The category is 'Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Access Time-Max | Base Product Number | Clock Frequency-Max | Data RAM Size | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Supply Voltage-Nom (Vsup) | Typical Operating Supply Voltage | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Part Status | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | Operating Mode | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Memory Width | Programmable Logic Type | Number of Logic Elements/Cells | Regulator Type | Memory Density | Total RAM Bits | Number of Gates | Max Frequency | Parallel/Serial | Memory IC Type | Speed Grade | Number of Transceivers | Primary Attributes | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Height | Length | Width | Radiation Hardening |
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 | Mfr Part No XC4003A-5VQ100C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 133.3 MHz | XILINX INC | XC4003A-5VQ100C | 3 | 85 °C | PLASTIC/EPOXY | LFQFP | LFQFP, TQFP100,.63SQ | TQFP100,.63SQ | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | 5.83 | No | 5.25 V | 4.75 V | 5 V | 360 FLIP-FLOPS; TYP. GATES = 2500-3000 | QUAD | GULL WING | 0.5 mm | unknown | 100 | S-PQFP-G100 | 77 | Not Qualified | 5 V | OTHER | 77 | 100 CLBS, 2500 GATES | 1.27 mm | FIELD PROGRAMMABLE GATE ARRAY | 4.5 ns | 100 | 238 | 2500 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC4013-5MQ208C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | XILINX INC | XC4013-5MQ208C | 85 °C | METAL | FQFP | FQFP, | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | 8.36 | 5.25 V | 4.75 V | 5 V | 3A991 | 1536 FLIP-FLOPS; TYP. GATES = 10000-13000 | 8542.39.00.01 | QUAD | GULL WING | 0.5 mm | unknown | 208 | S-MQFP-G208 | Not Qualified | OTHER | 576 CLBS, 10000 GATES | 3.68 mm | FIELD PROGRAMMABLE GATE ARRAY | 4.5 ns | 576 | 10000 | 27.64 mm | 27.64 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC18V256VQG44I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 15 ns | XILINX INC | XC18V256VQG44I | 3 | 32768 words | 32000 | 85 °C | -40 °C | PLASTIC/EPOXY | TQFP | TQFP, | SQUARE | FLATPACK, THIN PROFILE | Obsolete | QFP | 30 | 5.84 | Yes | 3.3 V | e3 | Yes | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | QUAD | GULL WING | 260 | 1 | 0.8 mm | compliant | 44 | S-PQFP-G44 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | 32KX8 | 1.2 mm | 8 | 262144 bit | PARALLEL/SERIAL | CONFIGURATION MEMORY | 10 mm | 10 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC5202-6VQG64C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 83 MHz | XILINX INC | XC5202-6VQG64C | 3 | 85 °C | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | QFP | 40 | 5.8 | Yes | 5.25 V | 4.75 V | 5 V | e3 | Yes | 3A001.A.7 | Matte Tin (Sn) | MAX AVAILABLE 3000 LOGIC GATES | 8542.39.00.01 | QUAD | GULL WING | 260 | 0.5 mm | compliant | 64 | S-PQFP-G64 | Not Qualified | OTHER | 64 CLBS, 2000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 5.6 ns | 64 | 2000 | 10 mm | 10 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC3142A-2PC84C | Xilinx | Datasheet | 29 | - | Min: 1 Mult: 1 | YES | 84 | 323 MHz | XILINX INC | XC3142A-2PC84C | 3 | 85 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-84 | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | 30 | 5.8 | No | 5.25 V | 4.75 V | 5 V | e0 | No | Tin/Lead (Sn85Pb15) | MAX USABLE 3000 LOGIC GATES | 8542.39.00.01 | QUAD | J BEND | 225 | 1.27 mm | unknown | 84 | S-PQCC-J84 | 74 | Not Qualified | 5 V | OTHER | 74 | 144 CLBS, 2000 GATES | 5.08 mm | FIELD PROGRAMMABLE GATE ARRAY | 2.2 ns | 144 | 144 | 2000 | 29.3116 mm | 29.3116 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC5215-6BG225I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 225 | 83 MHz | XILINX INC | XC5215-6BG225I | 3 | PLASTIC/EPOXY | BGA | PLASTIC, BGA-225 | BGA225,15X15 | SQUARE | GRID ARRAY | Obsolete | BGA | 30 | 5.8 | Non-Compliant | No | 5.5 V | 4.5 V | 5 V | e0 | No | Tin/Lead (Sn63Pb37) | MAX AVAILABLE 23000 LOGIC GATES | 8542.39.00.01 | BOTTOM | BALL | 225 | 1.5 mm | not_compliant | 225 | S-PBGA-B225 | 244 | Not Qualified | 5 V | 244 | 484 CLBS, 15000 GATES | 2.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 5.6 ns | 484 | 484 | 15000 | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC4003A-6PC84I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 84 | 90.9 MHz | XILINX INC | XC4003A-6PC84I | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-84 | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | 5.83 | No | 5.5 V | 4.5 V | 5 V | e0 | Tin/Lead (Sn85Pb15) | 360 FLIP-FLOPS; TYP. GATES = 2500-3000 | QUAD | J BEND | 1.27 mm | unknown | 84 | S-PQCC-J84 | 61 | Not Qualified | 5 V | INDUSTRIAL | 61 | 100 CLBS, 2500 GATES | 5.08 mm | FIELD PROGRAMMABLE GATE ARRAY | 6 ns | 100 | 238 | 2500 | 29.3116 mm | 29.3116 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC2VP4-7FG256I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 1350 MHz | XILINX INC | XC2VP4-7FG256I | 3 | PLASTIC/EPOXY | BGA | 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Obsolete | BGA | 30 | 5.84 | No | 1.575 V | 1.425 V | 1.5 V | e0 | No | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1 mm | not_compliant | 256 | S-PBGA-B256 | 140 | Not Qualified | 1.5,1.5/3.3,2/2.5,2.5 V | 140 | 752 CLBS | 2 mm | FIELD PROGRAMMABLE GATE ARRAY | 0.28 ns | 752 | 6768 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC5206-5PQ160I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 160 | 160 | 83 MHz | XILINX INC | XC5206-5PQ160I | 3 | PLASTIC/EPOXY | QFP | QFP, QFP160,1.2SQ | QFP160,1.2SQ | SQUARE | FLATPACK | Obsolete | QFP | 30 | 5.79 | Compliant | No | 5.5 V | 4.5 V | 5 V | e0 | No | Tin/Lead (Sn85Pb15) | 100 °C | -40 °C | MAX AVAILABLE 10000 LOGIC GATES | 8542.39.00.01 | QUAD | GULL WING | 225 | 0.65 mm | not_compliant | 160 | S-PQFP-G160 | 133 | Not Qualified | 5 V | 5 V | 133 | 196 CLBS, 6000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 5 | 784 | 4.6 ns | 196 | 784 | 6000 | 28 mm | 28 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC6202P402PR | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | TOREX SEMICONDUCTOR LTD | XC6202P402PR | 1 | , | Not Recommended | NOT SPECIFIED | 5.69 | Yes | NOT SPECIFIED | compliant | FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU25DR-2FFVE1156E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1156 | XILINX INC | XCZU25DR-2FFVE1156E | 4 | 100 °C | PLASTIC/EPOXY | BGA | FCBGA-1156 | RECTANGULAR | GRID ARRAY | Active | NOT SPECIFIED | 5.62 | Yes | 0.876 V | 0.825 V | 0.85 V | Tray | * | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | compliant | R-PBGA-B1156 | OTHER | MICROPROCESSOR CIRCUIT | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XQ6VLX240T-1RF784I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | 1098 MHz | XILINX INC | XQ6VLX240T-1RF784I | PLASTIC/EPOXY | BGA | BGA784,28X28,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 5.26 | No | 1 V | e0 | 3A991.D | TIN LEAD | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B784 | 400 | Not Qualified | 1 V | 400 | FIELD PROGRAMMABLE GATE ARRAY | 241000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC4VLX100-11FFG1148CS2 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1148 | 1205 MHz | XILINX INC | XC4VLX100-11FFG1148CS2 | 4 | PLASTIC/EPOXY | BGA | BGA, BGA1148,34X34,40 | BGA1148,34X34,40 | SQUARE | GRID ARRAY | Obsolete | 30 | 5.84 | Yes | e1 | Yes | 3A001.A.7.A | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1 mm | not_compliant | S-PBGA-B1148 | 768 | Not Qualified | 1.2,1.2/3.3,2.5 V | 768 | FIELD PROGRAMMABLE GATE ARRAY | 110592 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-1FGG896I | Microchip | Datasheet | 1626 |
| Min: 1 Mult: 1 | 896-BGA | YES | 896-FBGA (31x31) | 896 | M2S050 | 64 kB | MICROSEMI CORP | - | - | M2S050T-1FGG896I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | SMD/SMT | 377 | 56340 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 1.54 | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | 896 | S-PBGA-B896 | 377 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 377 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL060T-FGG484 | Microchip | Datasheet | 2092 |
| Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2GL060 | MICROSEMI CORP | M2GL060T-FGG484 | + 85 C | Microchip Technology | 0 C | 3 | SMD/SMT | 267 | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | 1.2 V | OTHER | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56520 | 1869824 | 4 Transceiver | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150-1FCG1152 | Microchip | Datasheet | 1808 | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2S150 | 64 kB | MICROSEMI CORP | - | - | M2S150-1FCG1152 | 166 MHz | Microchip Technology | 4 | SMD/SMT | 574 | 146124 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.77 | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010TS-VFG256 | Microchip | Datasheet | 77 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | M2S010 | 64 kB | MICROSEMI CORP | - | - | M2S010TS-VFG256 | 166 MHz | Microchip Technology | 3 | 138 | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA256,16X16,32 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.8 | Non-Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B256 | 138 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-1FGG484 | Microchip | Datasheet | 2362 | - | Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S050 | 64 kB | MICROSEMI CORP | - | - | M2S050-1FGG484 | 166 MHz | Microchip Technology | 3 | SMD/SMT | 267 | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.76 | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AGLE3000V2-FG896 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 2 months ago) | Surface Mount | YES | 896 | 400.011771 mg | 896 | MICROSEMI CORP | M1AGLE3000V2-FG896 | 3 | 620 | 70 °C | PLASTIC/EPOXY | BGA | FBGA-896 | SQUARE | GRID ARRAY | Obsolete | 20 | 5.88 | Compliant | No | 1.575 V | 1.425 V | 1.5 V | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B896 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.14 V | 63 kB | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 75264 | 3e+06 | 892.86 MHz | 75264 | 75264 | 3000000 | 1.73 mm | 29 mm | 29 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P600L-1FG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 350 MHz | MICROSEMI CORP | M1A3P600L-1FG256I | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Obsolete | 30 | 5.26 | No | 1.575 V | 1.14 V | 1.2 V | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 177 | Not Qualified | 1.5/3.3 V | INDUSTRIAL | 177 | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 13824 | 600000 | 17 mm | 17 mm |
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XC4003A-5VQ100C
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XC4013-5MQ208C
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XC18V256VQG44I
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XC5202-6VQG64C
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XC3142A-2PC84C
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XC5215-6BG225I
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XC4003A-6PC84I
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XC2VP4-7FG256I
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XC5206-5PQ160I
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XC6202P402PR
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XCZU25DR-2FFVE1156E
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XQ6VLX240T-1RF784I
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XC4VLX100-11FFG1148CS2
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2S050T-1FGG896I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
305.077024
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M2GL060T-FGG484
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
189.257601
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M2S150-1FCG1152
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2S010TS-VFG256
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
76.176441
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M2S050-1FGG484
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M1AGLE3000V2-FG896
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M1A3P600L-1FG256I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire