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Specialized (1062)

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Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Contact plating	Surface Mount	Number of pins	Number of Terminals	Access Time-Max	Connector	Connector pinout layout	Contacts pitch	Date Of Intro	Electrical mounting	Gross weight	Ihs Manufacturer	Kind of connector	Moisture Sensitivity Levels	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Rohs Code	Row pitch	Spatial orientation	Supply Voltage-Nom (Vsup)	Type of connector	Operating temperature	JESD-609 Code	Pbfree Code	ECCN Code	Terminal Finish	Additional Feature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Current rating	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Supply Voltage-Max (Vsup)	Temperature Grade	Supply Voltage-Min (Vsup)	Number of Ports	Operating Mode	Supply Current-Max	Organization	Output Characteristics	Seated Height-Max	Memory Width	Standby Current-Max	Memory Density	Parallel/Serial	Memory IC Type	Rated voltage	Output Enable	Profile	Mixed Memory Type	Length	Width	Plating thickness	Flammability rating
Mfr Part No TC518129AFWL-80	Toshiba America Electronic Components	Datasheet	-	-	Min: 1 Mult: 1		YES		32	80 ns							TOSHIBA CORP			131072 words	128000	70 °C		PLASTIC/EPOXY	SOP			RECTANGULAR	SMALL OUTLINE	Obsolete	SOIC	No			5 V			e0			TIN LEAD	CE/AUTO/SELF REFRESH		DUAL	GULL WING	240	1	1.27 mm	unknown		NOT SPECIFIED	32	R-PDSO-G32	Not Qualified	5.5 V	COMMERCIAL	4.5 V	1	ASYNCHRONOUS		128KX8	3-STATE	2.8 mm	8		1048576 bit	PARALLEL	PSEUDO STATIC RAM		YES			20.6 mm	10.7 mm
Mfr Part No M6MGB64BM34CWG-P	Renesas Electronics Corporation	Datasheet	-	-	Min: 1 Mult: 1												RENESAS TECHNOLOGY CORP									,				Obsolete										EAR99			8542.32.00.71						unknown
Mfr Part No RD28F1602C3T90	Intel Corporation	Datasheet	-	-	Min: 1 Mult: 1		YES		66	90 ns							INTEL CORP			1048576 words	1000000	85 °C	-25 °C	PLASTIC/EPOXY	LFBGA	LFBGA, BGA68,8X12,32	BGA68,8X12,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	Obsolete	BGA				3 V					EAR99		SRAM IS ORGANIZED AS 256K X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	unknown			66	R-PBGA-B66	Not Qualified	3.3 V	COMMERCIAL EXTENDED	2.7 V		ASYNCHRONOUS	0.055 mA	1MX16		1.4 mm	16	0.000035 A	16777216 bit		MEMORY CIRCUIT				FLASH+SRAM	10 mm	8 mm
Mfr Part No NM1282KSLAXAL-3B	Nanya Technology Corporation	Datasheet	-	-	Min: 1 Mult: 1		YES		162								NANYA TECHNOLOGY CORP			67108864 words	64000000	85 °C	-25 °C	PLASTIC/EPOXY	VFBGA	VFBGA,		RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Active		Yes			1.8 V					EAR99		NAND IS ORGANISED AS 256M X 8 AND ALSO OPERATES WITH 1.2V NOMINAL SUPPLY	8542.32.00.71	BOTTOM	BALL	NOT SPECIFIED	1	0.5 mm	compliant		NOT SPECIFIED		R-PBGA-B162		1.95 V	OTHER	1.7 V		SYNCHRONOUS		64MX32		1 mm	32		2147483648 bit		MEMORY CIRCUIT					10.5 mm	8 mm
Mfr Part No KMDP6001DA-B425	Samsung Semiconductor	Datasheet	-	-	Min: 1 Mult: 1	gold-plated	YES	9	254		socket	1x9	2.54mm		THT	0.77 g	SAMSUNG SEMICONDUCTOR INC	female		68719476736 words	64000000000			PLASTIC/EPOXY		FBGA-254		RECTANGULAR		Obsolete				straight		pin strips	-40...163°C					DRAM IS ORGANISED AS 32G X 1		BOTTOM	BALL		1		compliant	1.5A			R-PBGA-B254								64GX8			8		549755813888 bit		MEMORY CIRCUIT	60V		beryllium copper	FLASH+DRAM			0.75µm	UL94V-0
Mfr Part No MR2A16AVYS35	NXP Semiconductors	Datasheet	-	-	Min: 1 Mult: 1	tinned	YES	6	44		socket	2x3	1.27mm	2018-08-17	THT	0.41 g	NXP SEMICONDUCTORS	female		262144 words	256000	105 °C	-40 °C	PLASTIC/EPOXY	TSOP2	TSOP2-44		RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete			1.27mm	straight	3.3 V	pin strips	-40...163°C			EAR99			8542.32.00.71	DUAL	GULL WING		1	0.8 mm	unknown	1.5A			R-PDSO-G44		3.6 V	INDUSTRIAL	3 V		ASYNCHRONOUS		256KX16		1.2 mm	16		4194304 bit		MEMORY CIRCUIT	125V		bronze		18.41 mm	10.16 mm	4µm	UL94V-0
Mfr Part No S71PL129JC0BFW9U0	Spansion	Datasheet	-	-	Min: 1 Mult: 1		YES		64								SPANSION INC		3	8388608 words	8000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-64		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes			3 V			e1		EAR99	TIN SILVER COPPER	PSEUDO STATIC RAM IS ORGANIZED AS 4M X 16	8542.32.00.71	BOTTOM	BALL	260	1	0.8 mm	unknown		40	64	R-PBGA-B64	Not Qualified	3.1 V	OTHER	2.7 V		ASYNCHRONOUS		8MX16		1.2 mm	16		134217728 bit		MEMORY CIRCUIT					11.6 mm	8 mm
Mfr Part No S71NS256PB0ZJETV3	Spansion	Datasheet	-	-	Min: 1 Mult: 1		YES		56								SPANSION INC			16777216 words	16000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	TFBGA,		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes			1.8 V					EAR99		PSRAM IS ORGANIZED AS 2M X 16	8542.32.00.71	BOTTOM	BALL	260	1	0.5 mm	unknown		40	56	R-PBGA-B56	Not Qualified	1.95 V	OTHER	1.7 V		SYNCHRONOUS		16MX16		1.2 mm	16		268435456 bit		MEMORY CIRCUIT					9.2 mm	8 mm
Mfr Part No MC-242453F9-B10-BT3	NEC Electronics Group	Datasheet	-	-	Min: 1 Mult: 1		YES		77								NEC ELECTRONICS CORP			2097152 words	2000000	70 °C	-20 °C	PLASTIC/EPOXY	TFBGA	TFBGA,		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA									EAR99		THE DEVICE ALSO CONTAINS A 1M X 16 MOBILE SPECIFIED RAM	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	unknown			77	R-PBGA-B77	Not Qualified	3 V	COMMERCIAL	2.6 V		ASYNCHRONOUS		2MX16		1.2 mm	16		33554432 bit		MEMORY CIRCUIT					12 mm	7 mm
Mfr Part No SST34HF3282-70-4E-L1P	Silicon Storage Technology	Datasheet	-	-	Min: 1 Mult: 1		YES		56								SILICON STORAGE TECHNOLOGY INC			2097152 words	2000000	85 °C	-20 °C	PLASTIC/EPOXY	LFBGA	LFBGA,		RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	Obsolete	BGA	No			3 V					EAR99		ALSO CONTAINS 512K X 16 SRAM	8542.32.00.71	BOTTOM	BALL	NOT SPECIFIED	1	0.8 mm	unknown		NOT SPECIFIED	56	R-PBGA-B56	Not Qualified	3.3 V	OTHER	2.7 V		ASYNCHRONOUS		2MX16		1.4 mm	16		33554432 bit		MEMORY CIRCUIT					10 mm	8 mm
Mfr Part No M4-4104S-Z2	Moujen Switch	Datasheet	-	-	Min: 1 Mult: 1
Mfr Part No S71GL064AB0BFW0Z0	Spansion	Datasheet	-	-	Min: 1 Mult: 1		YES		56								SPANSION INC		3	4194304 words	4000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	TFBGA,		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes			3 V			e1		EAR99	TIN SILVER COPPER	PSRAM IS ORGANIZED AS 512K X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant			56	R-PBGA-B56	Not Qualified	3.1 V	COMMERCIAL EXTENDED	2.7 V		ASYNCHRONOUS		4MX16		1.2 mm	16		67108864 bit		MEMORY CIRCUIT					9 mm	7 mm
Mfr Part No XC17S30XLPDG8I	AMD Xilinx	Datasheet	412 In Stock	-	Min: 1 Mult: 1		NO		8								XILINX INC		1	249168 words	249168	85 °C	-40 °C	PLASTIC/EPOXY	DIP	DIP,		RECTANGULAR	IN-LINE	Obsolete	DIP	Yes			3.3 V			e3	Yes	EAR99	Matte Tin (Sn)		8542.32.00.71	DUAL	THROUGH-HOLE	250	1	2.54 mm	compliant		30	8	R-PDIP-T8	Not Qualified	3.6 V	INDUSTRIAL	3 V		SYNCHRONOUS		249168X1		4.5974 mm	1		249168 bit		MEMORY CIRCUIT					9.3599 mm	7.62 mm
Mfr Part No M4-4114S-Z3	Moujen Switch	Datasheet	-	-	Min: 1 Mult: 1
Mfr Part No NAND99W3M1BZBC5E	Micron Technology Inc	Datasheet	-	-	Min: 1 Mult: 1		YES		137								MICRON TECHNOLOGY INC					85 °C	-30 °C	PLASTIC/EPOXY	FBGA	FBGA, BGA137,10X15,32	BGA137,10X15,32	RECTANGULAR	GRID ARRAY, FINE PITCH	Obsolete		Yes			3 V					EAR99			8542.32.00.71	BOTTOM	BALL			0.8 mm	compliant				R-PBGA-B137	Not Qualified		OTHER												MEMORY CIRCUIT				FLASH+SDRAM
Mfr Part No SST34WA1601-70-5E-MVJE	Microchip Technology Inc	Datasheet	-	-	Min: 1 Mult: 1		YES		44								MICROCHIP TECHNOLOGY INC			1048576 words	1000000	85 °C	-20 °C	PLASTIC/EPOXY	VFBGA	6 X 8 MM, 0.92 MM HEIGHT, 0.30 MM BALL, ROHS COMPLIANT, MO-225, VFBGA-44		RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Active	BGA	Yes			1.8 V				Yes	EAR99		ZERO DENSITY PSRAM	8542.32.00.71	BOTTOM	BALL	260	1	0.5 mm	compliant		40	44	R-PBGA-B44	Not Qualified	1.95 V	OTHER	1.7 V		SYNCHRONOUS		1MX16		1 mm	16		16777216 bit		MEMORY CIRCUIT					8 mm	6 mm
Mfr Part No S71PL127JB0BAWQB0	Spansion	Datasheet	-	-	Min: 1 Mult: 1		YES		64								SPANSION INC			8388608 words	8000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	TFBGA,		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA				3 V					EAR99		PSRAM IS ORGANIZED AS 2M X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	unknown			64	R-PBGA-B64	Not Qualified	3.6 V	OTHER	2.7 V		ASYNCHRONOUS		8MX16		1.2 mm	16		134217728 bit		MEMORY CIRCUIT					11.6 mm	8 mm
Mfr Part No NAND98R3M2AZBB5E	Numonyx Memory Solutions	Datasheet	-	-	Min: 1 Mult: 1		YES		107								NUMONYX					85 °C	-30 °C	PLASTIC/EPOXY	FBGA	FBGA, BGA107,10X14,32	BGA107,10X14,32	RECTANGULAR	GRID ARRAY	Obsolete	BGA	Yes			1.8 V				Yes	EAR99			8542.32.00.71	BOTTOM	BALL	NOT SPECIFIED		0.8 mm	unknown		NOT SPECIFIED	107	R-PBGA-B107	Not Qualified		OTHER												MEMORY CIRCUIT				FLASH+SDRAM
Mfr Part No PF38F5070M0Y0V0	Numonyx Memory Solutions	Datasheet	-	-	Min: 1 Mult: 1		YES		165	96 ns							NUMONYX							PLASTIC/EPOXY	FBGA	FBGA, BGA165,12X15,25	BGA165,12X15,25	RECTANGULAR	GRID ARRAY, FINE PITCH	Transferred		Yes			1.8 V					EAR99			8542.32.00.71	BOTTOM	BALL			0.635 mm	unknown				R-PBGA-B165	Not Qualified											0.00016 A			MEMORY CIRCUIT				FLASH+PSRAM
Mfr Part No TH50VSF3580AASB	AMD	Datasheet	-	-	Min: 1 Mult: 1

Specialized (1062)