The category is 'Embedded - Microcontrollers - Application Specific'
- All Manufacturers
- Applications
- Interface
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Core Processor
- RoHS Status
- Factory Lead Time
- Program Memory Type
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Number of Ports | uPs/uCs/Peripheral ICs Type | Number of Bits | Supply Current-Max | Seated Height-Max | Address Bus Width | Primary Clock/Crystal Frequency-Nom | Boundary Scan | Low Power Mode | External Data Bus Width | Output Clock Frequency-Max | Number of Serial I/Os | Bus Compatibility | Data Transfer Rate-Max | Communication Protocol | Information Access Method | Data Encoding/Decoding Method | Drive Interface Standard | Host Interface Standard | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No W83195BG-120 | Nuvoton Technology Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | NUVOTON TECHNOLOGY CORP | 3 | 70 °C | PLASTIC/EPOXY | SSOP | SSOP, SSOP56,.4 | SSOP56,.4 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Obsolete | SSOP | Yes | 3.465 V | 3.135 V | 3.3 V | e3 | Yes | EAR99 | MATTE TIN | 8542.39.00.01 | DUAL | GULL WING | 0.635 mm | compliant | 56 | R-PDSO-G56 | Not Qualified | COMMERCIAL | CLOCK GENERATOR, PROCESSOR SPECIFIC | 350 mA | 2.79 mm | 14.318 MHz | 400 MHz | 18.42 mm | 7.52 mm | ||||||||||||||||||||||
![]() | Mfr Part No MSM82C43GS | LAPIS Semiconductor Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | LAPIS SEMICONDUCTOR CO LTD | 20 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP24,.4 | SOP24,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | No | 6 V | 2.5 V | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | GULL WING | 1.27 mm | unknown | R-PDSO-G24 | Not Qualified | INDUSTRIAL | 5 | PARALLEL IO PORT, GENERAL PURPOSE | 4 | ||||||||||||||||||||||||||||
![]() | Mfr Part No IM6402AIJL | Intersil Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 33 MHz | INTERSIL CORP | 85 °C | -40 °C | CERAMIC | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5.5 V | 4.5 V | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | not_compliant | R-XDIP-T40 | Not Qualified | INDUSTRIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 32 | NO | 32 | 2 | 50 MBps | ASYNC, BIT; SYNC, BYTE | ||||||||||||||||||||||||||
![]() | Mfr Part No IM6402AIJL | General Electric Solid State | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | GENERAL ELECTRIC SOLID STATE | 85 °C | -40 °C | CERAMIC | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Transferred | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T40 | Not Qualified | INDUSTRIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IM6402AIJL | Harris Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 33 MHz | HARRIS SEMICONDUCTOR | 85 °C | -40 °C | CERAMIC | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5.5 V | 4.5 V | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T40 | Not Qualified | INDUSTRIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 32 | NO | 32 | 2 | 50 MBps | ASYNC, BIT; SYNC, BYTE | |||||||||||||||||||||||||
![]() | Mfr Part No ST16C450CJ | Exar Corporation | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PT8A6311S | Pericom Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | PERICOM TECHNOLOGY INC | , | Transferred | 8542.31.00.01 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TK11333BM | TOKO Inc | Datasheet | - | - | Min: 1 Mult: 1 | TOKO INC | , | Obsolete | 8542.31.00.01 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PCF8575CTS/1 | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TSS461C-TDRZ | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | 16 MHz | MICROCHIP TECHNOLOGY INC | 3 | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | ROHS COMPLIANT, SO-24 | SOP24,.4 | RECTANGULAR | SMALL OUTLINE | Active | Yes | 5.5 V | 4.5 V | 5 V | e3 | MATTE TIN | 8542.31.00.01 | DUAL | GULL WING | 1.27 mm | compliant | R-PDSO-G24 | Not Qualified | AUTOMOTIVE | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 15 mA | 2.65 mm | 8 | NO | YES | 8 | 1 | 0.125 MBps | ASYNC, BIT; SYNC, BYTE | NRZ; BIPH-LEVEL (MANCHESTER) | 15.4 mm | 7.5 mm | ||||||||||||||||||
