The category is 'Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | RAM Size | Peripherals | Propagation Delay | Turn On Delay Time | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Core Architecture | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Product Category | Height | Length | Width | Radiation Hardening | Lead Free |
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 | Mfr Part No A2F060M3E-FG256M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256 | MICROSEMI CORP | A2F060M3E-FG256M | Obsolete | 5.85 | Non-Compliant | No | 125 °C | -55 °C | 8542.39.00.01 | unknown | 80 MHz | EBI/EMI, I2C, SPI, UART, USART | DMA, POR, WDT | ARM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE3000L-FGG896 | Microchip | Datasheet | 1600 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | A3PE3000 | 250 MHz | MICROSEMI CORP | A3PE3000L-FGG896 | 1.26 V | Microchip Technology | 1.14 V | 3 | 620 | 70 °C | Tray | PLASTIC/EPOXY | BGA | 31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Compliant | Yes | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 70 °C | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 896 | S-PBGA-B896 | 620 | Not Qualified | 1.2 V | 1.2/1.5,1.2/3.3 V | COMMERCIAL | 1.26 V | 1.14 V | 63 kB | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3e+06 | 781.25 MHz | STD | 75264 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | No | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE3000L-FG324 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 324-BGA | YES | 324 | 324-FBGA (19x19) | 400.011771 mg | 324 | A3PE3000 | 250 MHz | MICROSEMI CORP | A3PE3000L-FG324 | Microchip Technology | 3 | 221 | 70 °C | Tray | PLASTIC/EPOXY | BGA | 19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, FBGA-324 | BGA324,18X18,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | Compliant | No | 1.575 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | ProASIC3L | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 70 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B324 | 221 | Not Qualified | 1.2 V | 1.2/1.5,1.2/3.3 V | COMMERCIAL | 1.26 V | 1.14 V | 63 kB | 221 | 75264 CLBS, 3000000 GATES | 1.78 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 781.25 MHz | STD | 75264 | 75264 | 75264 | 3000000 | 1.25 mm | 19 mm | 19 mm | No | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX08-1FG144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | A54SX08 | 280 MHz | MICROSEMI CORP | A54SX08-1FG144I | 3.63, 5.5 V | Microchip Technology | 2.97, 4.5 V | 3 | 111 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | Compliant | No | 3.6 V | 3 V | 3.3 V | 3.3, 5 V | -40 to 85 °C | SX | e0 | TIN LEAD SILVER | 85 °C | -40 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | 3V ~ 3.6V, 4.75V ~ 5.25V | BOTTOM | BALL | 225 | 1 mm | compliant | 280 MHz | S-PBGA-B144 | 111 | Not Qualified | 5 V | 3.3,5 V | INDUSTRIAL | 5.5 V | 4.5 V | 800 ps | 800 ps | 111 | 768 CLBS, 8000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 768 | 12000 | 280 MHz | 768 | 768 | 1 | 256 | 0.8 ns | 768 | 768 | 8000 | 1.05 mm | 13 mm | 13 mm | No | |||||||||||||||||||||||||||||||||
| Mfr Part No A54SX08-2FGG144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | A54SX08 | 320 MHz | MICROSEMI CORP | A54SX08-2FGG144 | 3.63, 5.25 V | Microchip Technology | 2.97, 4.75 V | 3 | 111 | 70 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Compliant | Yes | 3.6 V | 3 V | 3.3 V | 3.3, 5 V | 0 to 70 °C | SX | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | 3V ~ 3.6V, 4.75V ~ 5.25V | BOTTOM | BALL | 260 | 1 mm | compliant | 320 MHz | S-PBGA-B144 | 111 | Not Qualified | 5 V | 3.3,5 V | COMMERCIAL | 5.25 V | 4.75 V | 700 ps | 700 ps | 111 | 768 CLBS, 8000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 768 | 12000 | 320 MHz | 768 | 768 | 2 | 256 | 0.7 ns | 768 | 768 | 8000 | 1.05 mm | 13 mm | 13 mm | No | ||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-2FG256I | Microchip | Datasheet | 1905 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | A3P1000 | Microchip Technology / Atmel | 350 MHz | 90 | MICROSEMI CORP | A3P1000-2FG256I | 350 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P1000 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Programmable Logic ICs | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | - | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - Field Programmable Gate Array | 147456 | 1000000 | 2 | - | 24576 | 1000000 | FPGA - Field Programmable Gate Array | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL400V5-FGG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 484 | MICROSEMI CORP | AGL400V5-FGG484 | 3 | 85 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | 40 | 8.6 | Yes | 1.575 V | 1.425 V | 1.5 V | e1 | TIN SILVER COPPER | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | OTHER | 9216 CLBS, 400000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 9216 | 400000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX2000-FGG1152I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | YES | 1152 | 400.011771 mg | 1152 | 649 MHz | MICROSEMI CORP | AX2000-FGG1152I | 3 | 684 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | 40 | 5.29 | Compliant | Yes | 1.575 V | 1.425 V | 1.5 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 649 MHz | S-PBGA-B1152 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 36 kB | 990 ps | 990 ps | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 2e+06 | 649 MHz | 21504 | 21504 | 0.99 ns | 21504 | 32256 | 2000000 | 1.73 mm | 35 mm | 35 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-FG256I | Microchip | Datasheet | 2052 |
| Min: 1 Mult: 1 | Surface Mount | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | A3P1000 | Microchip Technology / Atmel | 350 MHz | 90 | MICROSEMI CORP | A3P1000-FG256I | 350 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 1.5 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P1000 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Programmable Logic ICs | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | not_compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | - | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - Field Programmable Gate Array | 147456 | 1000000 | STD | - | 24576 | 1000000 | FPGA - Field Programmable Gate Array | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-FG484T | Microchip | Datasheet | 1866 | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | A3P1000 | 350 MHz | MICROSEMI CORP | A3P1000-FG484T | 1.575 V | Microchip Technology | 1.425 V | 300 | 125 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 1 MM PITCH, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 5.23 | No | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | Automotive grade | -40°C ~ 125°C (TA) | Automotive, AEC-Q100, ProASIC3 | 3A001.A.7.A | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | 300 | Not Qualified | 1.5/3.3 V | AUTOMOTIVE | 300 | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | AEC-Q100 | STD | 24576 | 24576 | 1000000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL060V5-CS121 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 121 | 108 MHz | MICROSEMI CORP | AGL060V5-CS121 | 85 °C | PLASTIC/EPOXY | VFBGA | 6 X 6 MM, 0.99 MM HEIGHT, 0.50 MM PITCH, CSP-121 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | NOT SPECIFIED | 5.88 | No | 1.575 V | 1.425 V | 1.5 V | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | unknown | S-PBGA-B121 | Not Qualified | OTHER | 1536 CLBS, 60000 GATES | 0.99 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 60000 | 6 mm | 6 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL400V5-FG144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 144 | MICROSEMI CORP | AGL400V5-FG144 | 3 | 85 °C | PLASTIC/EPOXY | LBGA | 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | 30 | 5.31 | No | 1.575 V | 1.425 V | 1.5 V | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B144 | Not Qualified | OTHER | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 9216 | 400000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AFS1500-1FG676 | Microchip | Datasheet | 1956 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 676-BGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | AFS1500 | MICROSEMI CORP | AFS1500-1FG676 | Microchip Technology | 3 | 252 | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | Compliant | No | 1.575 V | 1.425 V | 1.5 V | 0°C ~ 85°C (TJ) | Fusion® | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B676 | Not Qualified | 1.5 V | OTHER | 1.575 V | 1.425 V | 33.8 kB | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1.5e+06 | 1.28205 GHz | 1 | 38400 | 38400 | 1500000 | 1.73 mm | 25 mm | 25 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX125-FGG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 2 months ago) | Surface Mount | YES | 256 | 400.011771 mg | 256 | 649 MHz | MICROSEMI CORP | AX125-FGG256I | 3 | 138 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | 30 | 5.82 | Compliant | Yes | 1.575 V | 1.425 V | 1.5 V | e1 | TIN SILVER COPPER | 85 °C | -40 °C | 125000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | 649 MHz | S-PBGA-B256 | 168 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 2.3 kB | 990 ps | 990 ps | 168 | 1344 CLBS, 125000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 1344 | 125000 | 649 MHz | 1344 | 1344 | 0.99 ns | 1344 | 2016 | 125000 | 1.2 mm | 17 mm | 17 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P250-FG256T | Microchip | Datasheet | 2314 | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | A3P250 | 350 MHz | MICROSEMI CORP | A3P250-FG256T | Microchip Technology | 3 | 157 | 125 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.23 | No | 1.575 V | 1.425 V | 1.5 V | Automotive grade | -40°C ~ 125°C (TA) | Automotive, AEC-Q100, ProASIC3 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 157 | Not Qualified | 1.5/3.3 V | AUTOMOTIVE | 157 | 6144 CLBS, 250000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | AEC-Q100 | STD | 6144 | 6144 | 250000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P600L-FG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 2 months ago) | Surface Mount | YES | 256 | 400.011771 mg | 256 | 350 MHz | MICROSEMI CORP | A3P600L-FG256 | 3 | 177 | 70 °C | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Obsolete | 30 | 5.28 | Compliant | No | 1.575 V | 1.14 V | 1.2 V | TIN LEAD/TIN LEAD SILVER | 70 °C | 0 °C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 177 | Not Qualified | 1.2 V | 1.5/3.3 V | COMMERCIAL | 1.26 V | 1.14 V | 5 mA | 13.5 kB | 177 | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 600000 | 781.25 MHz | 13824 | 13824 | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P400-FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 484 | 350 MHz | MICROSEMI CORP | A3P400-FG484I | 3 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | 30 | 7.76 | No | 1.575 V | 1.425 V | 1.5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | INDUSTRIAL | 9216 CLBS, 400000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 9216 | 400000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P600-FGG144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | 144 | A3P600 | 350 MHz | MICROSEMI CORP | A3P600-FGG144 | Microchip Technology | 3 | 97 | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 0.76 | Compliant | Yes | 8542310000/8542310000/8542310000/8542310000/8542310000 | 1.575 V | 1.425 V | 1.5 V | 0°C ~ 85°C (TJ) | ProASIC3 | e1 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | 231 MHz | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 13.5 kB | 5 mA | 13.5 kB | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 6500 | 110592 | 600000 | 231 MHz | STD | 13824 | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | No | Lead Free | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No APA450-FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Lead, Tin | Surface Mount | Surface Mount | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | APA450 | 180 MHz | MICROSEMI CORP | APA450-FG484I | Microchip Technology | 3 | 344 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | Compliant | No | 2.7 V | 2.3 V | 2.5 V | -40°C ~ 85°C (TA) | ProASICPLUS | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1 mm | unknown | 180 MHz | S-PBGA-B484 | 344 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 2.7 V | 2.3 V | 13.5 kB | 344 | 450000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 450000 | 180 MHz | STD | 12288 | 12288 | 450000 | 1.73 mm | 25 mm | 25 mm | No | Contains Lead | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No AFS250-FG256I | Microchip | Datasheet | 2075 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 256-LBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | AFS250 | MICROSEMI CORP | AFS250-FG256I | Microchip Technology | 3 | 114 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 1.8 | Compliant | No | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 85 °C | Fusion® | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 1.0989 GHz | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 4.5 kB | 6144 CLBS, 250000 GATES | 1.68 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 1.0989 GHz | STD | 6144 | 6144 | 250000 | 1.2 mm | 17 mm | 17 mm | No |
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A2F060M3E-FG256M
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A3PE3000L-FGG896
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A3PE3000L-FG324
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A54SX08-1FG144I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A54SX08-2FGG144
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A3P1000-2FG256I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AGL400V5-FGG484
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
AX2000-FGG1152I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
A3P1000-FG256I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
124.647451
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A3P1000-FG484T
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
AGL060V5-CS121
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
AGL400V5-FG144
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
AFS1500-1FG676
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
352.734083
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AX125-FGG256I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
A3P250-FG256T
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
A3P600L-FG256
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
A3P400-FG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
A3P600-FGG144
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
APA450-FG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
AFS250-FG256I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
291.113733