The category is 'Embedded - Microcontrollers - Application Specific'
- All Manufacturers
- Applications
- Interface
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Core Processor
- RoHS Status
- Factory Lead Time
- Program Memory Type
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | uPs/uCs/Peripheral ICs Type | Supply Current-Max | Seated Height-Max | Address Bus Width | Primary Clock/Crystal Frequency-Nom | Boundary Scan | Low Power Mode | External Data Bus Width | Output Clock Frequency-Max | RAM (words) | Number of Serial I/Os | Bus Compatibility | Data Transfer Rate-Max | Communication Protocol | Data Encoding/Decoding Method | Host Data Transfer Rate-Max | Number of Banks | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No PEX8114-AA13BIG | PLX Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 133 MHz | PLX TECHNOLOGY INC | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | BGA | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | unknown | 256 | S-PBGA-B256 | Not Qualified | BUS CONTROLLER, PCI | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No S82343 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | INTEL CORP | PLASTIC/EPOXY | QFP | QFP-160 | QFP160,1.2SQ | SQUARE | FLATPACK | Obsolete | QFP | No | 5 V | e0 | TIN LEAD | 8542.31.00.01 | QUAD | GULL WING | 0.8 mm | compliant | 16 | S-PQFP-G16 | Not Qualified | MEMORY CONTROLLER, DRAM | 3.85 mm | 11 | NO | NO | 8 | 4 | 28 mm | 28 mm | ||||||||||||||||||||||
![]() | Mfr Part No SC11483CV | Sierra Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No P8284A-1 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | INTEL CORP | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP18,.3 | DIP18,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.5 V | 4.5 V | 5 V | e0 | EAR99 | TIN LEAD | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | 18 | R-PDIP-T18 | Not Qualified | COMMERCIAL | CLOCK GENERATOR, PROCESSOR SPECIFIC | 162 mA | 5.08 mm | 30 MHz | 30 MHz | 22.355 mm | 7.62 mm | |||||||||||||||||||
![]() | Mfr Part No SAE81C91 | Siemens | Datasheet | 44 | - | Min: 1 Mult: 1 | YES | 28 | 20 MHz | SIEMENS A G | 110 °C | -40 °C | PLASTIC/EPOXY | , | SQUARE | CHIP CARRIER | Transferred | 5.5 V | 4.5 V | 5 V | 8542.31.00.01 | QUAD | J BEND | unknown | S-PQCC-J28 | Not Qualified | INDUSTRIAL | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 30 mA | 8 | NO | NO | 8 | 0 | 3 | 0.125 MBps | NRZ | |||||||||||||||||||||||
![]() | Mfr Part No UPD16805MA | NEC Electronics Group | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU9CG-2LFFVB1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1156 | ADVANCED MICRO DEVICES INC | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-1156 | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Active | Yes | 0.85 V | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1156 | INDUSTRIAL | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 35 mm | 35 mm | |||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU9CG-L1SFVC784I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA-784 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 0.742 V | 0.698 V | 0.72 V | e1 | TIN SILVER COPPER | ALSO OPERATES AT 0.85V NOMINAL SUPPLY | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | |||||||||||||||||||||
![]() | Mfr Part No XCZU9CG-L1SFVC784I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA78428X28,32 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.742 V | 0.698 V | 0.72 V | TIN SILVER COPPER | ALSO OPERATES AT 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | unknown | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | |||||||||||||||||||||
![]() | Mfr Part No CL-GD510A-32QC-B | Cirrus Logic | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No ZR36487BGCF | Qualcomm | Datasheet | - | - | Min: 1 Mult: 1 | QUALCOMM INC | , | Obsolete | 8542.31.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No P2010AF-08TR | Pulsecore Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | PULSECORE SEMICONDUCTOR | 70 °C | PLASTIC/EPOXY | TSSOP | 4.40 MM, ROHS COMPLIANT, TSSOP-8 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | Yes | 5.5 V | 2.7 V | 3.3 V | DUAL | GULL WING | NOT SPECIFIED | 0.65 mm | unknown | NOT SPECIFIED | R-PDSO-G8 | Not Qualified | COMMERCIAL | CLOCK GENERATOR, OTHER | 1.1 mm | 35 MHz | 35 MHz | 4.4 mm | 3 mm | |||||||||||||||||||||||||
