°C

Bulk

Military, MIL-PRF-55182/01, RNC55

0.094 Dia x 0.250 L (2.39mm x 6.35mm)

±0.1%

Active

2

±25ppm/°C

TxRx + MCU

2 kOhms

Metal Film

0.125W, 1/8W

Wireless & RF Integrated Circuits

Si

1.9V ~ 3.6V

2.4GHz

2.4 GHz

R (0.01%)

-

OTP

64 kB, 128 kB

0 dBm

32 bit

RF System on a Chip - SoC

Bluetooth v5.0

0dBm

Bluetooth

-94dBm

-

8 Channel

GPIO, I²S, SPI, UART, USB

3.1mA

3.4mA

-

21

Military, Moisture Resistant, Weldable

--

DA14586-00F02AT2

Mfr Part No

DA14586-00F02AT2

Renesas Datasheet

-

-

Min: 1

Mult: 1

Surface Mount

Axial

Axial

DA14586

96 kB

SRAM

I2C, SPI, UART

16 MHz

1 Mbps

+ 85 C

Renesas Design Germany GmbH

- 40 C

SMD/SMT

MSL 3 - 168 hours

24 I/O

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

Active

-

3.7 mA

3.4 mA

3.6 V

1.7 V

-65°C ~ 175°C

Bulk

Military, MIL-PRF-55182/01, RNC55

0.094 Dia x 0.250 L (2.39mm x 6.35mm)

±0.1%

Active

2

±25ppm/°C

TxRx + MCU

29.4 kOhms

Metal Film

0.125W, 1/8W

Wireless & RF Integrated Circuits

Si

3.3V

2.4GHz

2.4 GHz

R (0.01%)

I2C, I2S, SPI, UART

2Mb Flash, 64kB OTP, 128kB ROM, 96kB SRAM

Flash, OTP, ROM

2MB

0 dBm

32bit

RF System on a Chip - SoC

Bluetooth v5.0

0dBm

Bluetooth

-93dBm

-

4 Channel

I²C, SPI, UART

3.7mA

3.4mA

-

24

Military, Moisture Resistant, Weldable

ARM Cortex-M0

0.9 mm

--

5 mm

5 mm

DA14580-01AT2

Mfr Part No

DA14580-01AT2

Renesas Datasheet

-

-

Min: 1

Mult: 1

Surface Mount

Surface Mount

Axial

Axial

DA14580

42 kB

SRAM

I2C, SPI, UART

16 MHz

+ 85 C

Renesas Design Germany GmbH

- 40 C

SMD/SMT

MSL 3 - 168 hours

24 I/O

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

Not For New Designs

-

Compliant

3.7 mA

3.4 mA

3.3 V

2.35 V

-65°C ~ 175°C

Bulk

Military, MIL-PRF-55182/01, RNC55

0.094 Dia x 0.250 L (2.39mm x 6.35mm)

±0.1%

Active

2

±25ppm/°C

TxRx + MCU

3.09 kOhms

85 °C

-40 °C

Metal Film

0.125W, 1/8W

Wireless & RF Integrated Circuits

Si

2.35V ~ 3.3V

2.4GHz

2.4 GHz

3.3 V

S (0.001%)

