The category is 'RF Transceiver ICs'
RF Transceiver ICs (26)
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Axial
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mount | Mounting Type | Package / Case | Number of Pins | Supplier Device Package | Dielectric Material | Base Product Number | Brand | Data RAM Size | Data RAM Type | Factory Pack QuantityFactory Pack Quantity | Interface Type | Lead Free Status / RoHS Status | Manufacturer | Maximum Clock Frequency | Maximum Data Rate | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting | Mounting Styles | MSL | Number of I/Os | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temperature (Max.) | Operating Temperature (Min.) | Package | Package Type | Product Status | Qualification | Rad Hardened | RoHS | Supply Current Receiving | Supply Current Transmitting | Supply Voltage-Max | Supply Voltage-Min | Unit Weight | Voltage Rating AC | Voltage Rating DC | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | Temperature Coefficient | Type | Resistance | Max Operating Temperature | Min Operating Temperature | Composition | Applications | Power (Watts) | Capacitance | Subcategory | Technology | Voltage - Supply | Frequency | Pin Count | Operating Frequency | Operating Supply Voltage | Failure Rate | Lead Spacing | Interface | Memory Size | RAM Size | Max Supply Current | Program Memory Type | Program Memory Size | Output Power | Data Rate | Data Bus Width | Product Type | Protocol | Power - Output | RF Family/Standard | Sensitivity | Data Rate (Max) | Number of ADC Channels | Serial Interfaces | Current - Receiving | Current - Transmitting | Number of Timers | Modulation | Sensitivity (dBm) | Number of GPIO | GPIO | Features | Product Category | Device Core | Height | Height Seated (Max) | Length | Width | Lead Free | Ratings |
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![]() | Mfr Part No SAF3560EL/V1100K | NXP | Datasheet | - | - | Min: 1 Mult: 1 | Axial | Axial | NXP USA Inc. | Tray | Obsolete | -65°C ~ 175°C | Bulk | Military, MIL-R-10509/2, RN65 | 0.180 Dia x 0.562 L (4.57mm x 14.27mm) | ±0.1% | Active | 2 | ±50ppm/°C | 169 Ohms | Metal Film | 0.5W, 1/2W | -- | Flame Retardant Coating, Military, Moisture Resistant, Safety | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CYW20737L | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Axial | Axial | CYW20737 | Infineon Technologies | 60 kB | RAM | 1300 | I2C, SPI, UART | Infineon | 24 MHz | + 85 C | Infineon Technologies | - 40 C | SMD/SMT | 14 I/O | Tray | Active | Details | 1.2 V | 1.2 V | -65°C ~ 175°C | Tape & Reel (TR) | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±0.1% | Active | 2 | ±25ppm/°C | TxRx + MCU | 17.8 kOhms | Metal Film | 0.125W, 1/8W | Wireless & RF Integrated Circuits | Si | 3.8V | 2.4GHz | 2.402 GHz to 2.48 GHz | 1.2 V | P (0.1%) | 320kB ROM, 60kB RAM | EEPROM | 512 kbit | 2 dBm | 32 bit | RF Microcontrollers - MCU | Bluetooth v4.0 | 4dBm | Bluetooth | -94dBm | 1Mbps | 9 Channel | I²C, SPI, UART | 9.8mA | 9.1mA | 4 | GFSK | 14 | Military, Moisture Resistant, Weldable | RF Microcontrollers - MCU | -- | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No