![]() | Mfr Part No P2010AF-08TR | Alliance Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | ALLIANCE SEMICONDUCTOR CORP | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | SOIC | Yes | 5.5 V | 2.7 V | 3.3 V | e3/e6 | EAR99 | PURE MATTE TIN/TIN BISMUTH | 8542.39.00.01 | DUAL | GULL WING | 260 | 0.65 mm | unknown | 40 | 8 | R-PDSO-G8 | Not Qualified | COMMERCIAL | CLOCK GENERATOR, OTHER | 1.1 mm | 35 MHz | 4.4 mm | 3 mm | ||||||||||||||||||||
![]() | Mfr Part No XCZU2EG-2LSFVC784I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | ||||||||||||||||||||||||
![]() | Mfr Part No OX16C950-PCC60-B | PLX Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 60 MHz | PLX TECHNOLOGY INC | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Obsolete | LCC | No | 5.25 V | 4.75 V | 5 V | 8542.31.00.01 | QUAD | J BEND | NOT SPECIFIED | 1.27 mm | unknown | NOT SPECIFIED | 44 | S-PQCC-J44 | Not Qualified | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 2.34 mm | 3 | NO | YES | 8 | 1 | 7.5 MBps | ASYNC, BIT | 16.61 mm | 16.61 mm | ||||||||||||||||
![]() | Mfr Part No TC8566AF | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 16.5 MHz | TOSHIBA CORP | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, | RECTANGULAR | FLATPACK | Obsolete | QFP | No | 5.5 V | 4.5 V | 5 V | e0 | TIN LEAD | 8542.31.00.01 | QUAD | GULL WING | unknown | 100 | R-PQFP-G100 | Not Qualified | INDUSTRIAL | SECONDARY STORAGE CONTROLLER, FLOPPY DISK DRIVE | 30 mA | 8 | 0.0625 MBps | |||||||||||||||||||||||
![]() | Mfr Part No PDI1394L11D | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 80 | NXP SEMICONDUCTORS | 70 °C | PLASTIC/EPOXY | QFP | QFP, | RECTANGULAR | FLATPACK | Obsolete | QFP | 3.6 V | 3 V | 3.3 V | 8542.31.00.01 | QUAD | GULL WING | 0.8 mm | unknown | 80 | R-PQFP-G80 | Not Qualified | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 3.2 mm | 8 | NO | NO | 8 | 1 | ASYNC, BIT | 20 mm | 14 mm | |||||||||||||||||||||
![]() | Mfr Part No PDI1394L11D | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 80 | PHILIPS SEMICONDUCTORS | 70 °C | PLASTIC/EPOXY | QFP | QFP, QFP80,.7X.9,32 | QFP80,.7X.9,32 | RECTANGULAR | FLATPACK | Transferred | No | 3.3 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | 0.8 mm | unknown | R-PQFP-G80 | Not Qualified | COMMERCIAL | 150 mA | ||||||||||||||||||||||||||||||
![]() | Mfr Part No SDIN8DE2-4G-XI | SanDisk Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | SANDISK CORP | 85 °C | -40 °C | UNSPECIFIED | DIE | DIE, | RECTANGULAR | UNCASED CHIP | Obsolete | Yes | 3.6 V | 2.7 V | 3.3 V | 8542.31.00.01 | UPPER | NO LEAD | unknown | R-XUUC-N | INDUSTRIAL | SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE | 120 MBps | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU9CG-2LFFVC900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | ADVANCED MICRO DEVICES INC | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | Yes | 0.85 V | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm |
PEX8114-AA13BIG
PLX Technology
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
S82343
Intel Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SC11483CV
Sierra Semiconductor
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
P8284A-1
Intel Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SAE81C91
Siemens
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
UPD16805MA
NEC Electronics Group
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU9CG-2LFFVB1156I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU9CG-L1SFVC784I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU9CG-L1SFVC784I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
CL-GD510A-32QC-B
Cirrus Logic
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
ZR36487BGCF
Qualcomm
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
P2010AF-08TR
Pulsecore Semiconductor
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
P2010AF-08TR
Alliance Semiconductor Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU2EG-2LSFVC784I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
OX16C950-PCC60-B
PLX Technology
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
TC8566AF
Toshiba America Electronic Components
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PDI1394L11D
NXP Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PDI1394L11D
Philips Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SDIN8DE2-4G-XI
SanDisk Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU9CG-2LFFVC900I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