I2C, SPI, UART

32kB OTP, 84kB ROM, 50kB SRAM

42 kB

3.7 mA

32KB

0 dBm

32bit

RF System on a Chip - SoC

Bluetooth v4.1

-1dBm

Bluetooth

-93dBm

-

4 Channel

I²C, SPI, UART

3.7mA

3.4mA

2 Timer

-

-93 dBm

24

24

Military, Moisture Resistant, Weldable

ARM Cortex-M0

0.9 mm

--

5 mm

5 mm

Lead Free

DA14681-01000U22

Mfr Part No

DA14681-01000U22

Renesas Datasheet

12
In Stock

Min: 1

Mult: 1

Surface Mount

Axial

Axial

DA14681

128 kB

SRAM

I2C, SPI, UART, USB

96 MHz

400 kbps

+ 85 C

Renesas Design Germany GmbH

- 40 C

SMD/SMT

21 I/O

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

Not For New Designs

3.1 mA

3.4 mA

4.75 V

1.7 V

-65°C ~ 175°C

Bulk

Military, MIL-PRF-55182/01, RNC55

0.094 Dia x 0.250 L (2.39mm x 6.35mm)

±0.1%

Active

2

±25ppm/°C

TxRx + MCU

305 Ohms

Metal Film

0.125W, 1/8W

Wireless & RF Integrated Circuits

Si

1.7V ~ 4.5V

2.4GHz

2.4 GHz

S (0.001%)

64kB OTP, 128kB ROM, 144kB SRAM

OTP

64 kB, 128 kB

0 dBm

32 bit

RF System on a Chip - SoC

Bluetooth v4.2

0dBm

Bluetooth

-94dBm

-

8 Channel

I²C, I²S, PCM, SPI, UART, USB

-

-

3 Timer

-

Military, Moisture Resistant, Weldable

0.5 mm

--

3.406 mm

3.01 mm

DA14580-01UNA

Mfr Part No

DA14580-01UNA

Renesas Datasheet

-

-

Min: 1

Mult: 1

Surface Mount

Surface Mount

Axial

34

Axial

DA14580

42 kB

SRAM

I2C, SPI, UART

16 MHz

+ 85 C

Renesas Design Germany GmbH

- 40 C

SMD/SMT

14 I/O

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

Not For New Designs

Compliant

3.7 mA

3.4 mA

3.3 V

2.35 V

-65°C ~ 175°C

Bulk

Military, MIL-PRF-55182/01, RNC55

0.094 Dia x 0.250 L (2.39mm x 6.35mm)

±0.1%

Active

2

±25ppm/°C

TxRx + MCU

301 Ohms

85 °C

-40 °C

Metal Film

0.125W, 1/8W

Wireless & RF Integrated Circuits

Si

2.35V ~ 3.3V

2.4GHz

2.4 GHz

3.3 V

S (0.001%)

I2C, SPI, UART

32kB OTP, 84kB ROM, 50kB SRAM

50 kB

3.7 mA

32 kB, 84 kB

0 dBm

32 bit

RF System on a Chip - SoC

Bluetooth v4.1

-1dBm

Bluetooth

-93dBm

-

4 Channel

I²C, SPI, UART

3.7mA

3.4mA

2 Timer

-

-93 dBm

14

14

Military, Moisture Resistant, Weldable

0.511 mm

--

2.436 mm

2.436 mm

Lead Free

CC3220SF12RGKT

Mfr Part No

CC3220SF12RGKT

Texas Instruments Datasheet

-

-

Min: 1

Mult: 1

Surface Mount

Axial

Axial

RNC55

Vishay Dale

Tape & Reel (TR)

Active

-65°C ~ 175°C

Military, MIL-PRF-55182/01, RNC55

0.094 Dia x 0.250 L (2.39mm x 6.35mm)

±0.1%

2

±25ppm/°C

TxRx + MCU

2.49 kOhms

Metal Film

0.125W, 1/8W

2.1V ~ 3.6V

2.4GHz

R (0.01%)

1MB Flash, 256kB RAM

802.11b/g/n

18.3dBm

WiFi

-96dBm

16Mbps

I²C, I²S, JTAG, SPI, UART

CCK, DSSS, OFDM

27

Military, Moisture Resistant, Weldable

-

EFR32BG22C222F352GM40-C

Mfr Part No

EFR32BG22C222F352GM40-C

Silicon Labs Datasheet

6
In Stock

Min: 1

Mult: 1

Surface Mount

Axial

Axial

EFR32BG22C222

Silicon Labs

32 kB

RAM

490

EUART, I2C, PDM, USART

Silicon Laboratories

76.8 MHz

2 Mbps

+ 85 C

Silicon Labs

- 40 C

Yes

SMD/SMT

MSL 2 - 1 year

26 I/O

Tray

Active

-

Details

3.6 mA

8.2 mA

3.8 V

1.71 V

-55°C ~ 175°C

Bulk

CMF

0.090 Dia x 0.240 L (2.29mm x 6.10mm)

±1%

Active

2

±50ppm/°C

Bluetooth

274 kOhms

Metal Film

0.5W, 1/2W

Wireless & RF Integrated Circuits

Si

1.71V ~ 3.8V

2.4GHz ~ 2.4835GHz

2.4 GHz

--

EUART, I2C, I2S, PDM, SMBus, SPI, UART

352kB Flash, 32kB RAM

Flash

352KB

6 dBm

32bit

RF System on a Chip - SoC

Bluetooth v5.2

6dBm

Bluetooth

- 96.2 dBm

2Mbps

ADC, I²C, I²S, PWM, SPI, IrDA, UART, USART

3.6mA ~ 4.5mA

4.1mA ~ 8.5mA

4 x 16 bit, 1 x 32 bit

2FSK, DSSS, GFSK, GMSK, MSK, OQPSK

26

Flame Retardant Coating, Moisture Resistant, Safety

RF System on a Chip - SoC

ARM Cortex-M33F

0.85 mm

--

5 mm

5 mm

EFR32BG22C222F352GN32-C

Mfr Part No

EFR32BG22C222F352GN32-C

Silicon Labs Datasheet

-

-

Min: 1

Mult: 1

Surface Mount

Axial

Axial

EFR32BG22C222

Silicon Labs

32 kB

RAM

490

EUART, I2C, PDM, USART

Silicon Laboratories

76.8 MHz

2 Mbps

+ 85 C

Silicon Labs

- 40 C

Yes

SMD/SMT

MSL 2 - 1 year

18 I/O

Tray

Active

-

Details

3.6 mA

8.2 mA

3.8 V

1.71 V

-55°C ~ 175°C

Bulk

CMF

0.090 Dia x 0.240 L (2.29mm x 6.10mm)

±0.1%

Active

2

±50ppm/°C

Bluetooth

221 Ohms

Metal Film

0.5W, 1/2W

Wireless & RF Integrated Circuits

Si

1.71V ~ 3.8V

2.4GHz ~ 2.4835GHz

2.4 GHz

--

EUART, I2C, I2S, PDM, SMBus, SPI, UART

352kB Flash, 32kB RAM

Flash

352KB

6 dBm

32bit

RF System on a Chip - SoC

Bluetooth v5.2

6dBm

Bluetooth

- 96.2 dBm

2Mbps

ADC, I²C, I²S, PWM, SPI, IrDA, UART, USART

3.6mA ~ 4.5mA

4.1mA ~ 8.5mA

4 x 16 bit, 1 x 32 bit

2FSK, DSSS, GFSK, GMSK, MSK, OQPSK

18

Flame Retardant Coating, Moisture Resistant, Safety

RF System on a Chip - SoC

ARM Cortex-M33F

0.3 mm

--

4 mm

4 mm

EFR32FG22C121F512GM32-CR

Mfr Part No

EFR32FG22C121F512GM32-CR

Silicon Labs Datasheet

-

-

Min: 1

Mult: 1

Surface Mount

Axial

Axial

EFR32FG22C121

Silicon Labs

32 kB

RAM

2500

Silicon Laboratories

38.4 MHz

+ 85 C

Silicon Labs

- 40 C

Yes

SMD/SMT

18 I/O

Tape & Reel (TR)