![]() | Mfr Part No PSD301-15L | Waferscale Integration Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | WAFERSCALE INTEGRATION INC | 19 | 70 °C | CERAMIC, METAL-SEALED COFIRED | WQCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER, WINDOW | Obsolete | No | 5.5 V | 4.5 V | 5 V | e0 | TIN LEAD | QUAD | J BEND | 1.27 mm | unknown | S-CQCC-J44 | Not Qualified | COMMERCIAL | 3 | PARALLEL IO PORT, GENERAL PURPOSE | 95 mA | 4.57 mm | 16 | 16.485 mm | 16.485 mm | ||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU5EV-3FBVB900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-900 | SQUARE | GRID ARRAY | Active | Yes | 0.9 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 2.88 mm | 31 mm | 31 mm | |||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU5EV-3FBVB900I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | Yes | 0.9 V | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 2.88 mm | 31 mm | 31 mm | |||||||||||||||||||||||||||||
![]() | Mfr Part No SP705B | Zarlink Semiconductor Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 14 | ZARLINK SEMICONDUCTOR INC | 70 °C | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | Obsolete | 5.5 V | 4.5 V | 5 V | e0 | EAR99 | TIN LEAD | 8542.39.00.01 | DUAL | THROUGH-HOLE | unknown | R-PDIP-T14 | Not Qualified | COMMERCIAL | CLOCK GENERATOR, OTHER | 10 MHz | 5 MHz | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No ASM3I2969AF-06OR | Alliance Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 6 | ALLIANCE SEMICONDUCTOR CORP | 85 °C | -40 °C | PLASTIC/EPOXY | VSSOP | VSSOP, | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | Transferred | SOT-23 | Yes | 3.6 V | 2.7 V | 3.3 V | e3 | EAR99 | Matte Tin (Sn) | ALSO OPERATES AT 2.5V SUPPLY | 8542.39.00.01 | DUAL | GULL WING | 250 | 0.95 mm | unknown | 40 | 6 | R-PDSO-G6 | Not Qualified | INDUSTRIAL | CLOCK GENERATOR, OTHER | 1 mm | 13 MHz | 13 MHz | 2.9 mm | 1.6 mm | ||||||||||||||||||||||
![]() | Mfr Part No T62M0001A-KG | TM Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | TM TECHNOLOGY INC | Contact Manufacturer | 8542.31.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No X1B000371000200 | Seiko Epson Corporation | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PF29F16G32PANC1 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 122 | INTEL CORP | 70 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA(UNSPEC) | BGA(UNSPEC) | RECTANGULAR | GRID ARRAY, FINE PITCH | Obsolete | BGA | Yes | 3.6 V | 3 V | 3.3 V | e1 | Yes | TIN SILVER COPPER | ALSO REQUIRES 5 V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 0.65 mm | compliant | 122 | R-PBGA-B122 | Not Qualified | COMMERCIAL | SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE | 1.8 mm | 8 | IDE | ATA | 18 mm | 12 mm | |||||||||||||||||||||||
![]() | Mfr Part No MCP7940N | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | 0.032 MHz | MICROCHIP TECHNOLOGY INC | Active | 5.5 V | 1.8 V | 2.5 V | e4 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.39.00.01 | NOT SPECIFIED | compliant | NOT SPECIFIED | TIMER, REAL TIME CLOCK | SERIAL(I2C) | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU19EG-2LFFVE1924E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1924 | ADVANCED MICRO DEVICES INC | 4 | 110 °C | PLASTIC/EPOXY | BGA | FCBGA-1924 | BGA1924,44X44,40 | SQUARE | GRID ARRAY | Active | Yes | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1924 | OTHER | PROGRAMMABLE SoC | 3.71 mm | CAN, I2C, SPI, UART | 45 mm | 45 mm |
W83195BG-120
Nuvoton Technology Corp
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
MSM82C43GS
LAPIS Semiconductor Co Ltd
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
IM6402AIJL
Intersil Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
IM6402AIJL
General Electric Solid State
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
IM6402AIJL
Harris Semiconductor
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
ST16C450CJ
Exar Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PT8A6311S
Pericom Technology Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
TK11333BM
TOKO Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PCF8575CTS/1
NXP Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
TSS461C-TDRZ
Microchip Technology Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PSD301-15L
Waferscale Integration Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU5EV-3FBVB900I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU5EV-3FBVB900I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SP705B
Zarlink Semiconductor Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
ASM3I2969AF-06OR
Alliance Semiconductor Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
T62M0001A-KG
TM Technology Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
X1B000371000200
Seiko Epson Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PF29F16G32PANC1
Intel Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
MCP7940N
Microchip Technology Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU19EG-2LFFVE1924E
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