DA14683-00000A92 | Renesas | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Axial | Axial | DA14683 | 128 kB | RAM | Serial | 96 MHz | 400 kbps | + 85 C | Renesas Design Germany GmbH | - 40 C | SMD/SMT | 37 I/O | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Active | 3.1 mA | 3.4 mA | 4.75 V | 1.7 V | -65°C ~ 175°C | Bulk | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±0.1% | Active | 2 | ±25ppm/°C | TxRx + MCU | 2 kOhms | Metal Film | 0.125W, 1/8W | Wireless & RF Integrated Circuits | Si | 1.9V ~ 3.6V | 2.4GHz | 2.4 GHz | R (0.01%) | - | OTP | 64 kB, 128 kB | 0 dBm | 32 bit | RF System on a Chip - SoC | Bluetooth v5.0 | 0dBm | Bluetooth | -94dBm | - | 8 Channel | GPIO, I²S, SPI, UART, USB | 3.1mA | 3.4mA | - | 21 | Military, Moisture Resistant, Weldable | -- | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No DA14586-00F02AT2 | Renesas | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Axial | Axial | DA14586 | 96 kB | SRAM | I2C, SPI, UART | 16 MHz | 1 Mbps | + 85 C | Renesas Design Germany GmbH | - 40 C | SMD/SMT | MSL 3 - 168 hours | 24 I/O | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Active | - | 3.7 mA | 3.4 mA | 3.6 V | 1.7 V | -65°C ~ 175°C | Bulk | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±0.1% | Active | 2 | ±25ppm/°C | TxRx + MCU | 29.4 kOhms | Metal Film | 0.125W, 1/8W | Wireless & RF Integrated Circuits | Si | 3.3V | 2.4GHz | 2.4 GHz | R (0.01%) | I2C, I2S, SPI, UART | 2Mb Flash, 64kB OTP, 128kB ROM, 96kB SRAM | Flash, OTP, ROM | 2MB | 0 dBm | 32bit | RF System on a Chip - SoC | Bluetooth v5.0 | 0dBm | Bluetooth | -93dBm | - | 4 Channel | I²C, SPI, UART | 3.7mA | 3.4mA | - | 24 | Military, Moisture Resistant, Weldable | ARM Cortex-M0 | 0.9 mm | -- | 5 mm | 5 mm | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No DA14580-01AT2 | Renesas | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | Axial | Axial | DA14580 | 42 kB | SRAM | I2C, SPI, UART | 16 MHz | + 85 C | Renesas Design Germany GmbH | - 40 C | SMD/SMT | MSL 3 - 168 hours | 24 I/O | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Not For New Designs | - | Compliant | 3.7 mA | 3.4 mA | 3.3 V | 2.35 V | -65°C ~ 175°C | Bulk | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±0.1% | Active | 2 | ±25ppm/°C | TxRx + MCU | 3.09 kOhms | 85 °C | -40 °C | Metal Film | 0.125W, 1/8W | Wireless & RF Integrated Circuits | Si | 2.35V ~ 3.3V | 2.4GHz | 2.4 GHz | 3.3 V | S (0.001%) | I2C, SPI, UART | 32kB OTP, 84kB ROM, 50kB SRAM | 42 kB | 3.7 mA | 32KB | 0 dBm | 32bit | RF System on a Chip - SoC | Bluetooth v4.1 | -1dBm | Bluetooth | -93dBm | - | 4 Channel | I²C, SPI, UART | 3.7mA | 3.4mA | 2 Timer | - | -93 dBm | 24 | 24 | Military, Moisture Resistant, Weldable | ARM Cortex-M0 | 0.9 mm | -- | 5 mm | 5 mm | Lead Free | ||||||||||||||||||||||||||||||
![]() | Mfr Part No DA14681-01000U22 | Renesas | Datasheet | 12 |
