The category is 'Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | Core Processor | Peripherals | Propagation Delay | Connectivity | Turn On Delay Time | Data Rate | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Core Architecture | Total RAM Bits | Number of Gates | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Primary Attributes | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Flash Size | Product Category | Height | Length | Width | Radiation Hardening |
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 | Mfr Part No AX2000-1FGG1152I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | YES | 1152 | 400.011771 mg | 1152 | 763 MHz | MICROSEMI CORP | AX2000-1FGG1152I | 3 | 684 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | 40 | 5.29 | Compliant | Yes | 1.575 V | 1.425 V | 1.5 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 763 MHz | S-PBGA-B1152 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 36 kB | 850 ps | 850 ps | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 2e+06 | 763 MHz | 21504 | 1 | 21504 | 0.84 ns | 21504 | 32256 | 2000000 | 1.73 mm | 35 mm | 35 mm | No | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL600V2-FGG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 484 | 108 MHz | ACTEL CORP | AGL600V2-FGG484I | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Transferred | 40 | 5.77 | Yes | 1.575 V | 1.14 V | 1.2 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | 235 | Not Qualified | 1.2/1.5 V | INDUSTRIAL | 235 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 13824 | 600000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLE600V2-FGG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 484 | 250 MHz | MICROSEMI CORP | AGLE600V2-FGG484 | 3 | 70 °C | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Obsolete | 40 | 8.58 | Yes | 1.575 V | 1.14 V | 1.2 V | e1 | TIN SILVER COPPER | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 270 | Not Qualified | 1.2/1.5 V | COMMERCIAL | 270 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 13824 | 600000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE1500-FGG484I | Microchip | Datasheet | 2031 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA-484 | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE1500 | Microchip Technology / Atmel | 350 MHz | 60 | MICROSEMI CORP | A3PE1500-FGG484I | 350 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 280 | 16000 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.29 | Compliant | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3PE1500 | e1 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 231 MHz | S-PBGA-B484 | 280 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 33.8 kB | - | 280 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - Field Programmable Gate Array | 276480 | 1.5e+06 | 231 MHz | STD | - | 38400 | 38400 | 38400 | 1500000 | FPGA - Field Programmable Gate Array | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||
| Mfr Part No AGLN060V5-CSG81I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 81-WFBGA, CSBGA | YES | 81-CSP (5x5) | 81 | AGLN060 | MICROSEMI CORP | AGLN060V5-CSG81I | Microchip Technology | 3 | 60 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 2.07 | Yes | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | IGLOO nano | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | S-PBGA-B81 | Not Qualified | INDUSTRIAL | 1536 CLBS, 60000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 18432 | 60000 | STD | 1536 | 60000 | 5 mm | 5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FG256M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | YES | 256 | 256-FPBGA (17x17) | 256 | A2F500 | MICROSEMI CORP | A2F500M3G-FG256M | Microchip Technology | MCU - 25, FPGA - 66 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 5.84 | Non-Compliant | No | 1.575 V | 1.425 V | 1.5 V | -55°C ~ 125°C (TJ) | SmartFusion® | 125 °C | -55 °C | 8542.39.00.01 | BOTTOM | BALL | 1 mm | unknown | 80 MHz | S-PBGA-B256 | 66 | MILITARY | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 11520 CLBS, 500000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 500000 | 512KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLE3000V2-FG896 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 896 | 250 MHz | MICROSEMI CORP | AGLE3000V2-FG896 | 3 | 70 °C | PLASTIC/EPOXY | BGA | 31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Obsolete | 30 | 5.84 | No | 1.575 V | 1.14 V | 1.2 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B896 | 620 | Not Qualified | 1.2/1.5 V | COMMERCIAL | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 75264 | 75264 | 