Active

Details

-55°C ~ 175°C

Bulk

CMF

0.090 Dia x 0.240 L (2.29mm x 6.10mm)

±1%

Active

2

±50ppm/°C

Bluetooth

226 kOhms

Metal Film

0.5W, 1/2W

Wireless & RF Integrated Circuits

Si

1.71V ~ 3.8V

2.4GHz ~ 2.4835GHz

2.4 GHz

--

512kB Flash, 32kB RAM

Flash

512 kB

6 dBm

32 bit

RF System on a Chip - SoC

-

6dBm

WiFi

-102.3dBm

2Mbps

I²C, I²S, SPI, IrDA, PDM, UART, USART

3.6mA ~ 4.6mA

4.1mA ~ 8.5mA

2-FSK, 2-GFSK, DSSS, GFSK, GMSK, MSK, O-QPSK

18

Flame Retardant Coating, Moisture Resistant, Safety

RF System on a Chip - SoC

--

EFR32BG22C222F352GM32-CR

Mfr Part No

EFR32BG22C222F352GM32-CR

Silicon Labs Datasheet

-

-

Min: 1

Mult: 1

Surface Mount

Axial

Axial

EFR32BG22C222

Silicon Labs

32 kB

RAM

2500

EUART, I2C, PDM, USART

Silicon Laboratories

76.8 MHz

2 Mbps

+ 85 C

Silicon Labs

- 40 C

Yes

Surface Mount

SMD/SMT

18 I/O

3.8(V)

1.71(V)

3(V)

85C

-40C

Tape & Reel (TR)

QFN EP

Active

No

Details

4.4 mA, 4.5 mA

8.5 mA

3.8 V

1.71 V

-55°C ~ 175°C

Bulk

CMF

0.090 Dia x 0.240 L (2.29mm x 6.10mm)

±1%

Active

2

±50ppm/°C

Bluetooth

392 Ohms

Metal Film

0.5W, 1/2W

Wireless & RF Integrated Circuits

Si

1.71V ~ 3.8V

2.4GHz ~ 2.4835GHz

32

2.4 GHz

--

512kB Flash, 32kB RAM

Flash

352 kB

6 dBm

32 bit

RF System on a Chip - SoC

Bluetooth v5.2

6dBm

Bluetooth

- 96.2 dBm, - 98.9 dBm, - 106.7 dBm

2000(kbps)

ADC, I²C, I²S, PWM, SPI, IrDA, UART, USART

3.6mA ~ 4.5mA

4.1mA ~ 8.5mA

4 x 16 bit, 1 x 32 bit

2FSK, DSSS, GFSK, GMSK, MSK, OQPSK

18

Flame Retardant Coating, Moisture Resistant, Safety

RF System on a Chip - SoC

0.85 mm

--

4 mm

4 mm

EFR32BG22C224F512GM40-C

Mfr Part No

EFR32BG22C224F512GM40-C

Silicon Labs Datasheet

24
In Stock

-

Min: 1

Mult: 1

Surface Mount

Axial

Axial

EFR32BG22C224

Silicon Labs

32 kB

RAM

490

EUART, I2C, PDM, USART

Silicon Laboratories

76.8 MHz

2 Mbps

+ 85 C

Silicon Labs

- 40 C

Yes

SMD/SMT

MSL 2 - 1 year

26 I/O

Tray

Active

-

Details

3.6 mA

8.2 mA

3.8 V

1.71 V

-55°C ~ 175°C

Tape & Reel (TR)

CMF

0.180 Dia x 0.562 L (4.57mm x 14.27mm)

±0.1%

Active

2

±25ppm/°C

Bluetooth

30.51 kOhms

Metal Film

1.5W

Wireless & RF Integrated Circuits

Si

1.71V ~ 3.8V

2.4GHz ~ 2.4835GHz

2.4 GHz

--

EUART, I2C, I2S, PDM, SMBus, SPI, UART

512kB Flash, 32kB RAM

Flash

512KB

6 dBm

32bit

RF System on a Chip - SoC

Bluetooth v5.2

6dBm

Bluetooth

- 96.2 dBm

2Mbps

ADC, I²C, I²S, PWM, SPI, IrDA, UART, USART

3.6mA ~ 4.5mA

4.1mA ~ 8.5mA

4 x 16 bit, 1 x 32 bit

2FSK, DSSS, GFSK, GMSK, MSK, OQPSK

26

Flame Retardant Coating, Moisture Resistant, Safety

RF System on a Chip - SoC

ARM Cortex-M33F

0.85 mm

--

5 mm

5 mm

BC6130A04IQQBR

Mfr Part No

BC6130A04IQQBR

CSR Datasheet

-

-

Min: 1

Mult: 1

Axial

Axial

RNC55

Vishay Dale

Tape & Reel (TR)

Active

-65°C ~ 175°C

Military, MIL-PRF-55182/01, RNC55

0.094 Dia x 0.250 L (2.39mm x 6.35mm)

±1%

2

±50ppm/°C

27.4 kOhms

Metal Film

0.125W, 1/8W

S (0.001%)

Military, Moisture Resistant, Weldable

-

CYW20732ST

Mfr Part No

CYW20732ST

Infineon Datasheet

-

-

Min: 1

Mult: 1

Through Hole

Axial

48-LGA (6.5x6.5)

Polypropylene (PP), Metallized

--

Infineon Technologies

Tape & Reel (TR)

Obsolete

250V

630V

-55°C ~ 100°C

Tape & Reel (TR)

MKP1839

0.217 Dia x 0.433 L (5.50mm x 11.00mm)

±2.5%

Active

--

PC Pins

TxRx + MCU

DC Link, DC Filtering; High Pulse, DV/DT

75pF

1.4V ~ 3.6V

2.4GHz

--

-

Bluetooth v4.0

-

Bluetooth

-

-

I²C, SPI, UART

-

-

-

14

--

--

--

DA14585-00000VV2

Mfr Part No

DA14585-00000VV2

Renesas Datasheet

-

-

Min: 1

Mult: 1

Surface Mount

Axial

Axial

DA14585

96 kB

SRAM

I2C, SPI, UART

16 MHz

1 Mbps

+ 85 C

Renesas Design Germany GmbH

- 40 C

SMD/SMT

MSL 1 - Unlimited

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

Active

-

3.7 mA

3.4 mA

3.6 V

900 mV

-65°C ~ 175°C

Bulk

Military, MIL-PRF-55182/01, RNC55

0.094 Dia x 0.250 L (2.39mm x 6.35mm)

±0.1%

Active

2

±25ppm/°C

TxRx + MCU

298 kOhms

Metal Film

0.125W, 1/8W

Wireless & RF Integrated Circuits

Si

3.3V

2.4GHz

2.4 GHz

S (0.001%)

I2C, I2S, SPI, UART

64kB OTP, 128kB ROM, 96kB SRAM

OTP, ROM

64KB

0 dBm

32bit

RF System on a Chip - SoC

Bluetooth v5.0

0dBm

Bluetooth

-93dBm

-

4 Channel

I²C, SPI, UART

3.7mA

3.4mA

-

14

Military, Moisture Resistant, Weldable

ARM Cortex-M0

0.39 mm

--

2.66 mm

2.4 mm

DA14680-01F08A92

Mfr Part No

DA14680-01F08A92

Renesas Datasheet

-

-

Min: 1

Mult: 1

Surface Mount

Axial

Axial

DA14680

128 kB

SRAM

I2C, SPI, UART, USB

96 MHz

400 kbps

+ 85 C

Renesas Design Germany GmbH

- 40 C

SMD/SMT

31 I/O

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

Not For New Designs

3.1 mA

3.4 mA

4.75 V

1.7 V

-65°C ~ 175°C

Bulk

Military, MIL-PRF-55182/01, RNC55

0.094 Dia x 0.250 L (2.39mm x 6.35mm)

±0.1%

Active

2

±25ppm/°C

TxRx + MCU

294 kOhms

Metal Film

0.125W, 1/8W

Wireless & RF Integrated Circuits

Si

1.7V ~ 4.5V

2.4GHz

2.4 GHz

S (0.001%)