| Min: 1 Mult: 1 | Surface Mount | Axial | Axial | DA14681 | 128 kB | SRAM | I2C, SPI, UART, USB | 96 MHz | 400 kbps | + 85 C | Renesas Design Germany GmbH | - 40 C | SMD/SMT | 21 I/O | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Not For New Designs | 3.1 mA | 3.4 mA | 4.75 V | 1.7 V | -65°C ~ 175°C | Bulk | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±0.1% | Active | 2 | ±25ppm/°C | TxRx + MCU | 305 Ohms | Metal Film | 0.125W, 1/8W | Wireless & RF Integrated Circuits | Si | 1.7V ~ 4.5V | 2.4GHz | 2.4 GHz | S (0.001%) | 64kB OTP, 128kB ROM, 144kB SRAM | OTP | 64 kB, 128 kB | 0 dBm | 32 bit | RF System on a Chip - SoC | Bluetooth v4.2 | 0dBm | Bluetooth | -94dBm | - | 8 Channel | I²C, I²S, PCM, SPI, UART, USB | - | - | 3 Timer | - | Military, Moisture Resistant, Weldable | 0.5 mm | -- | 3.406 mm | 3.01 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No DA14580-01UNA | Renesas | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | Axial | 34 | Axial | DA14580 | 42 kB | SRAM | I2C, SPI, UART | 16 MHz | + 85 C | Renesas Design Germany GmbH | - 40 C | SMD/SMT | 14 I/O | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Not For New Designs | Compliant | 3.7 mA | 3.4 mA | 3.3 V | 2.35 V | -65°C ~ 175°C | Bulk | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±0.1% | Active | 2 | ±25ppm/°C | TxRx + MCU | 301 Ohms | 85 °C | -40 °C | Metal Film | 0.125W, 1/8W | Wireless & RF Integrated Circuits | Si | 2.35V ~ 3.3V | 2.4GHz | 2.4 GHz | 3.3 V | S (0.001%) | I2C, SPI, UART | 32kB OTP, 84kB ROM, 50kB SRAM | 50 kB | 3.7 mA | 32 kB, 84 kB | 0 dBm | 32 bit | RF System on a Chip - SoC | Bluetooth v4.1 | -1dBm | Bluetooth | -93dBm | - | 4 Channel | I²C, SPI, UART | 3.7mA | 3.4mA | 2 Timer | - | -93 dBm | 14 | 14 | Military, Moisture Resistant, Weldable | 0.511 mm | -- | 2.436 mm | 2.436 mm | Lead Free | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No CC3220SF12RGKT | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Axial | Axial | RNC55 | Vishay Dale | Tape & Reel (TR) | Active | -65°C ~ 175°C | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±0.1% | 2 | ±25ppm/°C | TxRx + MCU | 2.49 kOhms | Metal Film | 0.125W, 1/8W | 2.1V ~ 3.6V | 2.4GHz | R (0.01%) | 1MB Flash, 256kB RAM | 802.11b/g/n | 18.3dBm | WiFi | -96dBm | 16Mbps | I²C, I²S, JTAG, SPI, UART | CCK, DSSS, OFDM | 27 | Military, Moisture Resistant, Weldable | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EFR32BG22C222F352GM40-C | Silicon Labs | Datasheet | 6 |
| Min: 1 Mult: 1 | Surface Mount | Axial | Axial | EFR32BG22C222 | Silicon Labs | 32 kB | RAM | 490 | EUART, I2C, PDM, USART | Silicon Laboratories | 76.8 MHz | 2 Mbps | + 85 C | Silicon Labs | - 40 C | Yes | SMD/SMT | MSL 2 - 1 year | 26 I/O | Tray | Active | - | Details | 3.6 mA | 8.2 mA | 3.8 V | 1.71 V | -55°C ~ 175°C | Bulk | CMF | 0.090 Dia x 0.240 L (2.29mm x 6.10mm) | ±1% | Active | 2 | ±50ppm/°C | Bluetooth | 274 kOhms | Metal Film | 0.5W, 1/2W | Wireless & RF Integrated Circuits | Si | 1.71V ~ 3.8V | 2.4GHz ~ 2.4835GHz | 2.4 GHz | -- | EUART, I2C, I2S, PDM, SMBus, SPI, UART | 352kB Flash, 32kB RAM | Flash | 352KB | 6 dBm | 32bit | RF System on a Chip - SoC | Bluetooth v5.2 | 6dBm | Bluetooth | - 96.2 dBm | 2Mbps | ADC, I²C, I²S, PWM, SPI, IrDA, UART, USART | 3.6mA ~ 4.5mA | 4.1mA ~ 8.5mA | 4 x 16 bit, 1 x 32 bit | 2FSK, DSSS, GFSK, GMSK, MSK, OQPSK | 26 | Flame Retardant Coating, Moisture Resistant, Safety | RF System on a Chip - SoC | ARM Cortex-M33F | 0.85 mm | -- | 5 mm | 5 mm | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No EFR32BG22C222F352GN32-C | Silicon Labs | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Axial | Axial | EFR32BG22C222 | Silicon Labs | 32 kB | RAM | 490 | EUART, I2C, PDM, USART | Silicon Laboratories | 76.8 MHz | 2 Mbps | + 85 C | Silicon Labs | - 40 C | Yes | SMD/SMT | MSL 2 - 1 year | 18 I/O | Tray | Active | - | Details | 3.6 mA | 8.2 mA | 3.8 V | 1.71 V | -55°C ~ 175°C | Bulk | CMF | 0.090 Dia x 0.240 L (2.29mm x 6.10mm) | ±0.1% | Active | 2 | ±50ppm/°C | Bluetooth | 221 Ohms | Metal Film | 0.5W, 1/2W | Wireless & RF Integrated Circuits | Si | 1.71V ~ 3.8V | 2.4GHz ~ 2.4835GHz | 2.4 GHz | -- | EUART, I2C, I2S, PDM, SMBus, SPI, UART | 352kB Flash, 32kB RAM | Flash | 352KB | 6 dBm | 32bit | RF System on a Chip - SoC | Bluetooth v5.2 | 6dBm | Bluetooth | - 96.2 dBm | 2Mbps | ADC, I²C, I²S, PWM, SPI, IrDA, UART, USART | 3.6mA ~ 4.5mA | 4.1mA ~ 8.5mA | 4 x 16 bit, 1 x 32 bit | 2FSK, DSSS, GFSK, GMSK, MSK, OQPSK | 18 | Flame Retardant Coating, Moisture Resistant, Safety | RF System on a Chip - SoC | ARM Cortex-M33F | 0.3 mm | -- | 4 mm | 4 mm | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No EFR32FG22C121F512GM32-CR | Silicon Labs | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Axial | Axial | EFR32FG22C121 | Silicon Labs | 32 kB | RAM | 2500 | Silicon Laboratories | 38.4 MHz | + 85 C | Silicon Labs | - 40 C | Yes | SMD/SMT | 18 I/O | Tape & Reel (TR) | Active | Details | -55°C ~ 175°C | Bulk | CMF | 0.090 Dia x 0.240 L (2.29mm x 6.10mm) | ±1% | Active | 2 | ±50ppm/°C | Bluetooth | 226 kOhms | Metal Film | 0.5W, 1/2W | Wireless & RF Integrated Circuits | Si | 1.71V ~ 3.8V | 2.4GHz ~ 2.4835GHz | 2.4 GHz | -- | 512kB Flash, 32kB RAM | Flash | 512 kB | 6 dBm | 32 bit | RF System on a Chip - SoC | - | 6dBm | WiFi | -102.3dBm | 2Mbps | I²C, I²S, SPI, IrDA, PDM, UART, USART | 3.6mA ~ 4.6mA | 4.1mA ~ 8.5mA | 2-FSK, 2-GFSK, DSSS, GFSK, GMSK, MSK, O-QPSK | 18 | Flame Retardant Coating, Moisture Resistant, Safety | RF System on a Chip - SoC | -- | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EFR32BG22C222F352GM32-CR | Silicon Labs | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Axial | Axial | EFR32BG22C222 | Silicon Labs | 32 kB | RAM | 2500 | EUART, I2C, PDM, USART | Silicon Laboratories | 76.8 MHz | 2 Mbps | + 85 C | Silicon Labs | - 40 C | Yes | Surface Mount | SMD/SMT | 18 I/O | 3.8(V) | 1.71(V) | 3(V) | 85C | -40C | Tape & Reel (TR) | QFN EP | Active | No | Details | 4.4 mA, 4.5 mA | 8.5 mA | 3.8 V | 1.71 V | -55°C ~ 175°C | Bulk | CMF | 0.090 Dia x 0.240 L (2.29mm x 6.10mm) | ±1% | Active | 2 | ±50ppm/°C | Bluetooth | 392 Ohms | Metal Film | 0.5W, 1/2W | Wireless & RF Integrated Circuits | Si | 1.71V ~ 3.8V | 2.4GHz ~ 2.4835GHz | 32 | 2.4 GHz | -- | 512kB Flash, 32kB RAM | Flash | 352 kB | 6 dBm | 32 bit | RF System on a Chip - SoC | Bluetooth v5.2 | 6dBm | Bluetooth | - 96.2 dBm, - 98.9 dBm, - 106.7 dBm | 2000(kbps) | ADC, I²C, I²S, PWM, SPI, IrDA, UART, USART | 3.6mA ~ 4.5mA | 4.1mA ~ 8.5mA | 4 x 16 bit, 1 x 32 bit | 2FSK, DSSS, GFSK, GMSK, MSK, OQPSK | 18 | Flame Retardant Coating, Moisture Resistant, Safety | RF System on a Chip - SoC | 0.85 mm | -- | 4 mm | 4 mm | ||||||||||||||||||||||||||||
