The category is 'Embedded - Microcontrollers - Application Specific'
- All Manufacturers
- Applications
- Interface
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Core Processor
- RoHS Status
- Factory Lead Time
- Program Memory Type
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Material | Number of Terminals | Body diameter | Capacitors series | Case - inch | Case - mm | Clock Frequency-Max | Colour | Gross weight | Heatsink shape | Ihs Manufacturer | Internal diameter | Kind of capacitor | Material finishing | Moisture Sensitivity Levels | Mounting | Noal voltage | Number of I/O Lines | Operating ambient temperature | Operating current | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Transport packaging size/quantity | Trigger temperature | Type of capacitor | Type of heatsink | Operating temperature | Tolerance | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Capacitance | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Depth | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Dielectric | Temperature Grade | Number of Ports | uPs/uCs/Peripheral ICs Type | Supply Current-Max | Fuse type | Seated Height-Max | Address Bus Width | Primary Clock/Crystal Frequency-Nom | Boundary Scan | Low Power Mode | External Data Bus Width | Output Clock Frequency-Max | Number of Serial I/Os | Bus Compatibility | Data Transfer Rate-Max | Time-Min | 2nd Connector Number of Positions Loaded | Interrupt Capability | Volatile | Communication Protocol | Information Access Method | Data Encoding/Decoding Method | Saturation Current | Operating voltage | Host Data Transfer Rate-Max | Drive Interface Standard | Host Interface Standard | Diameter | Height | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No IBM37RGB526DB17 | IBM | Datasheet | - | - | Min: 1 Mult: 1 | YES | 144 | IBM MICROELECTRONICS | PLASTIC/EPOXY | FQFP | FQFP, | SQUARE | FLATPACK, FINE PITCH | Obsolete | 3.6 V | 3 V | 3.3 V | 8542.31.00.01 | QUAD | GULL WING | 0.5 mm | unknown | S-PQFP-G144 | Not Qualified | DISPLAY CONTROLLER, PALETTE DAC | 3.1 mm | 3 | 8 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No DS1744-100 | Dallas Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 0.032 MHz | DALLAS SEMICONDUCTOR | 70 °C | PLASTIC/EPOXY | DIP | 0.700 INCH, PLASTIC, DIP-28 | DIP28,.6 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Obsolete | No | 5.5 V | 4.5 V | 5 V | e0 | TIN LEAD | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDMA-T28 | Not Qualified | COMMERCIAL | TIMER, REAL TIME CLOCK | 8 | SECONDS | N | NO | PARALLEL, DIRECT ADDRESS | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No R6765-5P | Rockwell Automation | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No ICS501BMLFT | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | INTEGRATED DEVICE TECHNOLOGY INC | 70 °C | PLASTIC/EPOXY | SOP | 0.150 INCH, LEAD FREE, SOIC-8 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Transferred | SOIC | Yes | 5.25 V | 3.14 V | 3.3 V | e3 | Yes | EAR99 | MATTE TIN | ALSO OPERATES AT 3.14V MINIMUM SUPPLY | 8542.39.00.01 | DUAL | GULL WING | 1.27 mm | unknown | 8 | R-PDSO-G8 | Not Qualified | COMMERCIAL | CLOCK GENERATOR, OTHER | 1.75 mm | 7.5 MHz | 15 MHz | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BCM5020 | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | YES | 144 | BROADCOM CORP | PLASTIC/EPOXY | QFP | QFP, | RECTANGULAR | FLATPACK | Obsolete | QFP | 5.25 V | 4.75 V | 5 V | 8542.31.00.01 | QUAD | GULL WING | unknown | 144 | R-PQFP-G144 | Not Qualified | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 5 | YES | NO | 16 | 1 | ASYNC, BIT | NRZ | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No THGBMFG7C2LBAIW | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 153 | TOSHIBA CORP | 85 °C | -25 °C | PLASTIC/EPOXY | BGA | BGA, | RECTANGULAR | GRID ARRAY | Active | 3.6 V | 2.7 V | 8542.31.00.01 | BOTTOM | BALL | unknown | R-PBGA-B153 | OTHER | SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU6CG-1SBVA484E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 484 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | PLASTIC/EPOXY | FBGA | BGA-484 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B484 | OTHER | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SAA6703AH | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 160 | 50 MHz | NXP SEMICONDUCTORS | 70 °C | PLASTIC/EPOXY | QFP | QFP, | SQUARE | FLATPACK | Obsolete | QFP | 2.7 V | 2.3 V | 2.5 V | e3 | 3A001.A.3 | TIN | 8542.31.00.01 | QUAD | GULL WING | 0.65 mm | compliant | 160 | S-PQFP-G160 | Not Qualified | COMMERCIAL | DISPLAY CONTROLLER, CRT OR FLAT PANEL GRAPHICS DISPLAY | 4.07 mm | I2C | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TMP82C79M-2(EL) | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No S-3510ANFJA-TB | ABLIC Inc. | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.032 MHz | SEIKO INSTRUMENTS USA INC | 70 °C | -20 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | 5.5 V | 1.7 V | 3 V | EAR99 | 8542.39.00.01 | DUAL | GULL WING | 1.27 mm | unknown | 8 | R-PDSO-G8 | Not Qualified | COMMERCIAL | TIMER, REAL TIME CLOCK | 1.75 mm | SERIAL, 3-WIRE | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No ICS9147F-03 | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | INTEGRATED DEVICE TECHNOLOGY INC | 70 °C | PLASTIC/EPOXY | SSOP | SSOP, | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Obsolete | SSOP | No | 3.7 V | 3 V | 3.3 V | e0 | No | EAR99 | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | 0.635 mm | compliant | 48 | R-PDSO-G48 | Not Qualified | COMMERCIAL | CLOCK GENERATOR, PROCESSOR SPECIFIC | 2.794 mm | 16 MHz | 75 MHz | 15.875 mm | 7.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CL-SH130-15PC-D | Cirrus Logic | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | CIRRUS LOGIC INC | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC44,.7SQ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | unknown | S-PQCC-J44 | Not Qualified | COMMERCIAL | 50 mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SST55LC100M-45-C-BWE | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 84 | SILICON STORAGE TECHNOLOGY INC | 70 °C | PLASTIC/EPOXY | TFBGA | TFBGA, | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Transferred | BGA | Yes | 3.465 V | 3.135 V | 3.3 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8 mm | unknown | 40 | 84 | S-PBGA-B84 | Not Qualified | COMMERCIAL | SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE | 1.2 mm | 16 | 10 MBps | IDE | ATA | 9 mm | 9 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MK1422STR | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | INTEGRATED CIRCUIT SYSTEMS INC | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5.5 V | 4.5 V | 5 V | e0 | EAR99 | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | 1.27 mm | unknown | 8 | R-PDSO-G8 | Not Qualified | COMMERCIAL | CLOCK GENERATOR, OTHER | 1.7272 mm | 14.318 MHz | 33.868 MHz | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No LAN9115-MT | SMSC | Datasheet | - | - | Min: 1 Mult: 1 | YES | aluminium | 100 | 25 MHz | black | 700 g | H | STANDARD MICROSYSTEMS CORP | anodized | retaining spring | 70 °C | PLASTIC/EPOXY | LFQFP | GREEN, TQFP-100 | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Transferred | QFP | Yes | 3.3 V | extruded | e3 | Yes | MATTE TIN | 8542.31.00.01 | QUAD | GULL WING | 260 | 0.5 mm | compliant | 100 | S-PQFP-G100 | Not Qualified | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 1.6 mm | 7 | NO | YES | 16 | 1 | 12.5 MBps | universal | NRZ; NRZI; BIPH-LEVEL(MANCHESTER) | 3 | 65.8mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No UPD720133GB-YEU-A | NEC Electronics Group | Datasheet | - | - | Min: 1 Mult: 1 | YES | aluminium | 64 | 30 MHz | black | 700 g | round | NEC ELECTRONICS CORP | 25mm | anodized | heat transfer glue, | 70 °C | PLASTIC/EPOXY | TFQFP | 10 X 10 MM, LEAD FREE, PLASTIC, TQFP-64 | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | QFP | Yes | 2.7 V | 2.3 V | 2.5 V | extruded | e6/e4 | Yes | 3A991.A.2 | TIN BISMUTH/NICKEL