The category is 'Embedded - Microcontrollers - Application Specific'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Surface Mount | Number of Terminals | Clock Frequency-Max | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Number of Ports | uPs/uCs/Peripheral ICs Type | Number of Bits | Supply Current-Max | Seated Height-Max | Address Bus Width | Primary Clock/Crystal Frequency-Nom | Boundary Scan | Low Power Mode | External Data Bus Width | Output Clock Frequency-Max | RAM (words) | Number of Serial I/Os | Bus Compatibility | Data Transfer Rate-Max | Number of DMA Channels | Communication Protocol | Data Encoding/Decoding Method | Display Configuration | Length | Width |
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![]() | Mfr Part No RV-8564-C2-TA-QC-020-MG01 | Micro Crystal AG | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC68B45S | Motorola Semiconductor Products | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 2 MHz | MOTOROLA INC | 70 °C | CERAMIC, GLASS-SEALED | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5.25 V | 4.75 V | 5 V | e0 | TIN LEAD | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-GDIP-T40 | Not Qualified | COMMERCIAL | DISPLAY CONTROLLER, CRT CHARACTER DISPLAY | 5.84 mm | 1 | 8 | 6800 | 80 X 24 CHARACTERS | 52.275 mm | 15.24 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No FS6322-04 | AMI Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | AMI SEMICONDUCTOR | 70 °C | PLASTIC/EPOXY | SOP | 0.150 INCH, SOIC-16 | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | Transferred | 3.6 V | 3 V | 3.3 V | DUAL | GULL WING | 1.27 mm | unknown | R-PDSO-G16 | Not Qualified | COMMERCIAL | CLOCK GENERATOR, OTHER | 1.75 mm | 30 MHz | 48.00026 MHz | 9.9 mm | 3.9 mm | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No P82586-6 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 48 | 6 MHz | INTEL CORP | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP48,.6 | DIP48,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.5 V | 4.5 V | 5 V | e0 | Tin/Lead (Sn/Pb) | MICROINSTRUCTION ROM; ON-CHIP MEMORY MANAGEMENT | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | 48 | R-PDIP-T48 | Not Qualified | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 550 mA | 5.08 mm | 24 | NO | NO | 16 | 0 | 1 | 80186; 80188 | 1.25 MBps | 4 | SYNC, HDLC | NRZ; BIPH-LEVEL(MANCHESTER) | 61.79 mm | 15.24 mm | |||||||||||||||
![]() | Mfr Part No QP8251A | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 3.125 MHz | INTEL CORP | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.5 V | 4.5 V | 5 V | e0 | TIN LEAD | MODEM CONTROL INPUTS SELECTABLE AS I/O | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | 28 | R-PDIP-T28 | Not Qualified | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 100 mA | 5.08 mm | NO | NO | 8 | 0 | 1 | MCS 48; MCS 80; MCS 85; IAPX 86; IAPX 88 | 0.0078125 MBps | ASYNC, BIT; SYNC, BYTE; BISYNC; EXT SYNC | NRZ | 37.02 mm | 15.24 mm | |||||||||||||||||
![]() | Mfr Part No PI7C8150BMAI-33 | Pericom Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | 33 MHz | PERICOM SEMICONDUCTOR CORP | 85 °C | -40 °C | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | No | 3.6 V | 3 V | 3.3 V | No | EAR99 | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 0.5 mm | compliant | NOT SPECIFIED | 208 | S-PQFP-G208 | Not Qualified | INDUSTRIAL | BUS CONTROLLER, PCI | 510 mA | 3.8 mm | 32 | 32 | 28 mm | 28 mm | ||||||||||||||||||||||
![]() | Mfr Part No NJU6374QE | New Japan Radio Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | NEW JAPAN RADIO CO LTD | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | Yes | 6 V | 4 V | 5 V | e6 | Yes | EAR99 | TIN BISMUTH | 8542.39.00.01 | DUAL | GULL WING | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | INDUSTRIAL | CLOCK GENERATOR, OTHER | 28 mA | 1.9 mm | 75 MHz | 75 MHz | 5 mm | 3.9 mm | ||||||||||||||||||||||||
![]() | Mfr Part No TNETX3100PGW | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 240 | 50 MHz | TEXAS INSTRUMENTS INC | 95 °C | PLASTIC/EPOXY | HQFP | HQFP, | SQUARE | FLATPACK, HEAT SINK/SLUG | Obsolete | QFP | No | 3.6 V | 3 V | 3.3 V | No | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | not_compliant | NOT SPECIFIED | 240 | S-PQFP-G240 | Not Qualified | OTHER | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 2 | YES | NO | 8 | 10 | 25 MBps | ASYNC, BIT | ||||||||||||||||||||||||
![]() | Mfr Part No ASM3P2579A-06OR | Alliance Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 6 | ALLIANCE SEMICONDUCTOR CORP | 70 °C | PLASTIC/EPOXY | VSSOP | VSSOP, TSOP6,.11,37 | TSOP6,.11,37 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | Transferred | SOT-23 | No | 2.625 V | 2.375 V | 2.5 V | e0 | EAR99 | TIN LEAD | ALSO OPERATES AT 3.3V SUPPLY | 8542.39.00.01 | DUAL | GULL WING | 0.95 mm | unknown | 6 | R-PDSO-G6 | Not Qualified | COMMERCIAL | CLOCK GENERATOR, OTHER | 6 mA | 1 mm | 30 MHz | 30 MHz | 2.9 mm | 1.6 mm | ||||||||||||||||||||||||