![]() | Mfr Part No EFR32BG22C224F512GM40-C | Silicon Labs | Datasheet | 24 | - | Min: 1 Mult: 1 | Surface Mount | Axial | Axial | EFR32BG22C224 | Silicon Labs | 32 kB | RAM | 490 | EUART, I2C, PDM, USART | Silicon Laboratories | 76.8 MHz | 2 Mbps | + 85 C | Silicon Labs | - 40 C | Yes | SMD/SMT | MSL 2 - 1 year | 26 I/O | Tray | Active | - | Details | 3.6 mA | 8.2 mA | 3.8 V | 1.71 V | -55°C ~ 175°C | Tape & Reel (TR) | CMF | 0.180 Dia x 0.562 L (4.57mm x 14.27mm) | ±0.1% | Active | 2 | ±25ppm/°C | Bluetooth | 30.51 kOhms | Metal Film | 1.5W | Wireless & RF Integrated Circuits | Si | 1.71V ~ 3.8V | 2.4GHz ~ 2.4835GHz | 2.4 GHz | -- | EUART, I2C, I2S, PDM, SMBus, SPI, UART | 512kB Flash, 32kB RAM | Flash | 512KB | 6 dBm | 32bit | RF System on a Chip - SoC | Bluetooth v5.2 | 6dBm | Bluetooth | - 96.2 dBm | 2Mbps | ADC, I²C, I²S, PWM, SPI, IrDA, UART, USART | 3.6mA ~ 4.5mA | 4.1mA ~ 8.5mA | 4 x 16 bit, 1 x 32 bit | 2FSK, DSSS, GFSK, GMSK, MSK, OQPSK | 26 | Flame Retardant Coating, Moisture Resistant, Safety | RF System on a Chip - SoC | ARM Cortex-M33F | 0.85 mm | -- | 5 mm | 5 mm | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No BC6130A04IQQBR | CSR | Datasheet | - | - | Min: 1 Mult: 1 | Axial | Axial | RNC55 | Vishay Dale | Tape & Reel (TR) | Active | -65°C ~ 175°C | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±1% | 2 | ±50ppm/°C | 27.4 kOhms | Metal Film | 0.125W, 1/8W | S (0.001%) | Military, Moisture Resistant, Weldable | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CYW20732ST | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Axial | 48-LGA (6.5x6.5) | Polypropylene (PP), Metallized | -- | Infineon Technologies | Tape & Reel (TR) | Obsolete | 250V | 630V | -55°C ~ 100°C | Tape & Reel (TR) | MKP1839 | 0.217 Dia x 0.433 L (5.50mm x 11.00mm) | ±2.5% | Active | -- | PC Pins | TxRx + MCU | DC Link, DC Filtering; High Pulse, DV/DT | 75pF | 1.4V ~ 3.6V | 2.4GHz | -- | - | Bluetooth v4.0 | - | Bluetooth | - | - | I²C, SPI, UART | - | - | - | 14 | -- | -- | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No DA14585-00000VV2 | Renesas | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Axial | Axial | DA14585 | 96 kB | SRAM | I2C, SPI, UART | 16 MHz | 1 Mbps | + 85 C | Renesas Design Germany GmbH | - 40 C | SMD/SMT | MSL 1 - Unlimited | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Active | - | 3.7 mA | 3.4 mA | 3.6 V | 900 mV | -65°C ~ 175°C | Bulk | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±0.1% | Active | 2 | ±25ppm/°C | TxRx + MCU | 298 kOhms | Metal Film | 0.125W, 1/8W | Wireless & RF Integrated Circuits | Si | 3.3V | 2.4GHz | 2.4 GHz | S (0.001%) | I2C, I2S, SPI, UART | 64kB OTP, 128kB ROM, 96kB SRAM | OTP, ROM | 64KB | 0 dBm | 32bit | RF System on a Chip - SoC | Bluetooth v5.0 | 0dBm | Bluetooth | -93dBm | - | 4 Channel | I²C, SPI, UART | 3.7mA | 3.4mA | - | 14 | Military, Moisture Resistant, Weldable | ARM Cortex-M0 | 0.39 mm | -- | 2.66 mm | 2.4 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No DA14680-01F08A92 | Renesas | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Axial | Axial | DA14680 | 128 kB | SRAM | I2C, SPI, UART, USB | 96 MHz | 400 kbps | + 85 C | Renesas Design Germany GmbH | - 40 C | SMD/SMT | 31 I/O | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Not For New Designs | 3.1 mA | 3.4 mA | 4.75 V | 1.7 V | -65°C ~ 175°C | Bulk | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±0.1% | Active | 2 | ±25ppm/°C | TxRx + MCU | 294 kOhms | Metal Film | 0.125W, 1/8W | Wireless & RF Integrated Circuits | Si | 1.7V ~ 4.5V | 2.4GHz | 2.4 GHz | S (0.001%) | 8Mb Flash, 64kB OTP, 128kB ROM, 144kB SRAM | Flash | 64 kB, 128 kB, 8 MB | 0 dBm | 32 bit | RF System on a Chip - SoC | Bluetooth v4.2 | 0dBm | Bluetooth | -94dBm | - | 8 Channel | I²C, I²S, PCM, SPI, UART, USB | - | - | 3 Timer | - | Military, Moisture Resistant, Weldable | 0.9 mm | -- | 6 mm | 6 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MAX7031LATJ T | Analog Devices | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Axial | 32 | Axial | MAX703 | Analog Devices Inc./Maxim Integrated | Tape & Reel (TR) | Obsolete | Compliant | -55°C ~ 150°C | Tape & Reel (TR) | RNX | 0.140 Dia x 0.290 L (3.56mm x 7.37mm) | ±1% | Active | 2 | ±100ppm/°C | TxRx Only | 5 MOhms | 125 °C | -40 °C | Metal Oxide Film | 0.5W, 1/2W | 2.1V ~ 3.6V, 4.5V ~ 5.5V | 308MHz | -- | - | 66 kbps | - | 13.1dBm | General ISM < 1GHz | -110dBm | 66kbps | - | 6.4mA ~ 6.8mA | 11.6mA | FSK | -110 dBm | Flame Retardant Coating, High Voltage, Safety | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC13214 | Freescale | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Axial | Axial | Freescale Semiconductor | Tray | Obsolete | -65°C ~ 175°C | Bulk | Military, MIL-R-10509/8, RN50 | 0.065 Dia x 0.150 L (1.65mm x 3.81mm) | ±1% | Active | 2 | ±50ppm/°C | TxRx + MCU | 44.2 kOhms | Metal Film | 0.05W, 1/20W | 2V ~ 3.4V | 2.4GHz | -- | 60kB Flash, 4kB RAM | Zigbee® | 0dBm | 802.15.4 | -92dBm | 250kbps | I²C, SPI | 37mA | 30mA | O-QPSK | 38 | Flame Retardant Coating, Military, Moisture Resistant, Safety | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EFR32BG22C224F512IM40-CR | Silicon Labs | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Axial | Axial | EFR32BG22C224 | Silicon Labs | 32 kB | RAM | 2500 | EUART, I2C, PDM, USART | Silicon Laboratories | 76.8 MHz | 2 Mbps | + 125 C | Silicon Labs | - 40 C | Yes | SMD/SMT | 26 I/O | Tape & Reel (TR) | Active | Details | 3.6 mA | 8.2 mA | 3.8 V | 1.71 V | 0.082453 oz | -55°C ~ 175°C | Bulk | CMF | 0.090 Dia x 0.240 L (2.29mm x 6.10mm) | ±1% | Active | 2 | ±50ppm/°C | Bluetooth | 287 Ohms | Metal Film | 0.5W, 1/2W | Wireless & RF Integrated Circuits | Si | 1.71V ~ 3.8V | 2.4GHz ~ 2.4835GHz | 2.4 GHz | -- | 512kB Flash, 32kB RAM | Flash | 512 kB | 6 dBm | 32 bit | RF System on a Chip - SoC | Bluetooth v5.2 | 6dBm | Bluetooth | - 96.2 dBm | 2Mbps | ADC, I²C, I²S, PWM, SPI, IrDA, UART, USART | 3.6mA ~ 4.5mA | 4.1mA ~ 8.5mA | 4 x 16 bit, 1 x 32 bit | 2FSK, DSSS, GFSK, GMSK, MSK, OQPSK | 26 | Flame Retardant Coating, Moisture Resistant, Safety | RF System on a Chip - SoC | 0.85 mm | -- | 5 mm | 5 mm |
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