PALLADIUM GOLD | 8542.31.00.01 | QUAD | GULL WING | 260 | 0.5 mm | compliant | 10 | 64 | S-PQFP-G64 | Not Qualified | COMMERCIAL | BUS CONTROLLER, UNIVERSAL SERIAL BUS | 1.2 mm | LED | 45mm | 15mm | 10 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CDP1852CE | Rochester Electronics LLC | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | ROCHESTER ELECTRONICS LLC | 16 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP-24 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 6.5 V | 4 V | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.39.00.01 | DUAL | THROUGH-HOLE | unknown | 24 | R-PDIP-T24 | Not Qualified | INDUSTRIAL | 2 | PARALLEL IO PORT, GENERAL PURPOSE | 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IR3521MTRPBF | International Rectifier | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 4.2 mm | 1.11 | INTERNATIONAL RECTIFIER CORP | 250 AC Vmin | maximum - 175 (short-term exposure) °C | maximum - 15 A | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 42*28*23.5/3000 | 133 °C | maximum - 101 °C | e3 | Yes | MATTE TIN | 8542.31.00.01 | QUAD | NO LEAD | 0.5 mm | across the body - 11.5 mm | compliant | 32 | S-XQCC-N32 | Not Qualified | MICROPROCESSOR CIRCUIT | thermal fuse | 0.9 mm | 5 mm | 5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GL3523-OTY30 | Genesys Logic Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 76 | 25 MHz | GENESYS LOGIC INC | 70 °C | UNSPECIFIED | HVQCCN | QFN-76 | LCC76,.35SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Contact Manufacturer | 1.32 V | 1.15 V | 1.2 V | IT ALSO OPERATES AT 5V NOM SUPPLY | QUAD | NO LEAD | 0.4 mm | unknown | S-XQCC-N76 | BUS CONTROLLER, UNIVERSAL SERIAL BUS | 0.9 mm | I2C, SMBUS, SPI, USB | 60 MBps | 9 mm | 9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PEX8632-BB50BIF | Avago Technologies | Datasheet | - | - | Min: 1 Mult: 1 | YES | 676 | KGM | 1206 | 3216 | 100 MHz | 0.136 g | AVAGO TECHNOLOGIES INC | MLCC | SMD | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | 1.05 V | 0.95 V | 1 V | ceramic | -55...125°C | ±1% | e1 | TIN SILVER COPPER | 8542.31.00.01 | 3.3nF | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B676 | C0G (NP0) | INDUSTRIAL | BUS CONTROLLER, PCI | 2.48 mm | I2C | 0.0125 MBps | 3 | 100V | IEEE 1149.6; IEEE 1149.1 | 27 mm | 27 mm |
IBM37RGB526DB17
IBM
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
DS1744-100
Dallas Semiconductor
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
R6765-5P
Rockwell Automation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
ICS501BMLFT
Integrated Device Technology Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
BCM5020
Broadcom Limited
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
THGBMFG7C2LBAIW
Toshiba America Electronic Components
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU6CG-1SBVA484E
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SAA6703AH
NXP Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
TMP82C79M-2(EL)
Toshiba America Electronic Components
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
S-3510ANFJA-TB
ABLIC Inc.
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
ICS9147F-03
Integrated Device Technology Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
CL-SH130-15PC-D
Cirrus Logic
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SST55LC100M-45-C-BWE
Silicon Storage Technology
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
MK1422STR
Integrated Device Technology Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
LAN9115-MT
SMSC
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
UPD720133GB-YEU-A
NEC Electronics Group
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
CDP1852CE
Rochester Electronics LLC
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
IR3521MTRPBF
International Rectifier
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
GL3523-OTY30
Genesys Logic Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PEX8632-BB50BIF
Avago Technologies
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