3000000 | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLP030V5-CSG201 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 201-VFBGA, CSBGA | YES | 201-CSP (8x8) | 201 | AGLP030 | 250 MHz | MICROSEMI CORP | AGLP030V5-CSG201 | 1.575 V | Microchip Technology | 1.425 V | 3 | 120 | 70 °C | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, BGA201,15X15,20 | BGA201,15X15,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 0.85 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | 0 to 70 °C | IGLOO PLUS | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | 201 | S-PBGA-B201 | 120 | Not Qualified | 1.5 V | COMMERCIAL | 120 | 792 CLBS, 30000 GATES | 0.99 mm | FIELD PROGRAMMABLE GATE ARRAY | 792 | 30000 | STD | 792 | 792 | 30000 | 8 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLE600V5-FGG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 484 | 250 MHz | ACTEL CORP | AGLE600V5-FGG484 | 3 | 70 °C | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Transferred | 40 | 5.78 | Yes | 1.575 V | 1.425 V | 1.5 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 270 | Not Qualified | 1.5 V | COMMERCIAL | 270 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 13824 | 600000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL400V2-FG144T | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144 | MICROSEMI CORP | AGL400V2-FG144T | 3 | 97 | Active | 20 | 5.82 | Non-Compliant | No | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | 235 | unknown | 6.8 kB | FIELD PROGRAMMABLE GATE ARRAY | 9216 | 400000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL600V5-CSG281 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 281-TFBGA, CSBGA | YES | 281-CSP (10x10) | 281 | AGL600 | 108 MHz | MICROSEMI CORP | AGL600V5-CSG281 | Microchip Technology | 3 | 215 | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 1.46 | Yes | 1.575 V | 1.425 V | 1.5 V | 0°C ~ 70°C (TA) | IGLOO | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | S-PBGA-B281 | Not Qualified | OTHER | 13824 CLBS, 600000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 10 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL125V2-FG144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | AGL125 | 108 MHz | MICROSEMI CORP | AGL125V2-FG144I | Microchip Technology | 3 | 97 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.25 | No | 1.575 V | 1.14 V | 1.2 V | -40°C ~ 85°C (TA) | IGLOO | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B144 | Not Qualified | INDUSTRIAL | 3072 CLBS, 125000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 3072 | 36864 | 125000 | STD | 3072 | 125000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P600-2FG144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | A3P600 | 350 MHz | MICROSEMI CORP | A3P600-2FG144I | Microchip Technology | 3 | 97 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.25 | No | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | ProASIC3 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | INDUSTRIAL | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 2 | 13824 | 600000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX125-FGG324I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 2 months ago) | Surface Mount | YES | 324 | 400.011771 mg | 324 | 649 MHz | MICROSEMI CORP | AX125-FGG324I | 3 | 168 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA324,18X18,40 | BGA324,18X18,40 | SQUARE | GRID ARRAY | Obsolete | 40 | 5.8 | Compliant | Yes | 1.575 V | 1.425 V | 1.5 V | e1 | TIN SILVER COPPER | 85 °C | -40 °C | 125000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 mm | compliant | 649 MHz | S-PBGA-B324 | 168 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 2.3 kB | 990 ps | 990 ps | 168 | 1344 CLBS, 125000 GATES | 1.78 mm | FIELD PROGRAMMABLE GATE ARRAY | 1344 | 125000 | 649 MHz | 1344 | 1344 | 0.99 ns | 1344 | 2016 | 125000 | 1.25 mm | 19 mm | 19 mm | No | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A1280A-1CQ172M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 172 | 172 | 75 MHz | MICROSEMI CORP | A1280A-1CQ172M | 140 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | HGQFF | CERAMIC, CQFP-172 | TPAK172,2.5SQ,25 | SQUARE | FLATPACK, HEAT SINK/SLUG, GUARD RING | Obsolete | NOT SPECIFIED | 8.79 | Non-Compliant | No | 5.5 V | 4.5 V | 5 V | e0 | 3A001.A.2.C | TIN LEAD | 125 °C | -55 °C | MAX 140 I/OS | 8542.39.00.01 | QUAD | FLAT | NOT SPECIFIED | 0.635 mm | compliant | 90 MHz | S-CQFP-F172 | 140 | Not Qualified | 5 V | 5 V | MILITARY | 5.5 V | 4.5 V | 4.3 ns | 4.3 ns | 140 | 1232 CLBS, 8000 GATES | 2.9464 mm | FIELD PROGRAMMABLE GATE ARRAY | 1232 | 8000 | 1232 | 1 | 998 | 4.3 ns | 1232 | 1232 | 8000 | 29.972 mm | 29.972 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A1020B-2PL44I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 54.1 MHz | MICROSEMI CORP | A1020B-2PL44I | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-44 | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | 30 | 5.88 | No | 5.5 V | 4.5 V | 5 V | e0 | Tin/Lead (Sn/Pb) | MAX 34 I/OS | 8542.39.00.01 | QUAD | J BEND | 225 | 1.27 mm | unknown | 44 | S-PQCC-J44 | 69 | Not Qualified | 5 V | INDUSTRIAL | 69 | 547 CLBS, 2000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 3.4 ns | 547 | 547 | 2000 | 16.5862 mm | 16.5862 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A1240A-PQ144M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 144 | 144 | MICROSEMI CORP | A1240A-PQ144M | 3 | 104 | 125 °C | -55 °C | PLASTIC/EPOXY | QFP | QFP, | SQUARE | FLATPACK | Obsolete | 30 | 8.69 | Non-Compliant | No | 8542390000/8542390000/8542390000/8542390000/8542390000 | 5.5 V | 4.5 V | 5 V | e0 | 3A001.A.2.C | TIN LEAD | 125 °C | -55 °C | 8542.39.00.01 | QUAD | GULL WING | 225 | 0.65 mm | compliant | 90 MHz | S-PQFP-G144 | Not Qualified | 5 V | MILITARY | 5.5 V | 4.5 V | 5 ns | 684 CLBS, 4000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 684 | 4000 | 684 | 568 | 684 | 4000 | 28 mm | 28 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A10V20B-PL68C | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 68 | 45 MHz | MICROSEMI CORP | A10V20B-PL68C | 57 | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC68,1.0SQ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | 5.85 | Non-Compliant | No | 3.465 V | 3.135 V | 3.3 V | 70 °C | 0 °C | QUAD | J BEND | 1.27 mm | unknown | 68 | S-PQCC-J68 | 69 | Not Qualified | 3.3 V | 3.3 V | COMMERCIAL | 6.5 ns | 69 | 547 CLBS, 2000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 2000 | 547 | 273 | 4.5 ns | 547 | 547 | 2000 | 24.2316 mm | 24.2316 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A1020B-CQ84M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 84 | 84 | 37 MHz | MICROSEMI CORP | A1020B-CQ84M | 69 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | GQFF | GQFF, TPAK84,1.63SQ,25 | TPAK84,1.63SQ,25 | SQUARE | FLATPACK | Obsolete | 20 | 5.84 | Non-Compliant | No | 5.5 V | 4.5 V | 5 V | e0 | 3A001.A.2.C | TIN LEAD | 125 °C | -55 °C | MAX 69 I/OS | 8542.39.00.01 | QUAD | FLAT | 225 | 0.635 mm | compliant | 48 MHz | S-CQFP-F84 | 69 | Not Qualified | 5 V | 5 V | MILITARY | 5.5 V | 4.5 V | 4.5 ns | 4.5 ns | 69 | 547 CLBS, 2000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 547 | 2000 | 547 | 273 | 5.5 ns | 547 | 547 | 2000 | 16.51 mm | 16.51 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P250-QNG132I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 132 | 132 | 350 MHz | MICROSEMI CORP | A3P250-QNG132I | 2 | 87 | 100 °C | -40 °C | UNSPECIFIED | VBCC | VBCC, | SQUARE | CHIP CARRIER, VERY THIN PROFILE | Obsolete | 30 | 5.24 | Compliant | Yes | 1.575 V | 1.425 V | 1.5 V | 85 °C | -40 °C | 8542.39.00.01 | BOTTOM | BUTT | 260 | 0.5 mm | compliant | S-XBCC-B132 | Not Qualified | 1.5 V | INDUSTRIAL | 4.5 kB | 6144 CLBS, 250000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 250000 | 6144 | 6144 | 250000 | 8 mm | 8 mm | No |
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AX2000-1FGG1152I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AGL600V2-FGG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AGLE600V2-FGG484
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A3PE1500-FGG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AGLN060V5-CSG81I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A2F500M3G-FG256M
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AGLE3000V2-FG896
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AGLP030V5-CSG201
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AGLE600V5-FGG484
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AGL400V2-FG144T
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AGL600V5-CSG281
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AGL125V2-FG144I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A3P600-2FG144I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AX125-FGG324I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A1280A-1CQ172M
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A1020B-2PL44I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A1240A-PQ144M
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A10V20B-PL68C
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A1020B-CQ84M
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A3P250-QNG132I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire