The category is 'Embedded - Microcontrollers - Application Specific'
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- Interface
- Moisture Sensitivity Level (MSL)
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- RoHS Status
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- Program Memory Type
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Memory Types | Number of I/Os | Operating Temperature (Max.) | Operating Temperature (Min.) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Applications | Additional Feature | HTS Code | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Memory Size | Analog IC - Other Type | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Program Memory Type | Bit Size | Data Bus Width | Number of Timers/Counters | Address Bus Width | Core Architecture | Max Frequency | Boundary Scan | Low Power Mode | Format | Integrated Cache | Consumer IC Type | Controller Series | Height Seated (Max) | Length | Width | RoHS Status | Lead Free |
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![]() | Mfr Part No SLE66R04SNBZZZA1 | Infineon Technologies | Datasheet | - | - | Min: 1 Mult: 1 | 9 Weeks | Surface Mount | Die | Wafer | -25°C~70°C TA | my-d™ | Obsolete | 3 (168 Hours) | Security | ISO/IEC 14443 Type A | ARM® Cortex®-M4 | EEPROM (512B) | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SLE66CL80PENBZZZA1 | Infineon Technologies | Datasheet | - | - | Min: 1 Mult: 1 | 9 Weeks | Surface Mount | Die | Wafer | -25°C~85°C | Obsolete | 3 (168 Hours) | Security | 2.7V~5.5V | ISO/IEC 14443 for both Type A and Type B | 2.25K x 8 | 8051 | EEPROM (8kB) | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SLE66R16PMCC2ZZZA1 | Infineon Technologies | Datasheet | - | - | Min: 1 Mult: 1 | 9 Weeks | -25°C~70°C | Tape & Reel (TR) | my-d™ NFC | Obsolete | 1 (Unlimited) | Security | ISO14443-3 Type A, NFC Forum Type 2 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SLE66R04PNBZZZA1 | Infineon Technologies | Datasheet | - | - | Min: 1 Mult: 1 | 9 Weeks | Surface Mount | Die | Wafer | -25°C~70°C | my-d™ NFC | Obsolete | 3 (168 Hours) | Security | ISO14443-3 Type A, NFC Forum Type 2 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SLE66R32SMCC2ZZZA1 | Infineon Technologies | Datasheet | - | - | Min: 1 Mult: 1 | 9 Weeks | MCC2 Chip Card Module | P-MCC2-2-1 | Tape & Reel (TR) | my-d™ | Obsolete | 1 (Unlimited) | ARM® Cortex®-M4 | EEPROM (4kB) | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SLB9665XT20FW560XUMA2 | Infineon Technologies | Datasheet | 31 |
| Min: 1 Mult: 1 | 15 Weeks | Surface Mount | 28-TSSOP (0.173, 4.40mm Width) | PG-TSSOP-28-2 | 1 | -40°C~85°C TA | Tape & Reel (TR) | 2015 | OPTIGA™ TPM | Active | 3 (168 Hours) | Trusted Platform Module (TPM) | 3V~3.6V | LPC | 16-Bit | NVM (7.04kB) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SLE 7737E M3.2 | Infineon Technologies | Datasheet | - | - | Min: 1 Mult: 1 | M3.2 Chip Card Module | M3.2 Chip Card Module | Tape & Reel (TR) | Obsolete | 1 (Unlimited) | Security | SLE7737 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A7005CGHN1/T1AGBEL | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 22 Weeks | Surface Mount | 32-VFQFN Exposed Pad | -25°C~85°C TA | 2011 | Active | Authentication | 1.62V~5.5V | I2C | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 14550R-500 | Echelon Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) | External Program Memory | 12 | -40°C~85°C | Tape & Reel (TR) | 2014 | IzoT™ | Active | 3 (168 Hours) | 85°C | -40°C | Smart Transceiver | 3V~3.6V | SPI | 64K x 8 | Neuron | External Program Memory | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CY8CTMA884AA-12 | Cypress Semiconductor Corp | Datasheet | - | - | Min: 1 Mult: 1 | 15 Weeks | YES | 85°C | -40°C | Active | 3 (168 Hours) | 100 | QUAD | GULL WING | 1 | S-PQFP-G100 | INDUSTRIAL | ANALOG CIRCUIT | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CY8CTMA884AE-22 | Cypress Semiconductor Corp | Datasheet | - | - | Min: 1 Mult: 1 | 15 Weeks | YES | 125°C | -40°C | Active | 3 (168 Hours) | 100 | QUAD | GULL WING | 1 | S-PQFP-G100 | AUTOMOTIVE | ANALOG CIRCUIT | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CP3BT26G18AWM/NOPB | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | Tin | Surface Mount | Surface Mount | 128-LQFP | 128 | FLASH | 54 | -40°C~85°C | Tube | no | Obsolete | 3 (168 Hours) | 128 | Connectivity Processor | 2.25V~2.75V | QUAD | GULL WING | 260 | 2.5V | 0.5mm | NOT SPECIFIED | CP3BT26 | 128 | Not Qualified | 3.63V | Bluetooth, ACCESS.bus, Audio, CAN, Microwire/SPI, UART, USB | 256kB | 32K x 8 | CR16C | FLASH (256kB) | 16 | 16b | 2 | 23 | RISC | 24MHz | YES | YES | FIXED POINT | NO | CP3000 | 1.6mm | ROHS3 Compliant | Contains Lead | |||||||||||||||||||||||||||
![]() | Mfr Part No PNX1501E,557 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 456-BGA | YES | 61 | 0°C~85°C | Tray | 2002 | PNX15xx | e0 | Obsolete | 3 (168 Hours) | 456 | TIN LEAD | Multimedia | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 225 | 1 | 1mm | unknown | 20 | PNX15* | 456 | S-PBGA-B456 | Not Qualified | 3.47V | 1.2V | 3.13V | I2C, 2-Wire Serial | TM3260 | CONSUMER CIRCUIT | Nexperia | 2.45mm | 27mm | 27mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
Mfr Part No CYPD3174-16SXQ | Cypress Semiconductor Corp | Datasheet | 95 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 16-SOIC (0.154, 3.90mm Width) | YES | 5 | -40°C~105°C TA | Tube | EZ-PD™ CCG3PA | Active | 3 (168 Hours) | 16 | USB Type C | 3V~24.5V | DUAL | GULL WING | NOT SPECIFIED | 5V | 1.27mm | NOT SPECIFIED | R-PDSO-G16 | I2C, SPI, UART | 8K x 8 | MICROPROCESSOR CIRCUIT | ARM® Cortex®-M0 | FLASH (64kB) | 9.893mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
Mfr Part No CYPD2704-09FNXIT | Cypress Semiconductor Corp | Datasheet | - |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 9-UFBGA, WLCSP | -40°C~85°C TA | Tape & Reel (TR) | EZ-PD™ CMG1 | Active | 1 (Unlimited) | USB Type C | 2.7V~5.5V | NOT SPECIFIED | NOT SPECIFIED | I2C, USB | MICROPROCESSOR CIRCUIT | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TLE9879QXA40XUMA1 | Infineon Technologies | Datasheet | 8000 |
| Min: 1 Mult: 1 | 26 Weeks | Surface Mount | 48-VFQFN Exposed Pad | 10 | -40°C~150°C | Tape & Reel (TR) | 2015 | Automotive, AEC-Q100 | yes | Not For New Designs | 3 (168 Hours) | Automotive | 5.5V~28V | NOT SPECIFIED | NOT SPECIFIED | LIN, SSI, UART | 6K x 8 | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | FLASH (128kB) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr Part No CYPD2703-09FNXIT | Cypress Semiconductor Corp | Datasheet | 31 |
| Min: 1 Mult: 1 | 11 Weeks | Surface Mount | 9-UFBGA, WLCSP | -40°C~85°C TA | Tape & Reel (TR) | EZ-PD™ CMG1 | Active | 1 (Unlimited) | USB Type C | 2.7V~5.5V | NOT SPECIFIED | NOT SPECIFIED | I2C, USB | MICROPROCESSOR CIRCUIT | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A7102CHUK/T0BC2VAZ | NXP USA Inc. | Datasheet | 24 |
| Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 12-UFBGA, WLCSP | -40°C~90°C TA | Tape & Reel (TR) | A71CH | Active | Not Applicable | Authentication | 2.5V~3.6V | NOT SPECIFIED | NOT SPECIFIED | I2C | MX51 | CONSUMER CIRCUIT | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A7101CHTK2/T0BC2BJ | NXP USA Inc. | Datasheet | 24 |
| Min: 1 Mult: 1 | 14 Weeks | Surface Mount | 8-VDFN Exposed Pad | Industrial grade | -25°C~85°C TA | Tape & Reel (TR) | A71CH | Active | 1 (Unlimited) | Authentication | 2.5V~3.6V | 260 | NOT SPECIFIED | I2C | MX51 | CONSUMER CIRCUIT | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A7102CHTK2/T0BC2AJ | NXP USA Inc. | Datasheet | 31 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 8-VDFN Exposed Pad | Industrial grade | -40°C~90°C TA | Tape & Reel (TR) | A71CH | Active | 1 (Unlimited) | NOT SPECIFIED | Authentication | 2.5V~3.6V | 260 | NOT SPECIFIED | I2C | MX51 | CONSUMER CIRCUIT | ROHS3 Compliant |
SLE66R04SNBZZZA1
Infineon Technologies
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SLE66CL80PENBZZZA1
Infineon Technologies
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SLE66R16PMCC2ZZZA1
Infineon Technologies
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SLE66R04PNBZZZA1
Infineon Technologies
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SLE66R32SMCC2ZZZA1
Infineon Technologies
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SLB9665XT20FW560XUMA2
Infineon Technologies
Package:Embedded - Microcontrollers - Application Specific
4.491010
SLE 7737E M3.2
Infineon Technologies
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
A7005CGHN1/T1AGBEL
NXP USA Inc.
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
14550R-500
Echelon Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
CY8CTMA884AA-12
Cypress Semiconductor Corp
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
CY8CTMA884AE-22
Cypress Semiconductor Corp
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
CP3BT26G18AWM/NOPB
Texas Instruments
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PNX1501E,557
NXP USA Inc.
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
CYPD3174-16SXQ
Cypress Semiconductor Corp
Package:Embedded - Microcontrollers - Application Specific
2.342443
CYPD2704-09FNXIT
Cypress Semiconductor Corp
Package:Embedded - Microcontrollers - Application Specific
0.943330
TLE9879QXA40XUMA1
Infineon Technologies
Package:Embedded - Microcontrollers - Application Specific
7.604748
CYPD2703-09FNXIT
Cypress Semiconductor Corp
Package:Embedded - Microcontrollers - Application Specific
3.909023
A7102CHUK/T0BC2VAZ
NXP USA Inc.
Package:Embedded - Microcontrollers - Application Specific
4.101873
A7101CHTK2/T0BC2BJ
NXP USA Inc.
Package:Embedded - Microcontrollers - Application Specific
3.563369
A7102CHTK2/T0BC2AJ
NXP USA Inc.
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