8Mb Flash, 64kB OTP, 128kB ROM, 144kB SRAM

Flash

64 kB, 128 kB, 8 MB

0 dBm

32 bit

RF System on a Chip - SoC

Bluetooth v4.2

0dBm

Bluetooth

-94dBm

-

8 Channel

I²C, I²S, PCM, SPI, UART, USB

-

-

3 Timer

-

Military, Moisture Resistant, Weldable

0.9 mm

--

6 mm

6 mm

MAX7031LATJ T

Mfr Part No

MAX7031LATJ T

Analog Devices Datasheet

-

-

Min: 1

Mult: 1

Surface Mount

Axial

32

Axial

MAX703

Analog Devices Inc./Maxim Integrated

Tape & Reel (TR)

Obsolete

Compliant

-55°C ~ 150°C

Tape & Reel (TR)

RNX

0.140 Dia x 0.290 L (3.56mm x 7.37mm)

±1%

Active

2

±100ppm/°C

TxRx Only

5 MOhms

125 °C

-40 °C

Metal Oxide Film

0.5W, 1/2W

2.1V ~ 3.6V, 4.5V ~ 5.5V

308MHz

--

-

66 kbps

-

13.1dBm

General ISM < 1GHz

-110dBm

66kbps

-

6.4mA ~ 6.8mA

11.6mA

FSK

-110 dBm

Flame Retardant Coating, High Voltage, Safety

--

MC13214

Mfr Part No

MC13214

Freescale Datasheet

-

-

Min: 1

Mult: 1

Surface Mount

Axial

Axial

Freescale Semiconductor

Tray

Obsolete

-65°C ~ 175°C

Bulk

Military, MIL-R-10509/8, RN50

0.065 Dia x 0.150 L (1.65mm x 3.81mm)

±1%

Active

2

±50ppm/°C

TxRx + MCU

44.2 kOhms

Metal Film

0.05W, 1/20W

2V ~ 3.4V

2.4GHz

--

60kB Flash, 4kB RAM

Zigbee®

0dBm

802.15.4

-92dBm

250kbps

I²C, SPI

37mA

30mA

O-QPSK

38

Flame Retardant Coating, Military, Moisture Resistant, Safety

--

EFR32BG22C224F512IM40-CR

Mfr Part No

EFR32BG22C224F512IM40-CR

Silicon Labs Datasheet

-

-

Min: 1

Mult: 1

Surface Mount

Axial

Axial

EFR32BG22C224

Silicon Labs

32 kB

RAM

2500

EUART, I2C, PDM, USART

Silicon Laboratories

76.8 MHz

2 Mbps

+ 125 C

Silicon Labs

- 40 C

Yes

SMD/SMT

26 I/O

Tape & Reel (TR)

Active

Details

3.6 mA

8.2 mA

3.8 V

1.71 V

0.082453 oz

-55°C ~ 175°C

Bulk

CMF

0.090 Dia x 0.240 L (2.29mm x 6.10mm)

±1%

Active

2

±50ppm/°C

Bluetooth

287 Ohms

Metal Film

0.5W, 1/2W

Wireless & RF Integrated Circuits

Si

1.71V ~ 3.8V

2.4GHz ~ 2.4835GHz

2.4 GHz

--

512kB Flash, 32kB RAM

Flash

512 kB

6 dBm

32 bit

RF System on a Chip - SoC

Bluetooth v5.2

6dBm

Bluetooth

- 96.2 dBm

2Mbps

ADC, I²C, I²S, PWM, SPI, IrDA, UART, USART

3.6mA ~ 4.5mA

4.1mA ~ 8.5mA

4 x 16 bit, 1 x 32 bit

2FSK, DSSS, GFSK, GMSK, MSK, OQPSK

26

Flame Retardant Coating, Moisture Resistant, Safety

RF System on a Chip - SoC

0.85 mm

--

5 mm

5 mm