![]() | Mfr Part No JMC250 | JMicron Technology Corporation | Datasheet | - | - | Min: 1 Mult: 1 | JMICRON TECHNOLOGY CORP | , | Contact Manufacturer | 8542.31.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU11EG-3FFVF1517I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1517 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | Yes | 0.9 V | e1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | INDUSTRIAL | PROGRAMMABLE SoC | 3.51 mm | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU11EG-3FFVF1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1517 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-1517 | SQUARE | GRID ARRAY | Active | Yes | 0.9 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1517 | INDUSTRIAL | PROGRAMMABLE SoC | 3.51 mm | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU6CG-1FBVB900E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | PLASTIC/EPOXY | BGA | BGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | OTHER | PROGRAMMABLE SoC | 2.88 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 31 mm | 31 mm | |||||||||||||||||||||||||||||
![]() | Mfr Part No PCA9557PW | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | PHILIPS SEMICONDUCTORS | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | Yes | EAR99 | 8542.39.00.01 | DUAL | GULL WING | 260 | 0.635 mm | unknown | R-PDSO-G16 | Not Qualified | INDUSTRIAL | 8 | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SC28L202A1DGG | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 50 MHz | NXP SEMICONDUCTORS | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP56,.3,20 | TSSOP56,.3,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | TSSOP | Yes | 5.5 V | 4.5 V | 5 V | e4 | Yes | Nickel/Palladium/Gold (Ni/Pd/Au) | ALSO OPERATES AT 3.3V SUPPLY | 8542.31.00.01 | DUAL | GULL WING | 260 | 0.5 mm | compliant | 30 | 56 | R-PDSO-G56 | Not Qualified | INDUSTRIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 1.2 mm | 7 | NO | YES | 8 | 2 | 68XXX; 80XXX | 0.375 MBps | ASYNC, BIT | NRZ | 14 mm | 6.1 mm | |||||||||||||
![]() | Mfr Part No XCZU4EG-3SFVC784I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FCBGA-784 | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 0.9 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No SC16C2552IA44 | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 80 MHz | NXP SEMICONDUCTORS | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC44,.7SQ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Obsolete | LPCC | Yes | 3.63 V | 2.97 V | 3.3 V | e3 | MATTE TIN | ALSO OPERATES AT 2.5 V SUPPLY | 8542.31.00.01 | QUAD | J BEND | 245 | 1.27 mm | unknown | 44 | S-PQCC-J44 | Not Qualified | INDUSTRIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 4.57 mm | 3 | NO | YES | 8 | 2 | 0.625 MBps | ASYNC, BIT | 16.585 mm | 16.585 mm | |||||||||||||||||
![]() | Mfr Part No PCF8574P | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | 0.1 MHz | NXP SEMICONDUCTORS | 8 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, PLASTIC, SOT-38-4, DIP-16 | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | Yes | 6 V | 2.5 V | 5 V | e4 | Yes | EAR99 | NICKEL PALLADIUM GOLD | 8542.39.00.01 | DUAL | THROUGH-HOLE | 245 | 2.54 mm | unknown | 16 | R-PDIP-T16 | Not Qualified | INDUSTRIAL | 1 | PARALLEL IO PORT, GENERAL PURPOSE | 8 | 0.1 mA | 4.7 mm | 21.6 mm | 7.62 mm | ||||||||||||||||||||
![]() | Mfr Part No SC18IS602BIPW/S8HP | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | 4 Weeks | YES | 16 | NXP SEMICONDUCTORS | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP-16 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | Yes | 3.6 V | 2.4 V | 3 V | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.31.00.01 | DUAL | GULL WING | 260 | 0.65 mm | compliant | 30 | R-PDSO-G16 | INDUSTRIAL | BUS CONTROLLER, I2C | 1.1 mm | I2C | 0.225 MBps | 5 mm | 4.4 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No PCA9675PW | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | 1 MHz | NXP SEMICONDUCTORS | 1 | 18 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP24,.25 | TSSOP24,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | TSSOP | Yes | 5.5 V | 2.3 V | 3 V | e4 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.39.00.01 | DUAL | GULL WING | 260 | 0.65 mm | compliant | 30 | 24 | R-PDSO-G24 | Not Qualified | INDUSTRIAL | 1 | PARALLEL IO PORT, GENERAL PURPOSE | 16 | 1.1 mm | 7.8 mm | 4.4 mm |
RV-8564-C2-TA-QC-020-MG01
Micro Crystal AG
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
MC68B45S
Motorola Semiconductor Products
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
FS6322-04
AMI Semiconductor
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
P82586-6
Intel Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
QP8251A
Intel Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PI7C8150BMAI-33
Pericom Semiconductor Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
NJU6374QE
New Japan Radio Co Ltd
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
TNETX3100PGW
Texas Instruments
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
ASM3P2579A-06OR
Alliance Semiconductor Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
JMC250
JMicron Technology Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU11EG-3FFVF1517I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU11EG-3FFVF1517I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU6CG-1FBVB900E
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PCA9557PW
Philips Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SC28L202A1DGG
NXP Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU4EG-3SFVC784I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SC16C2552IA44
NXP Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PCF8574P
NXP Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SC18IS602BIPW/S8HP
NXP Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PCA9675PW
NXP Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
